IT1120489B - Apparecchio e procedimento di saldatura a laser in particolare per componenti di chip elettronici - Google Patents
Apparecchio e procedimento di saldatura a laser in particolare per componenti di chip elettroniciInfo
- Publication number
- IT1120489B IT1120489B IT49988/79A IT4998879A IT1120489B IT 1120489 B IT1120489 B IT 1120489B IT 49988/79 A IT49988/79 A IT 49988/79A IT 4998879 A IT4998879 A IT 4998879A IT 1120489 B IT1120489 B IT 1120489B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- laser welding
- welding apparatus
- electronic chip
- chip components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93667178A | 1978-08-24 | 1978-08-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7949988A0 IT7949988A0 (it) | 1979-08-07 |
IT1120489B true IT1120489B (it) | 1986-03-26 |
Family
ID=25468940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT49988/79A IT1120489B (it) | 1978-08-24 | 1979-08-07 | Apparecchio e procedimento di saldatura a laser in particolare per componenti di chip elettronici |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5530895A (it) |
CA (1) | CA1123920A (it) |
DE (1) | DE2934407A1 (it) |
FR (1) | FR2434002A1 (it) |
GB (1) | GB2038220B (it) |
IT (1) | IT1120489B (it) |
NL (1) | NL7906042A (it) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0085278A1 (en) * | 1982-01-28 | 1983-08-10 | Battelle Development Corporation | Split beam method of altering material properties |
JPH0347730Y2 (it) * | 1985-04-18 | 1991-10-11 | ||
DE3539933A1 (de) * | 1985-11-11 | 1987-05-14 | Nixdorf Computer Ag | Vorrichtung zum aufloeten elektronischer bauelemente auf eine schaltungsplatine |
JPH0677811B2 (ja) * | 1986-01-20 | 1994-10-05 | 株式会社ハイベツク | 自動半田付け装置 |
JPH0783036B2 (ja) * | 1987-12-11 | 1995-09-06 | 三菱電機株式会社 | キヤリアテープ |
JPH02138066U (it) * | 1989-04-17 | 1990-11-19 | ||
US5309545A (en) * | 1990-08-27 | 1994-05-03 | Sierra Research And Technology, Inc. | Combined radiative and convective rework system |
US5060288A (en) * | 1990-08-27 | 1991-10-22 | Sierra Research And Technology, Inc. | Infrared heater array for IC soldering |
DE19833368C1 (de) * | 1998-07-24 | 2000-02-17 | Schott Glas | Verfahren und Vorrichtung zur Bearbeitung von Bauteilen aus sprödbrüchigen Werkstoffen |
JP2005347415A (ja) * | 2004-06-01 | 2005-12-15 | Miyachi Technos Corp | 電気部品実装方法 |
WO2006037566A1 (de) | 2004-10-06 | 2006-04-13 | Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg | Laseranordnung |
WO2006037370A1 (de) * | 2004-10-06 | 2006-04-13 | Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg | Laseranordnung |
CN110948079B (zh) * | 2019-12-24 | 2023-10-10 | 武汉嘉铭激光股份有限公司 | 一种双激光锡焊的组合装置及其焊接方法 |
CN114682948B (zh) * | 2022-03-04 | 2023-10-31 | 广东风华高新科技股份有限公司 | 片式元器件的可焊性测试方法、装置及系统 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1565832A1 (de) * | 1966-09-06 | 1970-02-12 | Siemens Ag | Optische Anordnung fuer Laserstrahlen |
US3524046A (en) * | 1968-04-26 | 1970-08-11 | Aluminum Co Of America | Apparatus and method for piercing holes in elastomeric articles |
GB1371624A (en) * | 1971-03-26 | 1974-10-23 | Atomic Energy Authority Uk | Optical processing of materials |
JPS5539434B2 (it) * | 1972-08-25 | 1980-10-11 | ||
JPS5310937B2 (it) * | 1973-05-18 | 1978-04-18 | ||
JPS5148917B2 (it) * | 1973-10-26 | 1976-12-23 | ||
GB1510899A (en) * | 1975-11-21 | 1978-05-17 | Boc Ltd | Laser machining |
JPS5297696U (it) * | 1976-01-21 | 1977-07-22 | ||
US4083629A (en) * | 1976-11-29 | 1978-04-11 | Gte Laboratories Incorporated | Beam splitting system for a welding laser |
-
1979
- 1979-07-13 CA CA331,825A patent/CA1123920A/en not_active Expired
- 1979-07-20 GB GB7925327A patent/GB2038220B/en not_active Expired
- 1979-07-31 FR FR7919725A patent/FR2434002A1/fr active Granted
- 1979-08-07 IT IT49988/79A patent/IT1120489B/it active
- 1979-08-07 NL NL7906042A patent/NL7906042A/nl not_active Application Discontinuation
- 1979-08-24 JP JP10805979A patent/JPS5530895A/ja active Granted
- 1979-08-24 DE DE19792934407 patent/DE2934407A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
IT7949988A0 (it) | 1979-08-07 |
GB2038220B (en) | 1982-10-20 |
FR2434002A1 (fr) | 1980-03-21 |
FR2434002B1 (it) | 1983-08-12 |
NL7906042A (nl) | 1980-02-26 |
JPS6349594B2 (it) | 1988-10-05 |
JPS5530895A (en) | 1980-03-04 |
GB2038220A (en) | 1980-07-23 |
CA1123920A (en) | 1982-05-18 |
DE2934407A1 (de) | 1980-03-06 |
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