CA1117221A - Thermally isolated monolithic semiconductor die - Google Patents

Thermally isolated monolithic semiconductor die

Info

Publication number
CA1117221A
CA1117221A CA000312466A CA312466A CA1117221A CA 1117221 A CA1117221 A CA 1117221A CA 000312466 A CA000312466 A CA 000312466A CA 312466 A CA312466 A CA 312466A CA 1117221 A CA1117221 A CA 1117221A
Authority
CA
Canada
Prior art keywords
semiconductor
support leads
layer
die
thermally isolated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000312466A
Other languages
English (en)
French (fr)
Inventor
Roy W. Chapel, Jr.
I. Macit Gurol
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluke Corp
Original Assignee
John Fluke Manufacturing Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by John Fluke Manufacturing Co Inc filed Critical John Fluke Manufacturing Co Inc
Application granted granted Critical
Publication of CA1117221A publication Critical patent/CA1117221A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/02—Measuring effective values, i.e. root-mean-square values
    • G01R19/03—Measuring effective values, i.e. root-mean-square values using thermoconverters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H10D89/105—Integrated device layouts adapted for thermal considerations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Pressure Sensors (AREA)
CA000312466A 1977-10-17 1978-10-02 Thermally isolated monolithic semiconductor die Expired CA1117221A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/842,972 US4257061A (en) 1977-10-17 1977-10-17 Thermally isolated monolithic semiconductor die
US842,972 1986-03-24

Publications (1)

Publication Number Publication Date
CA1117221A true CA1117221A (en) 1982-01-26

Family

ID=25288725

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000312466A Expired CA1117221A (en) 1977-10-17 1978-10-02 Thermally isolated monolithic semiconductor die

Country Status (5)

Country Link
US (1) US4257061A (enExample)
EP (1) EP0001707B1 (enExample)
JP (1) JPS5477588A (enExample)
CA (1) CA1117221A (enExample)
DE (1) DE2862105D1 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274143A (en) * 1979-08-02 1981-06-16 John Fluke Mfg. Co., Inc. Recirculating RMS AC conversion method and apparatus
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4920454A (en) * 1983-09-15 1990-04-24 Mosaic Systems, Inc. Wafer scale package system and header and method of manufacture thereof
US4847732A (en) * 1983-09-15 1989-07-11 Mosaic Systems, Inc. Wafer and method of making same
US4613891A (en) * 1984-02-17 1986-09-23 At&T Bell Laboratories Packaging microminiature devices
JPS61501295A (ja) * 1984-02-21 1986-06-26 エンバィアロンメンタル・リサーチ・インスティテュート・オブ・ミシガン ウェハスケールパッケージシステム
JP2673424B2 (ja) * 1984-02-21 1997-11-05 エンバィアロンメンタル・リサーチ・インスティテュート・オブ・ミシガン 集積回路用サブストレート
US4757528A (en) * 1986-09-05 1988-07-12 Harris Corporation Thermally coupled information transmission across electrical isolation boundaries
JPS6376279A (ja) * 1986-09-19 1988-04-06 株式会社日立製作所 コネクタ及びそれを用いた半導体素子実装構造
US4782028A (en) * 1987-08-27 1988-11-01 Santa Barbara Research Center Process methodology for two-sided fabrication of devices on thinned silicon
US4980586A (en) * 1987-10-07 1990-12-25 Tektronix, Inc. Digital integrated circuit propagation delay regulator
US4892842A (en) * 1987-10-29 1990-01-09 Tektronix, Inc. Method of treating an integrated circuit
US4918505A (en) * 1988-07-19 1990-04-17 Tektronix, Inc. Method of treating an integrated circuit to provide a temperature sensor that is integral therewith
US5231877A (en) * 1990-12-12 1993-08-03 University Of Cincinnati Solid state microanemometer
DE4117133C1 (en) * 1991-05-25 1992-11-12 Ladislav Dr. Grno Thermoelectric power measuring converter - has resistance electronically controllable by instantaneous value of input signal and temp. sensor on common support heat-insulated from surroundings
JPH06151685A (ja) * 1992-11-04 1994-05-31 Mitsubishi Electric Corp Ｍｃｐ半導体装置
DE4416980C2 (de) * 1994-05-13 1998-04-09 Bosch Gmbh Robert Anordnung zur Kontaktierung von planaren Hochfrequenzleitungen und Verfahren zur Herstellung einer Anordnung zur Kontaktierung von planaren Hochfrequenzleitungen
WO1997005493A1 (de) * 1995-07-25 1997-02-13 Applied Precision S.R.O. Thermoelektrischer messkonverter
DE19527226A1 (de) * 1995-07-26 1997-01-30 Applied Precision S R O Thermoelektrischer Meßkonverter
US5783854A (en) * 1996-10-15 1998-07-21 Honeywell Inc. Thermally isolated integrated circuit
JP2000036501A (ja) * 1998-05-12 2000-02-02 Sharp Corp ダイボンド装置
US6510503B2 (en) 1998-07-27 2003-01-21 Mosaid Technologies Incorporated High bandwidth memory interface
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6521916B2 (en) 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
US6639360B2 (en) 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
JP3964263B2 (ja) * 2002-05-17 2007-08-22 株式会社デンソー ブラインドビアホール充填方法及び貫通電極形成方法
US20040147056A1 (en) * 2003-01-29 2004-07-29 Mckinnell James C. Micro-fabricated device and method of making
US20050183589A1 (en) * 2004-02-19 2005-08-25 Salmon Peter C. Imprinting tools and methods for printed circuit boards and assemblies
US8070329B1 (en) 2005-02-11 2011-12-06 Gentex Corporation Light emitting optical systems and assemblies and systems incorporating the same
US20070176768A1 (en) * 2006-01-31 2007-08-02 Scott Jonathan B Thermocouple microwave power sensor
CN100392852C (zh) * 2006-04-12 2008-06-04 江苏长电科技股份有限公司 电子元器件平面凸点式超薄封装基板及其制作方法
CN100392851C (zh) * 2006-04-12 2008-06-04 江苏长电科技股份有限公司 半导体元器件平面凸点式超薄封装基板及其制作方法
DE112008003664T5 (de) * 2008-01-31 2010-12-30 Hewlett-Packard Development Co., L.P., Houston Isolierende Öffnung in Leiterplatten
DE102008036837A1 (de) 2008-08-07 2010-02-18 Epcos Ag Sensorvorrichtung und Verfahren zur Herstellung
US9134100B2 (en) * 2009-04-13 2015-09-15 Ensign-Bickford Aerospace & Defense Company Surface mountable semiconductor bridge die
EP2629084B1 (en) 2012-02-17 2018-05-02 ams international AG Integrated circuit and manufacturing method
CN104279529B (zh) * 2014-09-24 2017-12-15 惠州市英吉尔光电科技有限公司 一种led小型化电源
EP3396392B1 (en) * 2017-04-26 2020-11-04 ElectDis AB Apparatus and method for determining a power value of a target
DE102017208147B4 (de) * 2017-05-15 2021-12-30 Schweizer Electronic Ag Elektronisches Bauteil und Leiterplatte mit diesem elektronischen Bauteil
CN112992849B (zh) * 2021-02-05 2022-06-03 长鑫存储技术有限公司 封装基板及具有其的半导体结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134170C (enExample) * 1963-12-17 1900-01-01
US3395265A (en) * 1965-07-26 1968-07-30 Teledyne Inc Temperature controlled microcircuit
US3493820A (en) * 1966-12-01 1970-02-03 Raytheon Co Airgap isolated semiconductor device
NL6911479A (enExample) * 1968-07-26 1970-01-28
NL6910274A (enExample) * 1969-07-04 1971-01-06
NL7215200A (enExample) * 1972-11-10 1974-05-14
US3881181A (en) * 1973-02-22 1975-04-29 Rca Corp Semiconductor temperature sensor
NL7408033A (nl) * 1974-06-17 1975-12-19 Philips Nv Schakeling voor het meten van de effektieve waarde van een elektrisch signaal.

Also Published As

Publication number Publication date
EP0001707A1 (en) 1979-05-02
US4257061A (en) 1981-03-17
DE2862105D1 (en) 1982-11-18
EP0001707B1 (en) 1982-10-13
JPS5477588A (en) 1979-06-21
JPS6151419B2 (enExample) 1986-11-08

Similar Documents

Publication Publication Date Title
CA1117221A (en) Thermally isolated monolithic semiconductor die
US4462018A (en) Semiconductor strain gauge with integral compensation resistors
KR960015067B1 (ko) 실리콘 베이스 질량 기류 센서 및 그 조립방법
US5396795A (en) Semiconductor sensor device for measuring intake flow rate
US6709878B2 (en) Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
US5600071A (en) Vertically integrated sensor structure and method
US4426768A (en) Ultra-thin microelectronic pressure sensors
US6023978A (en) Pressure transducer with error compensation from cross-coupling outputs of two sensors
US4733559A (en) Thermal fluid flow sensing method and apparatus for sensing flow over a wide range of flow rates
US9921110B2 (en) On-chip calibration system and method for infrared sensor
US3881181A (en) Semiconductor temperature sensor
US4295115A (en) Semiconductor absolute pressure transducer assembly and method
US4129848A (en) Platinum film resistor device
US6444487B1 (en) Flexible silicon strain gage
US4885937A (en) Flow sensor
US6248609B1 (en) Integrated semiconductor device comprising a chemoresistive gas microsensor and manufacturing process thereof
JPH06105178B2 (ja) 質量空気流センサーのための制御および検出回路
WO1996008705A1 (en) Miniature silicon based thermal vacuum sensor and method of measuring vacuum pressures
JPH05264314A (ja) 空気流量検出器及びそれを使用したエンジン制御装置
US4346291A (en) Thermally isolated monolithic semiconductor die
EP0405452B1 (en) Gas flow type angular velocity sensor
JPS62266418A (ja) 媒体の流速を測定する装置およびその製造法
JP2855885B2 (ja) 半導体式流量検出装置
JPS63195537A (ja) 絶対圧形半導体圧力センサ
JPS63265125A (ja) 非接触型半導体温度センサ

Legal Events

Date Code Title Description
MKEX Expiry