CA1115654A - Placage brillant a l'alliage plomb/etain - Google Patents

Placage brillant a l'alliage plomb/etain

Info

Publication number
CA1115654A
CA1115654A CA157,164A CA157164A CA1115654A CA 1115654 A CA1115654 A CA 1115654A CA 157164 A CA157164 A CA 157164A CA 1115654 A CA1115654 A CA 1115654A
Authority
CA
Canada
Prior art keywords
lead
tin
water soluble
formula
aromatic aldehyde
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA157,164A
Other languages
English (en)
Other versions
CA157164S (en
Inventor
Silvester P. Valayil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Priority to CA299,106A priority Critical patent/CA1088454A/fr
Application granted granted Critical
Publication of CA1115654A publication Critical patent/CA1115654A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CA157,164A 1971-12-16 1972-11-22 Placage brillant a l'alliage plomb/etain Expired CA1115654A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA299,106A CA1088454A (fr) 1971-12-16 1978-03-16 Placage brillant d'alliage etain/plomb

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20888571A 1971-12-16 1971-12-16
US208,885 1994-03-08

Publications (1)

Publication Number Publication Date
CA1115654A true CA1115654A (fr) 1982-01-05

Family

ID=22776434

Family Applications (1)

Application Number Title Priority Date Filing Date
CA157,164A Expired CA1115654A (fr) 1971-12-16 1972-11-22 Placage brillant a l'alliage plomb/etain

Country Status (8)

Country Link
US (1) US3749649A (fr)
JP (1) JPS5629758B2 (fr)
CA (1) CA1115654A (fr)
DE (1) DE2256845A1 (fr)
FR (1) FR2163453B1 (fr)
GB (1) GB1408148A (fr)
IT (1) IT970627B (fr)
NL (1) NL7217115A (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
SE390986B (sv) * 1973-10-18 1977-01-31 Modo Kemi Ab Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
NZ190645A (en) * 1978-06-16 1980-11-14 M & T Chemicals Inc Aqueous acid tin plating bath containing 2,5-dimethoxy-benzaldehyde as brightening agent
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4688899A (en) * 1984-07-27 1987-08-25 Casio Computer Co., Ltd. Dual-frequency, dielectric anisotropy liquid crystal display
JPS61117297A (ja) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk スズ属金属めつき液
DE3854551T2 (de) * 1987-12-10 1996-04-18 Lea Ronal Inc Zinn-, Blei- und Zinn-Blei-Legierungs-Elektrolyten für Elekroplattieren bei hoher Geschwindigkeit.
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP2752046B2 (ja) * 1989-12-05 1998-05-18 株式会社村田製作所 クエン酸系錫または錫合金系めっき浴
CA2047502C (fr) * 1991-07-22 1995-05-09 Peter Tsuk Placage selectif d'une broche conductrice d'electricite
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
EP1342817A3 (fr) * 2002-03-05 2006-05-24 Shipley Co. L.L.C. Limitation de la perte d'étain par oxydation dans des solutions pour des bains d'électrodéposition d'étain ou d'alliage d'étain
US7063735B2 (en) * 2003-01-10 2006-06-20 Henkel Kommanditgesellschaft Auf Aktien Coating composition
MXPA05006053A (es) * 2003-01-10 2005-08-16 Henkel Kgaa Una composicion de revestimiento.
US20060172064A1 (en) * 2003-01-10 2006-08-03 Henkel Kommanditgesellschaft Auf Aktien Process of coating metals prior to cold forming
ES2354045T3 (es) 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedimientos con fundente mejorados.
EP2617859B1 (fr) 2012-01-20 2016-11-30 Rohm and Haas Electronic Materials LLC Procédé de flux amélioré pour l'étain et alliages d'étain

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1141284A (en) * 1965-02-13 1969-01-29 Philips Electronic Associated Improvements in acid tin electroplating solutions
FR1539596A (fr) * 1967-10-06 1968-09-13 Hyogo Prefectural Government Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Also Published As

Publication number Publication date
FR2163453B1 (fr) 1977-01-14
AU4828472A (en) 1974-05-02
GB1408148A (en) 1975-10-01
FR2163453A1 (fr) 1973-07-27
US3749649A (en) 1973-07-31
IT970627B (it) 1974-04-20
JPS4866537A (fr) 1973-09-12
JPS5629758B2 (fr) 1981-07-10
DE2256845A1 (de) 1973-06-20
NL7217115A (fr) 1973-06-19

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Legal Events

Date Code Title Description
MKEX Expiry