CA1094431A - Deposition mask and methods of making same - Google Patents
Deposition mask and methods of making sameInfo
- Publication number
- CA1094431A CA1094431A CA282,615A CA282615A CA1094431A CA 1094431 A CA1094431 A CA 1094431A CA 282615 A CA282615 A CA 282615A CA 1094431 A CA1094431 A CA 1094431A
- Authority
- CA
- Canada
- Prior art keywords
- mask
- web
- ribs
- openings
- rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000008021 deposition Effects 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 32
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 12
- 230000000873 masking effect Effects 0.000 claims abstract description 6
- 239000011364 vaporized material Substances 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 2
- 238000003486 chemical etching Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract description 16
- 239000000758 substrate Substances 0.000 abstract description 16
- 238000007733 ion plating Methods 0.000 abstract description 4
- 238000005137 deposition process Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24298—Noncircular aperture [e.g., slit, diamond, rectangular, etc.]
- Y10T428/24314—Slit or elongated
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Respiratory Apparatuses And Protective Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/709,357 US4049857A (en) | 1976-07-28 | 1976-07-28 | Deposition mask and methods of making same |
| US709,357 | 1976-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1094431A true CA1094431A (en) | 1981-01-27 |
Family
ID=24849531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA282,615A Expired CA1094431A (en) | 1976-07-28 | 1977-07-13 | Deposition mask and methods of making same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4049857A (OSRAM) |
| JP (1) | JPS5931591B2 (OSRAM) |
| CA (1) | CA1094431A (OSRAM) |
| DE (1) | DE2723465C2 (OSRAM) |
| FR (1) | FR2359908A1 (OSRAM) |
| GB (1) | GB1528295A (OSRAM) |
| IT (1) | IT1113769B (OSRAM) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4252839A (en) * | 1976-12-29 | 1981-02-24 | Citizen Watch Company Limited | Tuning fork-type quartz crystal vibrator and method of forming the same |
| US4256532A (en) * | 1977-07-05 | 1981-03-17 | International Business Machines Corporation | Method for making a silicon mask |
| JPS54103552A (en) * | 1978-02-01 | 1979-08-15 | Hitachi Electronics | Pattern formation method |
| CH649578A5 (de) * | 1981-03-27 | 1985-05-31 | Ulvac Corp | Hochgeschwindigkeits-kathoden-zerstaeubungsvorrichtung. |
| US4465724A (en) * | 1982-04-26 | 1984-08-14 | Rasmussen O B | Reticulate sheet product |
| US4915057A (en) * | 1985-10-23 | 1990-04-10 | Gte Products Corporation | Apparatus and method for registration of shadow masked thin-film patterns |
| US4715940A (en) * | 1985-10-23 | 1987-12-29 | Gte Products Corporation | Mask for patterning electrode structures in thin film EL devices |
| US4615781A (en) * | 1985-10-23 | 1986-10-07 | Gte Products Corporation | Mask assembly having mask stress relieving feature |
| JP4248037B2 (ja) * | 1997-02-04 | 2009-04-02 | 株式会社不二機販 | 金属被膜の形成方法 |
| US6592933B2 (en) * | 1997-10-15 | 2003-07-15 | Toray Industries, Inc. | Process for manufacturing organic electroluminescent device |
| JP3403627B2 (ja) * | 1998-01-09 | 2003-05-06 | 株式会社不二機販 | セラミック分散メッキ方法 |
| JP3730015B2 (ja) * | 1998-06-02 | 2005-12-21 | 株式会社不二機販 | 金属成品の表面処理方法 |
| US6253441B1 (en) * | 1999-04-16 | 2001-07-03 | General Electric Company | Fabrication of articles having a coating deposited through a mask |
| KR100625967B1 (ko) * | 2000-10-11 | 2006-09-20 | 삼성에스디아이 주식회사 | 증착마스크와 이의 제조방법 |
| KR100741052B1 (ko) * | 2000-10-16 | 2007-07-19 | 삼성에스디아이 주식회사 | 유기 el 소자의 증착마스크와 이를 이용한 증착방법 및그 장치 |
| US8088435B2 (en) * | 2005-03-30 | 2012-01-03 | Brother Kogyo Kabushiki Kaisha | Mask, method for producing mask, and method for producing wired board |
| JP4692290B2 (ja) * | 2006-01-11 | 2011-06-01 | セイコーエプソン株式会社 | マスクおよび成膜方法 |
| DE102018133062A1 (de) * | 2018-12-20 | 2020-06-25 | Optics Balzers Ag | Verfahren zur Herstellung eines linear variablen optischen Filters |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE948946C (de) * | 1954-03-11 | 1956-09-06 | Heinz Ringer | Schablone zum Aufspritzen von Zeichen auf eine ebene Grundflaeche |
| DE1446197A1 (de) * | 1959-04-27 | 1969-05-29 | Licentia Gmbh | Blende zur Begrenzung von unter vermindertem Druck zu bedampfenden Flaechen |
| US3302612A (en) * | 1963-09-12 | 1967-02-07 | Guy R Stutzman | Pattern masks and method for making same |
| US3241515A (en) * | 1963-12-02 | 1966-03-22 | Waters Mfg Inc | Multiple turn indicator |
| US3330252A (en) * | 1964-09-10 | 1967-07-11 | Sperry Rand Corp | Masking device |
| US3323490A (en) * | 1966-02-21 | 1967-06-06 | Trw Inc | Adjustable mask |
| US3577325A (en) * | 1968-05-29 | 1971-05-04 | Western Electric Co | Method of reclaiming graphite mask |
| US3678892A (en) * | 1970-05-19 | 1972-07-25 | Western Electric Co | Pallet and mask for substrates |
| US3724420A (en) * | 1971-02-18 | 1973-04-03 | M Quinn | Compressible stencil with high walls and narrow bridges |
| US3841261A (en) * | 1973-01-22 | 1974-10-15 | Gen Motors Corp | Self-aligning etch-out spray mask |
| US3897324A (en) * | 1973-06-25 | 1975-07-29 | Honeywell Inc | Material deposition masking for microcircuit structures |
| US4021276A (en) * | 1975-12-29 | 1977-05-03 | Western Electric Company, Inc. | Method of making rib-structure shadow mask for ion implantation |
-
1976
- 1976-07-28 US US05/709,357 patent/US4049857A/en not_active Expired - Lifetime
-
1977
- 1977-04-25 GB GB17019/77A patent/GB1528295A/en not_active Expired
- 1977-05-24 DE DE2723465A patent/DE2723465C2/de not_active Expired
- 1977-06-03 FR FR7717623A patent/FR2359908A1/fr active Granted
- 1977-06-23 IT IT24969/77A patent/IT1113769B/it active
- 1977-06-30 JP JP52077273A patent/JPS5931591B2/ja not_active Expired
- 1977-07-13 CA CA282,615A patent/CA1094431A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5931591B2 (ja) | 1984-08-02 |
| FR2359908A1 (fr) | 1978-02-24 |
| DE2723465A1 (de) | 1978-02-02 |
| US4049857A (en) | 1977-09-20 |
| FR2359908B1 (OSRAM) | 1980-01-04 |
| IT1113769B (it) | 1986-01-20 |
| DE2723465C2 (de) | 1984-10-18 |
| JPS5315274A (en) | 1978-02-10 |
| GB1528295A (en) | 1978-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1094431A (en) | Deposition mask and methods of making same | |
| US6406979B2 (en) | Method for sectioning a substrate wafer into a plurality of substrate chips | |
| EP0030116B2 (en) | Method of manufacturing a semiconductor device having a patterned multi-layer structure | |
| EP0379298B1 (en) | Method of forming an electrode for an electron emitting device | |
| TWI754174B (zh) | 具有深度調變的斜角光柵的光學組件及其形成方法 | |
| EP0167360A2 (en) | Programmable ion beam patterning system | |
| JPH061769B2 (ja) | アルミナ膜のパターニング方法 | |
| US4597826A (en) | Method for forming patterns | |
| US4145459A (en) | Method of making a short gate field effect transistor | |
| JPS6196765A (ja) | 金属パタ−ン形成方法 | |
| US4786361A (en) | Dry etching process | |
| EP0443348B1 (en) | Fine processing method using oblique metal deposition | |
| US4390394A (en) | Method of structuring with metal oxide masks by reactive ion-beam etching | |
| US7465407B2 (en) | Plasma processing method and apparatus | |
| US4278710A (en) | Apparatus and method for submicron pattern generation | |
| KR930008186A (ko) | 패터닝 방법 | |
| GB1570777A (en) | Multi-layer vacuum evaporation deposition method | |
| AU7502098A (en) | Method of forming a silicon layer on a surface | |
| Hammer | Obtaining gas panel metallization patterns by vacuum deposition through rib-supported mask structures | |
| JPH08321489A (ja) | 表面加工方法及び表面平滑化方法 | |
| JPH0770513B2 (ja) | エッチングの方法およびエッチング装置 | |
| KR0127233Y1 (ko) | 반도체 제조장치의 스퍼터 장치 | |
| JPS6035820B2 (ja) | エツチング構体製造のためのカソードスパツタリング方法 | |
| JPH0117253B2 (OSRAM) | ||
| JP2005032797A (ja) | プラズマ処理方法および装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |