CA1083263A - Prefabricated composite metallic heat-transmitting plate unit - Google Patents
Prefabricated composite metallic heat-transmitting plate unitInfo
- Publication number
- CA1083263A CA1083263A CA303,080A CA303080A CA1083263A CA 1083263 A CA1083263 A CA 1083263A CA 303080 A CA303080 A CA 303080A CA 1083263 A CA1083263 A CA 1083263A
- Authority
- CA
- Canada
- Prior art keywords
- heat
- plate unit
- accordance
- metallic
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 10
- 229910001313 Cobalt-iron alloy Inorganic materials 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 13
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- 150000002739 metals Chemical class 0.000 claims abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical group [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- QLNWXBAGRTUKKI-UHFFFAOYSA-N metacetamol Chemical compound CC(=O)NC1=CC=CC(O)=C1 QLNWXBAGRTUKKI-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 241000736839 Chara Species 0.000 description 1
- 241000518994 Conta Species 0.000 description 1
- 101100536893 Schizosaccharomyces pombe (strain 972 / ATCC 24843) thi9 gene Proteins 0.000 description 1
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- -1 aluminuw Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- KRTSDMXIXPKRQR-AATRIKPKSA-N monocrotophos Chemical compound CNC(=O)\C=C(/C)OP(=O)(OC)OC KRTSDMXIXPKRQR-AATRIKPKSA-N 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81108477A | 1977-06-29 | 1977-06-29 | |
| US811,084 | 1977-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1083263A true CA1083263A (en) | 1980-08-05 |
Family
ID=25205506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA303,080A Expired CA1083263A (en) | 1977-06-29 | 1978-05-11 | Prefabricated composite metallic heat-transmitting plate unit |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5412569A (enrdf_load_stackoverflow) |
| CA (1) | CA1083263A (enrdf_load_stackoverflow) |
| DE (1) | DE2826252A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2396263A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1588477A (enrdf_load_stackoverflow) |
| IT (1) | IT1105422B (enrdf_load_stackoverflow) |
| NL (1) | NL7806751A (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283464A (en) * | 1979-05-08 | 1981-08-11 | Norman Hascoe | Prefabricated composite metallic heat-transmitting plate unit |
| SE420964B (sv) * | 1980-03-27 | 1981-11-09 | Asea Ab | Kompositmaterial och sett for dess framstellning |
| US4427993A (en) * | 1980-11-21 | 1984-01-24 | General Electric Company | Thermal stress relieving bimetallic plate |
| US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
| FR2511193A1 (fr) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
| US5039335A (en) * | 1988-10-21 | 1991-08-13 | Texas Instruments Incorporated | Composite material for a circuit system and method of making |
| CA1316303C (en) * | 1988-12-23 | 1993-04-20 | Thijs Eerkes | Composite structure |
| JPH02231751A (ja) * | 1989-03-03 | 1990-09-13 | Sumitomo Special Metals Co Ltd | リードフレーム用材料 |
| US5310520A (en) * | 1993-01-29 | 1994-05-10 | Texas Instruments Incorporated | Circuit system, a composite material for use therein, and a method of making the material |
| KR960000706B1 (ko) * | 1993-07-12 | 1996-01-11 | 한국전기통신공사 | 전력소자용 플라스틱 패키지 구조 및 그 제조방법 |
| WO1998020549A1 (en) * | 1996-11-08 | 1998-05-14 | W.L. Gore & Associates, Inc. | Use of variable perforation density in copper layer to control cte |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL183243C (nl) * | 1953-11-30 | Metallgesellschaft Ag | Werkwijze voor het op metaaloppervlakken aanbrengen van fosfaatbekledingen. | |
| US3296501A (en) * | 1962-11-07 | 1967-01-03 | Westinghouse Electric Corp | Metallic ceramic composite contacts for semiconductor devices |
| GB1004020A (en) * | 1964-04-24 | 1965-09-08 | Standard Telephones Cables Ltd | Improvements in or relating to the mounting of electrical components |
| US3368112A (en) * | 1964-12-18 | 1968-02-06 | Navy Usa | Shielding of electrical circuits by metal deposition |
| US3928907A (en) * | 1971-11-18 | 1975-12-30 | John Chisholm | Method of making thermal attachment to porous metal surfaces |
| JPS5039065A (enrdf_load_stackoverflow) * | 1973-08-08 | 1975-04-10 | ||
| FR2305025A1 (fr) * | 1975-03-21 | 1976-10-15 | Thomson Csf | Element de liaison reliant un dispositif semi-conducteur a son support et dispositif comportant un tel element |
-
1978
- 1978-05-11 CA CA303,080A patent/CA1083263A/en not_active Expired
- 1978-05-25 GB GB22253/78A patent/GB1588477A/en not_active Expired
- 1978-06-09 FR FR7817339A patent/FR2396263A1/fr active Granted
- 1978-06-13 DE DE19782826252 patent/DE2826252A1/de not_active Ceased
- 1978-06-14 JP JP7201878A patent/JPS5412569A/ja active Pending
- 1978-06-22 NL NL7806751A patent/NL7806751A/xx active Search and Examination
- 1978-06-22 IT IT49996/78A patent/IT1105422B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| GB1588477A (en) | 1981-04-23 |
| JPS5412569A (en) | 1979-01-30 |
| FR2396263B1 (enrdf_load_stackoverflow) | 1984-04-13 |
| NL7806751A (nl) | 1979-01-03 |
| DE2826252A1 (de) | 1979-01-04 |
| FR2396263A1 (fr) | 1979-01-26 |
| IT7849996A0 (it) | 1978-06-22 |
| IT1105422B (it) | 1985-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |