CA1061015A - Fabrication of a semiconductor device of indium antimonide - Google Patents
Fabrication of a semiconductor device of indium antimonideInfo
- Publication number
- CA1061015A CA1061015A CA254,110A CA254110A CA1061015A CA 1061015 A CA1061015 A CA 1061015A CA 254110 A CA254110 A CA 254110A CA 1061015 A CA1061015 A CA 1061015A
- Authority
- CA
- Canada
- Prior art keywords
- type
- substrate
- indium antimonide
- preselected
- impurity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
- H01L21/26546—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds of electrically active species
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02241—III-V semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26593—Bombardment with radiation with high-energy radiation producing ion implantation at a temperature lower than room temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02258—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by anodic treatment, e.g. anodic oxidation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/084—Ion implantation of compound devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/591,996 US4080721A (en) | 1975-06-30 | 1975-06-30 | Fabrication of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1061015A true CA1061015A (en) | 1979-08-21 |
Family
ID=24368832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA254,110A Expired CA1061015A (en) | 1975-06-30 | 1976-06-04 | Fabrication of a semiconductor device of indium antimonide |
Country Status (6)
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4177298A (en) * | 1977-03-22 | 1979-12-04 | Hitachi, Ltd. | Method for producing an InSb thin film element |
DE2755418A1 (de) * | 1977-12-13 | 1979-06-21 | Bosch Gmbh Robert | Verfahren zur herstellung eines halbleiter-bauelements |
US4247373A (en) * | 1978-06-20 | 1981-01-27 | Matsushita Electric Industrial Co., Ltd. | Method of making semiconductor device |
US4348473A (en) * | 1981-03-04 | 1982-09-07 | Xerox Corporation | Dry process for the production of microelectronic devices |
JPS58108774A (ja) * | 1981-12-22 | 1983-06-28 | Citizen Watch Co Ltd | 薄膜トランジスタの製造方法 |
US4519127A (en) * | 1983-02-28 | 1985-05-28 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of manufacturing a MESFET by controlling implanted peak surface dopants |
FR2556135B1 (fr) * | 1983-12-02 | 1986-09-19 | Thomson Csf | Photo-diode a l'antimoniure d'indium et procede de fabrication |
US4898834A (en) * | 1988-06-27 | 1990-02-06 | Amber Engineering, Inc. | Open-tube, benign-environment annealing method for compound semiconductors |
US5143857A (en) * | 1988-11-07 | 1992-09-01 | Triquint Semiconductor, Inc. | Method of fabricating an electronic device with reduced susceptiblity to backgating effects |
GB2331841A (en) * | 1997-11-28 | 1999-06-02 | Secr Defence | Field effect transistor |
US6194295B1 (en) * | 1999-05-17 | 2001-02-27 | National Science Council Of Republic Of China | Production of a refractory metal by chemical vapor deposition of a bilayer-stacked tungsten metal |
US7687256B2 (en) * | 2002-04-11 | 2010-03-30 | Spire Corporation | Surface activated biochip |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3099776A (en) * | 1960-06-10 | 1963-07-30 | Texas Instruments Inc | Indium antimonide transistor |
US3515956A (en) * | 1967-10-16 | 1970-06-02 | Ion Physics Corp | High-voltage semiconductor device having a guard ring containing substitutionally active ions in interstitial positions |
DE2041035C2 (de) * | 1970-08-18 | 1982-10-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum gleichzeitigen elektrolytischen in bezug auf die Sperrfähigkeit selektiven Behandeln von mehreren in einer gemeinsamen Halbleiterscheibe erzeugten gleichen Halbleiterbauelementen |
US3929589A (en) * | 1974-02-08 | 1975-12-30 | Bell Telephone Labor Inc | Selective area oxidation of III-V compound semiconductors |
-
1975
- 1975-06-30 US US05/591,996 patent/US4080721A/en not_active Expired - Lifetime
-
1976
- 1976-05-21 FR FR7616136A patent/FR2316727A1/fr active Granted
- 1976-05-24 GB GB21374/76A patent/GB1488329A/en not_active Expired
- 1976-06-04 CA CA254,110A patent/CA1061015A/en not_active Expired
- 1976-06-18 JP JP51071274A patent/JPS526087A/ja active Granted
- 1976-06-24 DE DE19762628406 patent/DE2628406A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US4080721A (en) | 1978-03-28 |
JPS526087A (en) | 1977-01-18 |
GB1488329A (en) | 1977-10-12 |
DE2628406A1 (de) | 1977-02-03 |
FR2316727A1 (fr) | 1977-01-28 |
FR2316727B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-08-25 |
JPS5510985B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1980-03-21 |
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