CA1038992A - Hot melt adhesive - Google Patents

Hot melt adhesive

Info

Publication number
CA1038992A
CA1038992A CA181,706A CA181706A CA1038992A CA 1038992 A CA1038992 A CA 1038992A CA 181706 A CA181706 A CA 181706A CA 1038992 A CA1038992 A CA 1038992A
Authority
CA
Canada
Prior art keywords
hot melt
melt adhesive
adhesive composition
acid
ethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA181,706A
Other languages
English (en)
French (fr)
Other versions
CA181706S (en
Inventor
Eugene F. Lopez
Leon C. Glover (Jr.)
Bernard J. Lyons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Application granted granted Critical
Publication of CA1038992A publication Critical patent/CA1038992A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions
    • H02G15/18—Cable junctions protected by sleeves, e.g. for communication cable
    • H02G15/1806—Heat shrinkable sleeves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C61/00—Shaping by liberation of internal stresses; Making preforms having internal stresses; Apparatus therefor
    • B29C61/06—Making preforms having internal stresses, e.g. plastic memory
    • B29C61/0608—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms
    • B29C61/0616—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms layered or partially layered preforms, e.g. preforms with layers of adhesive or sealing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
CA181,706A 1972-09-25 1973-09-24 Hot melt adhesive Expired CA1038992A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29154272A 1972-09-25 1972-09-25

Publications (1)

Publication Number Publication Date
CA1038992A true CA1038992A (en) 1978-09-19

Family

ID=23120730

Family Applications (1)

Application Number Title Priority Date Filing Date
CA181,706A Expired CA1038992A (en) 1972-09-25 1973-09-24 Hot melt adhesive

Country Status (9)

Country Link
JP (1) JPS5812311B2 (me)
BE (1) BE805299A (me)
CA (1) CA1038992A (me)
DE (1) DE2347799C2 (me)
FR (1) FR2200342B1 (me)
GB (1) GB1440810A (me)
IT (1) IT995502B (me)
NL (1) NL7313209A (me)
SE (1) SE407942B (me)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2352358A1 (fr) * 1976-05-17 1977-12-16 Raychem Corp Perfectionnements apportes aux reperes d'identification
US4181775A (en) * 1976-05-24 1980-01-01 N.V. Raychem S.A. Adhesive
US4132690A (en) * 1976-09-27 1979-01-02 Allied Chemical Corporation Adhesive polyamide resin compositions containing high acid number copolymers
US4095044A (en) * 1976-10-26 1978-06-13 Raychem Corporation Multiple cable adapter and splice case including the same
GB1604379A (en) * 1977-11-08 1981-12-09 Raychem Sa Nv Heat shrinkable article
GB1604981A (en) * 1978-01-09 1981-12-16 Raychem Sa Nv Branchoff method
US4335223A (en) 1978-06-12 1982-06-15 Allied Corporation High impact molding compositions
CA1152591A (en) * 1979-08-07 1983-08-23 Jean-Marie E. Nolf Cable sleeve outlet for splice case
DE3211067A1 (de) * 1982-03-25 1983-09-29 Siemens AG, 1000 Berlin und 8000 München Schaeumbarer schmelzkleber
DE3504804A1 (de) * 1985-02-13 1986-08-14 Henkel KGaA, 4000 Düsseldorf Schmelzkleber
DE3912523A1 (de) * 1989-04-14 1990-10-18 Henkel Kgaa Verwendung von harzloesungen oder dispersionen von harzen zur oberflaechenbehandlung von polymerfasern
GB2262939A (en) * 1991-12-20 1993-07-07 Exxon Chemical Patents Inc Thermoplastic compositions
DE4211125C2 (de) * 1992-04-03 1994-12-08 Henkel Kgaa Schmelzklebstoffe, Verfahren zu deren Herstellung und deren Verwendung
DE69705083T2 (de) * 1996-03-15 2001-09-20 H.B. Fuller Licensing & Financing, Inc. Verfahren zum Buchbinden mittels Polyamid Heisschmelzkleber
EP0969068B1 (en) * 1998-01-12 2006-05-24 Sumitomo Electric Industries, Ltd. Adhesive resin composition and heat-shrinkable articles made by using the same
FR2850111B1 (fr) * 2003-01-17 2007-02-23 Atofina Composition adhesive thermofusible a base de polyolefines et de copolyamides a tenue thermique amelioree
WO2009062962A1 (fr) * 2007-11-14 2009-05-22 Tarkett Sas Cordon de soudure pour revetement de sol
EP2765170B1 (en) * 2013-02-06 2016-01-13 Henkel AG & Co. KGaA Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1167517A (en) * 1965-11-17 1969-10-15 Hitachi Ltd Hotmelt Adhesive Compositions
US3484403A (en) * 1966-03-14 1969-12-16 Eastman Kodak Co Preparation of polyamide-carboxylated polyolefin melt blends
US3377305A (en) * 1966-07-18 1968-04-09 Cities Service Oil Co Heat sealable coating composition

Also Published As

Publication number Publication date
AU6058673A (en) 1975-03-27
DE2347799C2 (de) 1985-07-04
FR2200342A1 (me) 1974-04-19
BE805299A (fr) 1974-03-25
FR2200342B1 (me) 1978-11-10
GB1440810A (en) 1976-06-30
DE2347799A1 (de) 1974-04-25
IT995502B (it) 1975-11-20
JPS4996053A (me) 1974-09-11
NL7313209A (me) 1974-03-27
JPS5812311B2 (ja) 1983-03-07
SE407942B (sv) 1979-04-30

Similar Documents

Publication Publication Date Title
CA1038992A (en) Hot melt adhesive
US4018733A (en) Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide
US4181775A (en) Adhesive
US5612448A (en) Curable adhesive compositions containing polyamide resins
US5548027A (en) Hotmelt adhesive
US3448178A (en) Hot melt adhesives comprising ethylene/vinyl acetate copolymers and alpha-pinene/phenol condensation products
CA1110795A (en) Adhesive polyamide resin compositions containing high acid number copolymers
CA1271293A (en) Adhesive composition
JPH0768498B2 (ja) ホットメルト接着剤およびその製造方法
CA1335138C (en) Hot-melt adhesive that has good open time at room temperature and can form creep-resistant bonds
JP2011236422A (ja) 脱着可能な自己接着性ラベル用ｈｍｐｓａ
JPH08509259A (ja) エチレン系ホットメルト接着剤及びそれらのホットメルト接着剤用改質剤
JP2002533500A (ja) ポリアミドに基づくホットメルト接着剤
WO1991012293A2 (en) Hot melt adhesive formulation heat curable by epoxy crosslinking
US3929938A (en) Limonene/phenol condensation products and hot-melt adhesives containing the same along with ethylene/unsaturated ester copolymers
US3646154A (en) Hot melt adhesive containing polyamide and ethylene-vinyl acetate copolymer
US5883172A (en) Polyamide hotmelt adhesive
US5296557A (en) Two-component curable hot melt compositions
US2495008A (en) Adhesive tape
NO155391B (no) Polyesteramider og deres anvendelse ved klebing av organiske eller uorganiske substrater og stoepemasse samt blandinger inneholdende polyesteramidene.
EP0905211A1 (fr) Adhésif sensible à la pression et applicable à chaud
US2986539A (en) Polyamide-epoxy adhesive
GB2173809A (en) Bonding poly(vinylidene chloride)
GB1595675A (en) Polyamides
WO1987000190A1 (en) Thermosetting adhesives for use with heat-recoverable closures