GB1440810A - Hot melt adhesive - Google Patents

Hot melt adhesive

Info

Publication number
GB1440810A
GB1440810A GB4489073A GB4489073A GB1440810A GB 1440810 A GB1440810 A GB 1440810A GB 4489073 A GB4489073 A GB 4489073A GB 4489073 A GB4489073 A GB 4489073A GB 1440810 A GB1440810 A GB 1440810A
Authority
GB
United Kingdom
Prior art keywords
ethylene
acid
copolymer
ester
terpolymers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4489073A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of GB1440810A publication Critical patent/GB1440810A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions
    • H02G15/18—Cable junctions protected by sleeves, e.g. for communication cable
    • H02G15/1806—Heat shrinkable sleeves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C61/00—Shaping by liberation of internal stresses; Making preforms having internal stresses; Apparatus therefor
    • B29C61/06—Making preforms having internal stresses, e.g. plastic memory
    • B29C61/0608—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms
    • B29C61/0616—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms layered or partially layered preforms, e.g. preforms with layers of adhesive or sealing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)

Abstract

1440810 Hot melt adhesive compositions RAYCHEM CORP 25 Sept 1973 [25 Sept 1972] 44890/73 Headings C3P and C3R Hot melt adhesive compositions comprise compatible mixtures of (a) an acidic ethylene copolymer having an acid number of 3 to 80, (b) a polyamide having an amine number of 70 to 400 and (c) 3 to 20 parts by weight per 100 parts of (a) and (b) of a tackifying agent, the relative proportions by weight of (a) and (b) being 30 : 70 to 60 : 40. The copolymer may be derived from ethylene and an unsaturated acid, optionally together with an ester of an unsaturated alcohol or an unsaturated acid, and may be prepared by direct copolymerization or by partial saponification of an unsaturated acid ester copolymer followed by acidification. The polyamide may be derived from dibasic acids, preferably consisting predominantly of "dimer acid", and diamines and/or monoalkanolamines. The tackifier may be a rosin derivative, chlorinated paraffin, ester, epoxidized ester, vegetable oil, lead stearate, terpene resin, vinyl toluene copolymer, orketone resin. The compositions may also contain conventional additives and may be used for bonding plastics to plastics or metals, particularly polyethylene sleeves to polyethylene- and lead-covered cable junctions and terminations. Examples describe (1 and 2) the preparation of polyamides from "dimer acid", hydrogenated "dimer diamine" and ethylene diamine; and adhesive compositions comprising (3) ethylene/vinyl acetate/methacrylic acid terpolymers, the above polyamides and ketone resin tackifier; (4) ethylene/vinyl acetate/methacrylic acid terpolymers, ethylene/acrylic acid copolymers, partially hydrolysed ethylene/ethyl acrylate copolymers, ethylene/vinyl propionate/ tetrahydrophthalic acid terpolymers or ethylene/mixed mono- and diethyl maleate terpolymers, the above or various commercial polyamides and ketone resin tackifier; and (5) ethylene/vinyl acetate/methacrylic acid copolymer, "dimeracid"/ethylene diamine polyamide and tackifiers selected from ketone resins, rosin derivatives, chlorinated biphenyl, chlorinated paraffin, triethylene glycol di- (2-ethylhexoate), N-ethyl toluene sulphonamides and epoxy plasticizers.
GB4489073A 1972-09-25 1973-09-25 Hot melt adhesive Expired GB1440810A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29154272A 1972-09-25 1972-09-25

Publications (1)

Publication Number Publication Date
GB1440810A true GB1440810A (en) 1976-06-30

Family

ID=23120730

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4489073A Expired GB1440810A (en) 1972-09-25 1973-09-25 Hot melt adhesive

Country Status (9)

Country Link
JP (1) JPS5812311B2 (en)
BE (1) BE805299A (en)
CA (1) CA1038992A (en)
DE (1) DE2347799C2 (en)
FR (1) FR2200342B1 (en)
GB (1) GB1440810A (en)
IT (1) IT995502B (en)
NL (1) NL7313209A (en)
SE (1) SE407942B (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132690A (en) 1976-09-27 1979-01-02 Allied Chemical Corporation Adhesive polyamide resin compositions containing high acid number copolymers
DE2848231A1 (en) * 1977-11-08 1979-05-10 Raychem Sa Nv ITEM REQUIRED BY HEAT
DE2900518A1 (en) * 1978-01-09 1979-07-19 Raychem Sa Nv METHOD FOR FORMING A SEALY DIFFERENTIAL JOINT AND FOR CARRYING OUT THE SPECIFIC CLAMP
US4181775A (en) 1976-05-24 1980-01-01 N.V. Raychem S.A. Adhesive
DE3029848A1 (en) * 1979-08-07 1981-02-26 Raychem Sa Nv CABLE SLEEVE OUTLET FOR A SPLICING HOUSING
US4335223A (en) * 1978-06-12 1982-06-15 Allied Corporation High impact molding compositions
GB2262939A (en) * 1991-12-20 1993-07-07 Exxon Chemical Patents Inc Thermoplastic compositions
EP0795593A2 (en) * 1996-03-15 1997-09-17 H.B. FULLER LICENSING & FINANCING, INC. Polyamide adhesives having improved bookbinding characteristics
US5817416A (en) * 1989-04-14 1998-10-06 E. I. Du Pont De Nemours And Company Resin solution for the surface treatment of polymers
FR2850111A1 (en) * 2003-01-17 2004-07-23 Atofina Hot-melt adhesive composition useful for glueing in fields such as automobiles, building, packaging, comprises a polyolefin/copolyamide mixture and a tackifying resin
WO2009062962A1 (en) * 2007-11-14 2009-05-22 Tarkett Sas Weld seam for ground coating
EP2765170A1 (en) * 2013-02-06 2014-08-13 Henkel AG & Co. KGaA Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2352358A1 (en) * 1976-05-17 1977-12-16 Raychem Corp Identity coding system for insulated electric conductors - has code number on polymer material strip coiled round conductor and shrunk by heating
US4095044A (en) * 1976-10-26 1978-06-13 Raychem Corporation Multiple cable adapter and splice case including the same
DE3211067A1 (en) * 1982-03-25 1983-09-29 Siemens AG, 1000 Berlin und 8000 München FOAMABLE MELT GLUE
DE3504804A1 (en) * 1985-02-13 1986-08-14 Henkel KGaA, 4000 Düsseldorf MELT GLUE
DE4211125C2 (en) * 1992-04-03 1994-12-08 Henkel Kgaa Hot melt adhesives, processes for their production and their use
CA2281707C (en) * 1998-01-12 2008-03-25 Sumitomo Electric Industries, Ltd. Adhesive resin composition and heat recoverable article using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1167517A (en) * 1965-11-17 1969-10-15 Hitachi Ltd Hotmelt Adhesive Compositions
US3484403A (en) * 1966-03-14 1969-12-16 Eastman Kodak Co Preparation of polyamide-carboxylated polyolefin melt blends
US3377305A (en) * 1966-07-18 1968-04-09 Cities Service Oil Co Heat sealable coating composition

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4181775A (en) 1976-05-24 1980-01-01 N.V. Raychem S.A. Adhesive
US4132690A (en) 1976-09-27 1979-01-02 Allied Chemical Corporation Adhesive polyamide resin compositions containing high acid number copolymers
DE2848231A1 (en) * 1977-11-08 1979-05-10 Raychem Sa Nv ITEM REQUIRED BY HEAT
DE2900518A1 (en) * 1978-01-09 1979-07-19 Raychem Sa Nv METHOD FOR FORMING A SEALY DIFFERENTIAL JOINT AND FOR CARRYING OUT THE SPECIFIC CLAMP
US4335223A (en) * 1978-06-12 1982-06-15 Allied Corporation High impact molding compositions
US4436872A (en) 1978-06-12 1984-03-13 Allied Corporation High impact molding compositions
DE3029848A1 (en) * 1979-08-07 1981-02-26 Raychem Sa Nv CABLE SLEEVE OUTLET FOR A SPLICING HOUSING
US5817416A (en) * 1989-04-14 1998-10-06 E. I. Du Pont De Nemours And Company Resin solution for the surface treatment of polymers
GB2262939A (en) * 1991-12-20 1993-07-07 Exxon Chemical Patents Inc Thermoplastic compositions
EP0795593A3 (en) * 1996-03-15 1998-10-14 H.B. FULLER LICENSING & FINANCING, INC. Polyamide adhesives having improved bookbinding characteristics
EP0795593A2 (en) * 1996-03-15 1997-09-17 H.B. FULLER LICENSING & FINANCING, INC. Polyamide adhesives having improved bookbinding characteristics
AU720179B2 (en) * 1996-03-15 2000-05-25 H.B. Fuller Licensing And Financing Inc. Polyamide adhesives having improved bookbinding characteristics
FR2850111A1 (en) * 2003-01-17 2004-07-23 Atofina Hot-melt adhesive composition useful for glueing in fields such as automobiles, building, packaging, comprises a polyolefin/copolyamide mixture and a tackifying resin
WO2004067668A1 (en) * 2003-01-17 2004-08-12 Arkema Polyolefin and copolyamide based thermofusible adhesive composition with improved thermal behavior
WO2009062962A1 (en) * 2007-11-14 2009-05-22 Tarkett Sas Weld seam for ground coating
US9938399B2 (en) 2007-11-14 2018-04-10 Tarkett Sas Weld seam for ground coating
EP2765170A1 (en) * 2013-02-06 2014-08-13 Henkel AG & Co. KGaA Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer
WO2014122211A1 (en) * 2013-02-06 2014-08-14 Henkel Ag & Co. Kgaa Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer
CN104968744A (en) * 2013-02-06 2015-10-07 汉高股份有限及两合公司 Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer
US10040981B2 (en) 2013-02-06 2018-08-07 Henkel Ag & Co. Kgaa Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer

Also Published As

Publication number Publication date
FR2200342A1 (en) 1974-04-19
SE407942B (en) 1979-04-30
FR2200342B1 (en) 1978-11-10
IT995502B (en) 1975-11-20
JPS4996053A (en) 1974-09-11
DE2347799A1 (en) 1974-04-25
CA1038992A (en) 1978-09-19
JPS5812311B2 (en) 1983-03-07
AU6058673A (en) 1975-03-27
BE805299A (en) 1974-03-25
DE2347799C2 (en) 1985-07-04
NL7313209A (en) 1974-03-27

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19920925