IT995502B - HOT MELT ADHESIVES - Google Patents

HOT MELT ADHESIVES

Info

Publication number
IT995502B
IT995502B IT29363/73A IT2936373A IT995502B IT 995502 B IT995502 B IT 995502B IT 29363/73 A IT29363/73 A IT 29363/73A IT 2936373 A IT2936373 A IT 2936373A IT 995502 B IT995502 B IT 995502B
Authority
IT
Italy
Prior art keywords
hot melt
melt adhesives
adhesives
hot
melt
Prior art date
Application number
IT29363/73A
Other languages
Italian (it)
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Priority to CH91874A priority Critical patent/CH570815A5/xx
Priority to GB388574A priority patent/GB1454045A/en
Priority to US442095A priority patent/US3873112A/en
Priority to DE2406762A priority patent/DE2406762C3/en
Priority to FR7405126A priority patent/FR2217041B3/fr
Application granted granted Critical
Publication of IT995502B publication Critical patent/IT995502B/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions
    • H02G15/18—Cable junctions protected by sleeves, e.g. for communication cable
    • H02G15/1806—Heat shrinkable sleeves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C61/00—Shaping by liberation of internal stresses; Making preforms having internal stresses; Apparatus therefor
    • B29C61/06—Making preforms having internal stresses, e.g. plastic memory
    • B29C61/0608—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms
    • B29C61/0616—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms layered or partially layered preforms, e.g. preforms with layers of adhesive or sealing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
IT29363/73A 1972-09-25 1973-09-25 HOT MELT ADHESIVES IT995502B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH91874A CH570815A5 (en) 1973-02-15 1974-01-23
GB388574A GB1454045A (en) 1973-02-15 1974-01-28 Releasable heel binding for skis
US442095A US3873112A (en) 1973-02-15 1974-02-13 Releasable rear attachment for skis having a constant release movement
DE2406762A DE2406762C3 (en) 1973-02-15 1974-02-13 Release ski binding
FR7405126A FR2217041B3 (en) 1973-02-15 1974-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29154272A 1972-09-25 1972-09-25

Publications (1)

Publication Number Publication Date
IT995502B true IT995502B (en) 1975-11-20

Family

ID=23120730

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29363/73A IT995502B (en) 1972-09-25 1973-09-25 HOT MELT ADHESIVES

Country Status (9)

Country Link
JP (1) JPS5812311B2 (en)
BE (1) BE805299A (en)
CA (1) CA1038992A (en)
DE (1) DE2347799C2 (en)
FR (1) FR2200342B1 (en)
GB (1) GB1440810A (en)
IT (1) IT995502B (en)
NL (1) NL7313209A (en)
SE (1) SE407942B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2352358A1 (en) * 1976-05-17 1977-12-16 Raychem Corp Identity coding system for insulated electric conductors - has code number on polymer material strip coiled round conductor and shrunk by heating
US4181775A (en) * 1976-05-24 1980-01-01 N.V. Raychem S.A. Adhesive
US4132690A (en) 1976-09-27 1979-01-02 Allied Chemical Corporation Adhesive polyamide resin compositions containing high acid number copolymers
US4095044A (en) * 1976-10-26 1978-06-13 Raychem Corporation Multiple cable adapter and splice case including the same
GB1604379A (en) * 1977-11-08 1981-12-09 Raychem Sa Nv Heat shrinkable article
GB1604981A (en) * 1978-01-09 1981-12-16 Raychem Sa Nv Branchoff method
US4335223A (en) * 1978-06-12 1982-06-15 Allied Corporation High impact molding compositions
CA1152591A (en) * 1979-08-07 1983-08-23 Jean-Marie E. Nolf Cable sleeve outlet for splice case
DE3211067A1 (en) * 1982-03-25 1983-09-29 Siemens AG, 1000 Berlin und 8000 München FOAMABLE MELT GLUE
DE3504804A1 (en) * 1985-02-13 1986-08-14 Henkel KGaA, 4000 Düsseldorf MELT GLUE
DE3912523A1 (en) * 1989-04-14 1990-10-18 Henkel Kgaa USE OF RESIN SOLUTIONS OR DISPERSIONS OF RESINS FOR SURFACE TREATMENT OF POLYMER FIBERS
GB2262939A (en) * 1991-12-20 1993-07-07 Exxon Chemical Patents Inc Thermoplastic compositions
DE4211125C2 (en) * 1992-04-03 1994-12-08 Henkel Kgaa Hot melt adhesives, processes for their production and their use
DE69705083T2 (en) * 1996-03-15 2001-09-20 Fuller H B Licensing Financ Process for bookbinding using polyamide hot melt adhesive
CA2281707C (en) * 1998-01-12 2008-03-25 Sumitomo Electric Industries, Ltd. Adhesive resin composition and heat recoverable article using the same
FR2850111B1 (en) * 2003-01-17 2007-02-23 Atofina THERMOFUSIBLE ADHESIVE COMPOSITION BASED ON POLYOLEFINS AND COPOLYAMIDES WITH IMPROVED THERMAL STRENGTH
EP2227372B1 (en) * 2007-11-14 2018-06-20 Tarkett SAS Welding rod for flooring
EP2765170B1 (en) * 2013-02-06 2016-01-13 Henkel AG & Co. KGaA Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1167516A (en) * 1965-11-17 1969-10-15 Hitachi Ltd Hotmelt Adhesive Compositions
US3484403A (en) * 1966-03-14 1969-12-16 Eastman Kodak Co Preparation of polyamide-carboxylated polyolefin melt blends
US3377305A (en) * 1966-07-18 1968-04-09 Cities Service Oil Co Heat sealable coating composition

Also Published As

Publication number Publication date
FR2200342A1 (en) 1974-04-19
BE805299A (en) 1974-03-25
SE407942B (en) 1979-04-30
AU6058673A (en) 1975-03-27
DE2347799C2 (en) 1985-07-04
FR2200342B1 (en) 1978-11-10
CA1038992A (en) 1978-09-19
GB1440810A (en) 1976-06-30
DE2347799A1 (en) 1974-04-25
NL7313209A (en) 1974-03-27
JPS5812311B2 (en) 1983-03-07
JPS4996053A (en) 1974-09-11

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