GB1167516A - Hotmelt Adhesive Compositions - Google Patents
Hotmelt Adhesive CompositionsInfo
- Publication number
- GB1167516A GB1167516A GB51386/66A GB5138666A GB1167516A GB 1167516 A GB1167516 A GB 1167516A GB 51386/66 A GB51386/66 A GB 51386/66A GB 5138666 A GB5138666 A GB 5138666A GB 1167516 A GB1167516 A GB 1167516A
- Authority
- GB
- United Kingdom
- Prior art keywords
- polyethylene
- low
- ethylene
- resins
- chlorinated polyethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
1,167,516. Polymer compositions. HITACHI SEISAKUSHO K.K. 16 Nov., 1966 [17 Nov., 1965; 19 Sept., 1966; 24 Oct., 1966], No. 51386/66. Headings C3B, C3P and C3R. Hot melt adhesive compositions comprise 95 to 50 parts by weight of an ethylene copolymer, 5 to 50 parts by weight of one or more high molecular weight thermoplastic resins selected from chlorinated polyolefins, polyesters, e.g. derived from terephthalic and/or isophthalic acids and ethylene and/or neopentyl glycols, phenoxy resins, polyvinyl formals, polyvinyl butyrals and ionomer resins, and optionally one or more agents to modify the softening point or viscosity. Specified agents are terpene and petroleum resins, low molecular weight polyolefins and polystyrenes, waxes and alkyl phenol condensates, e.g. 4,41 - thio - bis - (6 - t. - butyl - 3-methylphenol). The compositions may be used for coating and bonding polymeric materials, metals, porcelain, ceramics and glass. Examples describe hot melt adhesives comprising ethylene/vinyl acetate copolymers and (2-4) chlorinated polyethylene, (6) chlorinated polyethylene and terpene resin, (7) chlorinated polyethylene and low molecular weight polyethylene, (8 and 9) chlorinated polyethylene, terpene resin and low polyethylene, (10) chlorinated polyethylene, petroleum resin and low polyethylene, (13-15) polyvinyl butyral, (18- 21) polyvinyl butyral and low polyethylene, and (22-25) ionomer resins and low polyethylene; comprising ethylene/methyl acrylate copolymers and (11 and 12) chlorinated polyethylene, petroleum resin, p-t.-butylphenol dimer and low polyethylene; and comprising ethylene/ ethyl acrylate copolymers, polyesters derived from ethylene and neopentyl glycols and terephthalic and isophthalic acids and (26-28) phenoxy resins, and (29-31) low polyethylenes.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7027865 | 1965-11-17 | ||
JP6139266A JPS498026B1 (en) | 1966-09-19 | 1966-09-19 | |
JP6970666 | 1966-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1167516A true GB1167516A (en) | 1969-10-15 |
Family
ID=27297487
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB51386/66A Expired GB1167516A (en) | 1965-11-17 | 1966-11-16 | Hotmelt Adhesive Compositions |
GB34639/68A Expired GB1167517A (en) | 1965-11-17 | 1966-11-16 | Hotmelt Adhesive Compositions |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB34639/68A Expired GB1167517A (en) | 1965-11-17 | 1966-11-16 | Hotmelt Adhesive Compositions |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1594076B2 (en) |
GB (2) | GB1167516A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036451B1 (en) * | 1971-06-12 | 1975-11-25 | ||
US4018733A (en) | 1972-09-25 | 1977-04-19 | Raychem Corporation | Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide |
GB2321059A (en) * | 1997-01-13 | 1998-07-15 | Armstrong World Ind Inc | Extrudable polyvinyl butyral composition |
WO2000026319A1 (en) * | 1998-11-03 | 2000-05-11 | The Dow Chemical Company | Hot-melt adhesive compositions |
WO2014003204A1 (en) * | 2012-06-28 | 2014-01-03 | Henkel Japan Ltd. | Hot melt adhesive |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5812311B2 (en) * | 1972-09-25 | 1983-03-07 | レイケム コ−ポレ−シヨン | Hot Melt Gatasetchi Yakuzai |
CA1218005A (en) * | 1981-10-27 | 1987-02-17 | Roger D.A. Van Der Linden | Coated recoverable articles |
US4696965A (en) * | 1985-07-23 | 1987-09-29 | Minnesota Mining And Manufacturing Company | Polyamide-acrylic blends |
-
1966
- 1966-11-16 GB GB51386/66A patent/GB1167516A/en not_active Expired
- 1966-11-16 GB GB34639/68A patent/GB1167517A/en not_active Expired
- 1966-11-17 DE DE1594076A patent/DE1594076B2/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036451B1 (en) * | 1971-06-12 | 1975-11-25 | ||
US4018733A (en) | 1972-09-25 | 1977-04-19 | Raychem Corporation | Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide |
GB2321059A (en) * | 1997-01-13 | 1998-07-15 | Armstrong World Ind Inc | Extrudable polyvinyl butyral composition |
WO2000026319A1 (en) * | 1998-11-03 | 2000-05-11 | The Dow Chemical Company | Hot-melt adhesive compositions |
WO2014003204A1 (en) * | 2012-06-28 | 2014-01-03 | Henkel Japan Ltd. | Hot melt adhesive |
CN104540914A (en) * | 2012-06-28 | 2015-04-22 | 汉高股份有限及两合公司 | Hot melt adhesive |
Also Published As
Publication number | Publication date |
---|---|
DE1594076B2 (en) | 1975-09-11 |
GB1167517A (en) | 1969-10-15 |
DE1594076A1 (en) | 1970-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |