GB1167516A - Hotmelt Adhesive Compositions - Google Patents

Hotmelt Adhesive Compositions

Info

Publication number
GB1167516A
GB1167516A GB51386/66A GB5138666A GB1167516A GB 1167516 A GB1167516 A GB 1167516A GB 51386/66 A GB51386/66 A GB 51386/66A GB 5138666 A GB5138666 A GB 5138666A GB 1167516 A GB1167516 A GB 1167516A
Authority
GB
United Kingdom
Prior art keywords
polyethylene
low
ethylene
resins
chlorinated polyethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB51386/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6139266A external-priority patent/JPS498026B1/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1167516A publication Critical patent/GB1167516A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

1,167,516. Polymer compositions. HITACHI SEISAKUSHO K.K. 16 Nov., 1966 [17 Nov., 1965; 19 Sept., 1966; 24 Oct., 1966], No. 51386/66. Headings C3B, C3P and C3R. Hot melt adhesive compositions comprise 95 to 50 parts by weight of an ethylene copolymer, 5 to 50 parts by weight of one or more high molecular weight thermoplastic resins selected from chlorinated polyolefins, polyesters, e.g. derived from terephthalic and/or isophthalic acids and ethylene and/or neopentyl glycols, phenoxy resins, polyvinyl formals, polyvinyl butyrals and ionomer resins, and optionally one or more agents to modify the softening point or viscosity. Specified agents are terpene and petroleum resins, low molecular weight polyolefins and polystyrenes, waxes and alkyl phenol condensates, e.g. 4,41 - thio - bis - (6 - t. - butyl - 3-methylphenol). The compositions may be used for coating and bonding polymeric materials, metals, porcelain, ceramics and glass. Examples describe hot melt adhesives comprising ethylene/vinyl acetate copolymers and (2-4) chlorinated polyethylene, (6) chlorinated polyethylene and terpene resin, (7) chlorinated polyethylene and low molecular weight polyethylene, (8 and 9) chlorinated polyethylene, terpene resin and low polyethylene, (10) chlorinated polyethylene, petroleum resin and low polyethylene, (13-15) polyvinyl butyral, (18- 21) polyvinyl butyral and low polyethylene, and (22-25) ionomer resins and low polyethylene; comprising ethylene/methyl acrylate copolymers and (11 and 12) chlorinated polyethylene, petroleum resin, p-t.-butylphenol dimer and low polyethylene; and comprising ethylene/ ethyl acrylate copolymers, polyesters derived from ethylene and neopentyl glycols and terephthalic and isophthalic acids and (26-28) phenoxy resins, and (29-31) low polyethylenes.
GB51386/66A 1965-11-17 1966-11-16 Hotmelt Adhesive Compositions Expired GB1167516A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7027865 1965-11-17
JP6139266A JPS498026B1 (en) 1966-09-19 1966-09-19
JP6970666 1966-10-24

Publications (1)

Publication Number Publication Date
GB1167516A true GB1167516A (en) 1969-10-15

Family

ID=27297487

Family Applications (2)

Application Number Title Priority Date Filing Date
GB51386/66A Expired GB1167516A (en) 1965-11-17 1966-11-16 Hotmelt Adhesive Compositions
GB34639/68A Expired GB1167517A (en) 1965-11-17 1966-11-16 Hotmelt Adhesive Compositions

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB34639/68A Expired GB1167517A (en) 1965-11-17 1966-11-16 Hotmelt Adhesive Compositions

Country Status (2)

Country Link
DE (1) DE1594076B2 (en)
GB (2) GB1167516A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036451B1 (en) * 1971-06-12 1975-11-25
US4018733A (en) 1972-09-25 1977-04-19 Raychem Corporation Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide
GB2321059A (en) * 1997-01-13 1998-07-15 Armstrong World Ind Inc Extrudable polyvinyl butyral composition
WO2000026319A1 (en) * 1998-11-03 2000-05-11 The Dow Chemical Company Hot-melt adhesive compositions
WO2014003204A1 (en) * 2012-06-28 2014-01-03 Henkel Japan Ltd. Hot melt adhesive

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812311B2 (en) * 1972-09-25 1983-03-07 レイケム コ−ポレ−シヨン Hot Melt Gatasetchi Yakuzai
FI76633C (en) * 1981-10-27 1988-11-10 Raychem Sa Nv Tube protection sleeve and method for protecting a tube with this sleeve
US4696965A (en) * 1985-07-23 1987-09-29 Minnesota Mining And Manufacturing Company Polyamide-acrylic blends

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036451B1 (en) * 1971-06-12 1975-11-25
US4018733A (en) 1972-09-25 1977-04-19 Raychem Corporation Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide
GB2321059A (en) * 1997-01-13 1998-07-15 Armstrong World Ind Inc Extrudable polyvinyl butyral composition
WO2000026319A1 (en) * 1998-11-03 2000-05-11 The Dow Chemical Company Hot-melt adhesive compositions
WO2014003204A1 (en) * 2012-06-28 2014-01-03 Henkel Japan Ltd. Hot melt adhesive
CN104540914A (en) * 2012-06-28 2015-04-22 汉高股份有限及两合公司 Hot melt adhesive

Also Published As

Publication number Publication date
DE1594076B2 (en) 1975-09-11
GB1167517A (en) 1969-10-15
DE1594076A1 (en) 1970-10-29

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees