CA1038326A - Aqueous acidic copper plating bath with chloride ions and sulfur compounds - Google Patents

Aqueous acidic copper plating bath with chloride ions and sulfur compounds

Info

Publication number
CA1038326A
CA1038326A CA172,595A CA172595A CA1038326A CA 1038326 A CA1038326 A CA 1038326A CA 172595 A CA172595 A CA 172595A CA 1038326 A CA1038326 A CA 1038326A
Authority
CA
Canada
Prior art keywords
sulfur compound
heterocyclic sulfur
plating bath
copper plating
aqueous acidic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA172,595A
Other languages
English (en)
French (fr)
Other versions
CA172595S (en
Inventor
Otto Kardos
Silvester P. Valayil
Donald A. Arcilesi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Application granted granted Critical
Publication of CA1038326A publication Critical patent/CA1038326A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA172,595A 1972-06-19 1973-05-29 Aqueous acidic copper plating bath with chloride ions and sulfur compounds Expired CA1038326A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00264193A US3804729A (en) 1972-06-19 1972-06-19 Electrolyte and process for electro-depositing copper

Publications (1)

Publication Number Publication Date
CA1038326A true CA1038326A (en) 1978-09-12

Family

ID=23004985

Family Applications (1)

Application Number Title Priority Date Filing Date
CA172,595A Expired CA1038326A (en) 1972-06-19 1973-05-29 Aqueous acidic copper plating bath with chloride ions and sulfur compounds

Country Status (11)

Country Link
US (1) US3804729A (es)
JP (1) JPS5727189B2 (es)
AR (1) AR200018A1 (es)
BR (1) BR7304502D0 (es)
CA (1) CA1038326A (es)
DE (1) DE2331180C2 (es)
FR (1) FR2190943B1 (es)
GB (1) GB1433039A (es)
IT (1) IT988460B (es)
NL (1) NL7308515A (es)
ZA (1) ZA733838B (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
DE4126502C1 (es) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating

Also Published As

Publication number Publication date
US3804729A (en) 1974-04-16
FR2190943A1 (es) 1974-02-01
ZA733838B (en) 1974-08-28
BR7304502D0 (pt) 1974-08-15
AR200018A1 (es) 1974-10-15
DE2331180C2 (de) 1982-12-23
DE2331180A1 (de) 1974-01-17
NL7308515A (es) 1973-12-21
FR2190943B1 (es) 1977-09-09
JPS5727189B2 (es) 1982-06-09
GB1433039A (en) 1976-04-22
IT988460B (it) 1975-04-10
AU5622773A (en) 1974-12-05
JPS4952133A (es) 1974-05-21

Similar Documents

Publication Publication Date Title
US3682788A (en) Copper electroplating
US3542655A (en) Electrodeposition of copper
US2837472A (en) Brighteners for electroplating baths
US4036711A (en) Electrodeposition of copper
CA1038326A (en) Aqueous acidic copper plating bath with chloride ions and sulfur compounds
US3804726A (en) Electroplating processes and compositions
US4036709A (en) Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron
US4179343A (en) Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits
US3812566A (en) Composite nickel iron electroplate and method of making said electroplate
US4014759A (en) Electroplating iron alloys containing nickel, cobalt or nickel and cobalt
US4129482A (en) Electroplating iron group metal alloys
US4046647A (en) Additive for improved electroplating process
US3787463A (en) Amine gold complex useful for the electrodeposition of gold and its alloys
US3922209A (en) Electrode position of alloys of nickel, cobalt or nickel and cobalt with iron and electrolytes therefor
US3956084A (en) Electrodeposition of copper
US4104137A (en) Alloy plating
US3703448A (en) Method of making composite nickel electroplate and electrolytes therefor
US3940320A (en) Electrodeposition of copper
US4069112A (en) Electroplating of nickel, cobalt, mutual alloys thereof or ternary alloys thereof with iron
NO147995B (no) Fremgangsmaate til fremstilling av en elektrolytisk utfelling og pletteringsopploesning for utfoerelse av fremgangsmaaten
US3956120A (en) Electrodeposition of copper
US3367854A (en) Nickel plating
US3956079A (en) Electrodeposition of copper
US3969399A (en) Electroplating processes and compositions
CA1086679A (en) Electrodepositing nickel, cobalt and their alloys with unsaturated cyclosulfone added