CA1038325A - Compositions and process for the electrodeposition of metals - Google Patents

Compositions and process for the electrodeposition of metals

Info

Publication number
CA1038325A
CA1038325A CA203,082A CA203082A CA1038325A CA 1038325 A CA1038325 A CA 1038325A CA 203082 A CA203082 A CA 203082A CA 1038325 A CA1038325 A CA 1038325A
Authority
CA
Canada
Prior art keywords
aqueous solution
metal
copper
metal ion
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA203,082A
Other languages
English (en)
French (fr)
Other versions
CA203082S (fr
Inventor
Xavier Kowalski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Application granted granted Critical
Publication of CA1038325A publication Critical patent/CA1038325A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA203,082A 1973-06-25 1974-06-21 Compositions and process for the electrodeposition of metals Expired CA1038325A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US373051A US3914162A (en) 1973-06-25 1973-06-25 Compositions and process for the electrodeposition of metals

Publications (1)

Publication Number Publication Date
CA1038325A true CA1038325A (en) 1978-09-12

Family

ID=23470708

Family Applications (1)

Application Number Title Priority Date Filing Date
CA203,082A Expired CA1038325A (en) 1973-06-25 1974-06-21 Compositions and process for the electrodeposition of metals

Country Status (11)

Country Link
US (1) US3914162A (it)
JP (1) JPS5036322A (it)
AR (1) AR207452A1 (it)
BE (1) BE816806A (it)
BR (1) BR7405129D0 (it)
CA (1) CA1038325A (it)
DE (1) DE2430250A1 (it)
FR (1) FR2234388B1 (it)
GB (1) GB1438080A (it)
IT (1) IT1015337B (it)
SE (1) SE7408241L (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52106331A (en) * 1976-03-05 1977-09-06 Kosaku Kk Plating bath
DE2732777C2 (de) * 1977-07-20 1979-09-13 Benckiser-Knapsack Gmbh, 6802 Ladenburg N-Carboxyalkan-aminoalkan-polyphosphonsäuren und deren Alkalisalze sowie Verfahren zu ihrer Herstellung
US4265715A (en) * 1979-07-13 1981-05-05 Oxy Metal Industries Corporation Silver electrodeposition process
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
AU575037B2 (en) * 1983-01-03 1988-07-21 Omi International Corp. Cyanide-free copper plating electrolyte and process
US4979987A (en) * 1988-07-19 1990-12-25 First Miss Gold, Inc. Precious metals recovery from refractory carbonate ores
US5021324A (en) * 1990-10-05 1991-06-04 Polychrome Corporation Printing plate protectant
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
US7604783B2 (en) 2004-12-22 2009-10-20 Placer Dome Technical Services Limited Reduction of lime consumption when treating refractor gold ores or concentrates
US8061888B2 (en) 2006-03-17 2011-11-22 Barrick Gold Corporation Autoclave with underflow dividers
US8252254B2 (en) 2006-06-15 2012-08-28 Barrick Gold Corporation Process for reduced alkali consumption in the recovery of silver
WO2018181190A1 (ja) * 2017-03-31 2018-10-04 メタローテクノロジーズジャパン株式会社 電解銀めっき液
CN113832509B (zh) * 2021-09-30 2022-08-26 深圳市联合蓝海黄金材料科技股份有限公司 用于在镍镀层上电镀金的镀液和在镍镀层上电镀金的方法和镀金件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2673214A (en) * 1952-06-11 1954-03-23 Bersworth Polyhydroxyamino acid compounds
US2961311A (en) * 1955-12-13 1960-11-22 Dow Chemical Co Metal ion control
US3293176A (en) * 1964-04-01 1966-12-20 Le Roy A White Method of chelating with an ethergroup-containing sequestering agent
DE1496916B1 (de) * 1964-09-22 1969-10-23 Monsanto Co Cyanidfreies,galvanisches Bad und Verfahren zum Abscheiden galvanischer UEberzuege
DE1217950B (de) * 1965-02-25 1966-06-02 Henkel & Cie Gmbh Verfahren zur Herstellung neuer Perhydrate von Aminoalkylphosphonsaeuren
FR96342E (it) * 1967-12-09 1972-06-16
GB1392242A (en) * 1971-07-26 1975-04-30 Technic Process for producing by electrodeposition bright deposits of gold and its alloys
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques

Also Published As

Publication number Publication date
IT1015337B (it) 1977-05-10
BR7405129D0 (pt) 1975-01-21
AR207452A1 (es) 1976-10-08
SE7408241L (it) 1974-12-27
USB373051I5 (it) 1975-01-28
US3914162A (en) 1975-10-21
DE2430250A1 (de) 1975-01-23
GB1438080A (it) 1976-06-03
FR2234388A1 (it) 1975-01-17
FR2234388B1 (it) 1978-02-17
JPS5036322A (it) 1975-04-05
BE816806A (fr) 1974-12-27

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