CA1037519A - Method of producing nozzles in monocrystalline silicon wafer - Google Patents
Method of producing nozzles in monocrystalline silicon waferInfo
- Publication number
- CA1037519A CA1037519A CA240,350A CA240350A CA1037519A CA 1037519 A CA1037519 A CA 1037519A CA 240350 A CA240350 A CA 240350A CA 1037519 A CA1037519 A CA 1037519A
- Authority
- CA
- Canada
- Prior art keywords
- silicon
- layer
- cross
- section
- sectional area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 37
- 239000010703 silicon Substances 0.000 claims abstract description 37
- 238000005530 etching Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- 239000002019 doping agent Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 12
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 11
- 235000012239 silicon dioxide Nutrition 0.000 claims description 11
- 230000000873 masking effect Effects 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 238000005468 ion implantation Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- 150000004985 diamines Chemical class 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 14
- 239000012535 impurity Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000004888 barrier function Effects 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000007641 inkjet printing Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 244000228957 Ferula foetida Species 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001282736 Oriens Species 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- FRIKWZARTBPWBN-UHFFFAOYSA-N [Si].O=[Si]=O Chemical compound [Si].O=[Si]=O FRIKWZARTBPWBN-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000001243 acetic acids Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- LFETXMWECUPHJA-UHFFFAOYSA-N methanamine;hydrate Chemical compound O.NC LFETXMWECUPHJA-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B9/00—Blowing glass; Production of hollow glass articles
- C03B9/30—Details of blowing glass; Use of materials for the moulds
- C03B9/32—Giving special shapes to parts of hollow glass articles
- C03B9/33—Making hollow glass articles with feet or projections; Moulds therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S239/00—Fluid sprinkling, spraying, and diffusing
- Y10S239/19—Nozzle materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Weting (AREA)
- Nozzles (AREA)
- Facsimile Heads (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US537799A US3921916A (en) | 1974-12-31 | 1974-12-31 | Nozzles formed in monocrystalline silicon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1037519A true CA1037519A (en) | 1978-08-29 |
Family
ID=24144139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA240,350A Expired CA1037519A (en) | 1974-12-31 | 1975-11-21 | Method of producing nozzles in monocrystalline silicon wafer |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3921916A (da) |
| JP (1) | JPS5516070B2 (da) |
| CA (1) | CA1037519A (da) |
| DE (1) | DE2555462C2 (da) |
| FR (1) | FR2296504A1 (da) |
| GB (1) | GB1492465A (da) |
| IT (1) | IT1054354B (da) |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4007464A (en) * | 1975-01-23 | 1977-02-08 | International Business Machines Corporation | Ink jet nozzle |
| US4014029A (en) * | 1975-12-31 | 1977-03-22 | International Business Machines Corporation | Staggered nozzle array |
| US4047184A (en) * | 1976-01-28 | 1977-09-06 | International Business Machines Corporation | Charge electrode array and combination for ink jet printing and method of manufacture |
| US4106976A (en) * | 1976-03-08 | 1978-08-15 | International Business Machines Corporation | Ink jet nozzle method of manufacture |
| US4035812A (en) * | 1976-07-12 | 1977-07-12 | The Mead Corporation | Ink jet recorder and charge ring plate therefor with reduced deplating current |
| US4169008A (en) * | 1977-06-13 | 1979-09-25 | International Business Machines Corporation | Process for producing uniform nozzle orifices in silicon wafers |
| US4146899A (en) * | 1977-10-13 | 1979-03-27 | The Mead Corporation | Formed orifice plate for ink jet printing apparatus |
| US4184925A (en) * | 1977-12-19 | 1980-01-22 | The Mead Corporation | Solid metal orifice plate for a jet drop recorder |
| US4239586A (en) * | 1979-06-29 | 1980-12-16 | International Business Machines Corporation | Etching of multiple holes of uniform size |
| US4229265A (en) * | 1979-08-09 | 1980-10-21 | The Mead Corporation | Method for fabricating and the solid metal orifice plate for a jet drop recorder produced thereby |
| US4430784A (en) * | 1980-02-22 | 1984-02-14 | Celanese Corporation | Manufacturing process for orifice nozzle devices for ink jet printing apparati |
| US4282533A (en) * | 1980-02-22 | 1981-08-04 | Celanese Corporation | Precision orifice nozzle devices for ink jet printing apparati and the process for their manufacture |
| JPS5764563A (en) * | 1980-10-07 | 1982-04-19 | Fuji Xerox Co Ltd | Ink particle jet apparatus of multi-nozzle ink jet printer |
| JPS57182449A (en) * | 1981-05-07 | 1982-11-10 | Fuji Xerox Co Ltd | Forming method of ink jet multinozzle |
| JPS57208262A (en) * | 1981-06-18 | 1982-12-21 | Ibm | Drop-on demand type ink jet printing method |
| EP0078337B1 (de) * | 1981-10-30 | 1987-04-22 | Ibm Deutschland Gmbh | Kontakteinrichtung zur lösbaren Verbindung elektrischer Bauteile |
| US4583690A (en) * | 1983-04-05 | 1986-04-22 | Hewlett-Packard Company | Anti-wetting in fluid nozzles |
| US4555062A (en) * | 1983-04-05 | 1985-11-26 | Hewlett-Packard Company | Anti-wetting in fluid nozzles |
| DE3477977D1 (en) * | 1983-12-08 | 1989-06-01 | Gen Signal Corp | Isfet sensor and method of manufacture |
| DE3586998T2 (de) * | 1984-09-28 | 1993-07-22 | Matsushita Electric Ind Co Ltd | Tintenstrahldrucker. |
| CA1237020A (en) * | 1984-10-13 | 1988-05-24 | Herbert A. Waggener | Silicon nozzle structure and method of manufacture |
| US4733823A (en) * | 1984-10-15 | 1988-03-29 | At&T Teletype Corporation | Silicon nozzle structures and method of manufacture |
| US4647013A (en) * | 1985-02-21 | 1987-03-03 | Ford Motor Company | Silicon valve |
| US4756508A (en) * | 1985-02-21 | 1988-07-12 | Ford Motor Company | Silicon valve |
| US4628576A (en) * | 1985-02-21 | 1986-12-16 | Ford Motor Company | Method for fabricating a silicon valve |
| US4768751A (en) * | 1987-10-19 | 1988-09-06 | Ford Motor Company | Silicon micromachined non-elastic flow valves |
| AU625518B2 (en) * | 1988-03-14 | 1992-07-16 | Baxter International Inc. | Systems having fixed and variable flow rate control mechanisms |
| US5176360A (en) * | 1988-03-14 | 1993-01-05 | Baxter International Inc. | Infusor having fixed and variable flow rate control mechanisms |
| US5014750A (en) * | 1988-03-14 | 1991-05-14 | Baxter International Inc. | Systems having fixed and variable flow rate control mechanisms |
| US5009251A (en) * | 1988-11-15 | 1991-04-23 | Baxter International, Inc. | Fluid flow control |
| SG45171A1 (en) * | 1990-03-21 | 1998-01-16 | Boehringer Ingelheim Int | Atomising devices and methods |
| DE4112150C2 (de) * | 1990-09-21 | 1998-11-19 | Bosch Gmbh Robert | Lochkörper und Ventil mit Lochkörper |
| IL100224A (en) * | 1990-12-04 | 1994-10-21 | Dmw Tech Ltd | Spray nozzle |
| DE4104019C1 (da) * | 1991-02-09 | 1992-04-23 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
| ATE173197T1 (de) * | 1992-08-31 | 1998-11-15 | Canon Kk | Tintenstrahlkopfherstellungsverfahren mittels bearbeitung durch ionen und tintenstrahlkopf |
| US6007676A (en) * | 1992-09-29 | 1999-12-28 | Boehringer Ingelheim International Gmbh | Atomizing nozzle and filter and spray generating device |
| IL107120A (en) * | 1992-09-29 | 1997-09-30 | Boehringer Ingelheim Int | Atomising nozzle and filter and spray generating device |
| CA2115819C (en) * | 1993-02-17 | 2000-07-25 | Yasuhide Tani | Fluid injection nozzle |
| US5569187A (en) * | 1994-08-16 | 1996-10-29 | Texas Instruments Incorporated | Method and apparatus for wireless chemical supplying |
| DE19515722C1 (de) * | 1995-05-03 | 1996-07-25 | Tricumed Gmbh | Implantierbare Infusionspumpe |
| US5908414A (en) * | 1995-05-03 | 1999-06-01 | Tricumed Gmbh | Implantable infusion pump |
| US5992769A (en) * | 1995-06-09 | 1999-11-30 | The Regents Of The University Of Michigan | Microchannel system for fluid delivery |
| JP3386099B2 (ja) * | 1995-07-03 | 2003-03-10 | セイコーエプソン株式会社 | インクジェット式記録ヘッド用ノズルプレート、これの製造方法、及びインクジェット式記録ヘッド |
| FR2736303B1 (fr) * | 1995-07-03 | 1998-08-21 | Seiko Epson Corp | Tete a jets d'encre et son procede de fabrication |
| US5658471A (en) * | 1995-09-22 | 1997-08-19 | Lexmark International, Inc. | Fabrication of thermal ink-jet feed slots in a silicon substrate |
| US5757400A (en) * | 1996-02-01 | 1998-05-26 | Spectra, Inc. | High resolution matrix ink jet arrangement |
| EP0910478A4 (en) * | 1996-07-08 | 1999-09-01 | Corning Inc | RAYLEIGH BREAKING ATOMIZATION DEVICES AND METHODS OF MANUFACTURING SUCH DEVICES |
| US6352209B1 (en) | 1996-07-08 | 2002-03-05 | Corning Incorporated | Gas assisted atomizing devices and methods of making gas-assisted atomizing devices |
| WO1998001705A1 (en) | 1996-07-08 | 1998-01-15 | Corning Incorporated | Gas-assisted atomizing device |
| US5901425A (en) * | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
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| US6375858B1 (en) * | 1997-05-14 | 2002-04-23 | Seiko Epson Corporation | Method of forming nozzle for injection device and method of manufacturing inkjet head |
| JP3530744B2 (ja) * | 1997-07-04 | 2004-05-24 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| DE19742439C1 (de) * | 1997-09-26 | 1998-10-22 | Boehringer Ingelheim Int | Mikrostrukturiertes Filter |
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| US6363606B1 (en) * | 1998-10-16 | 2002-04-02 | Agere Systems Guardian Corp. | Process for forming integrated structures using three dimensional printing techniques |
| US6633031B1 (en) | 1999-03-02 | 2003-10-14 | Advion Biosciences, Inc. | Integrated monolithic microfabricated dispensing nozzle and liquid chromatography-electrospray system and method |
| JP2001179987A (ja) * | 1999-12-22 | 2001-07-03 | Samsung Electro Mech Co Ltd | ノズルプレート及びその製造方法 |
| ATE538490T1 (de) | 1999-12-30 | 2012-01-15 | Advion Biosystems Inc | Mehrfach-elektrospray-einrichtung, systeme und verfahren |
| JP2003520962A (ja) | 2000-01-18 | 2003-07-08 | アドビオン バイオサイエンシーズ インコーポレーティッド | 分離媒体、複式電気噴霧ノズルシステム、および方法 |
| KR100499118B1 (ko) | 2000-02-24 | 2005-07-04 | 삼성전자주식회사 | 단결정 실리콘 웨이퍼를 이용한 일체형 유체 노즐어셈블리 및 그 제작방법 |
| DE10101875B4 (de) * | 2001-01-16 | 2006-05-04 | Infineon Technologies Ag | Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips und Verfahren zu seiner Herstellung |
| AU2002354191A1 (en) * | 2001-12-04 | 2003-06-17 | Atock Co., Ltd. | Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid |
| JP3975272B2 (ja) * | 2002-02-21 | 2007-09-12 | 独立行政法人産業技術総合研究所 | 超微細流体ジェット装置 |
| WO2005024927A1 (en) * | 2003-09-09 | 2005-03-17 | Csg Solar, Ag | Improved method of etching silicon |
| CN100435358C (zh) * | 2003-09-09 | 2008-11-19 | Csg索拉尔有限公司 | 通过回流调节掩模 |
| CN100561668C (zh) * | 2003-09-09 | 2009-11-18 | Csg索拉尔有限公司 | 在有机树脂材料中形成开口的改进方法 |
| US7548775B2 (en) | 2003-10-21 | 2009-06-16 | The Regents Of The University Of Michigan | Intracranial neural interface system |
| US7347532B2 (en) * | 2004-08-05 | 2008-03-25 | Fujifilm Dimatix, Inc. | Print head nozzle formation |
| US9014796B2 (en) | 2005-06-14 | 2015-04-21 | Regents Of The University Of Michigan | Flexible polymer microelectrode with fluid delivery capability and methods for making same |
| CN101583309B (zh) * | 2005-10-07 | 2012-07-04 | 神经连结科技公司 | 模块化多通道微电极阵列及其制造方法 |
| WO2007089738A2 (en) | 2006-01-26 | 2007-08-09 | The Regents Of The University Of Michigan | Microelectrode with laterally extending platform for reduction of tissue encapsulation |
| JP4881126B2 (ja) * | 2006-10-25 | 2012-02-22 | 株式会社東芝 | ノズルプレートの製造方法、および液滴吐出ヘッドの製造方法 |
| US8731673B2 (en) * | 2007-02-26 | 2014-05-20 | Sapiens Steering Brain Stimulation B.V. | Neural interface system |
| WO2009042212A2 (en) * | 2007-09-26 | 2009-04-02 | Aradigm Corporation | Impinging jet nozzles in stretched or deformed substrates |
| WO2009052425A1 (en) | 2007-10-17 | 2009-04-23 | Neuronexus Technologies | Implantable device including a resorbable carrier |
| US8565894B2 (en) * | 2007-10-17 | 2013-10-22 | Neuronexus Technologies, Inc. | Three-dimensional system of electrode leads |
| US8224417B2 (en) * | 2007-10-17 | 2012-07-17 | Neuronexus Technologies, Inc. | Guide tube for an implantable device system |
| US8498720B2 (en) | 2008-02-29 | 2013-07-30 | Neuronexus Technologies, Inc. | Implantable electrode and method of making the same |
| US9289142B2 (en) | 2008-03-24 | 2016-03-22 | Neuronexus Technologies, Inc. | Implantable electrode lead system with a three dimensional arrangement and method of making the same |
| US20090240314A1 (en) * | 2008-03-24 | 2009-09-24 | Kong K C | Implantable electrode lead system with a three dimensional arrangement and method of making the same |
| JP2012507417A (ja) * | 2008-10-31 | 2012-03-29 | フジフィルム ディマティックス， インコーポレイテッド | ノズル噴出口成形 |
| US8197029B2 (en) * | 2008-12-30 | 2012-06-12 | Fujifilm Corporation | Forming nozzles |
| WO2011046665A1 (en) * | 2009-10-16 | 2011-04-21 | Neuronexus Technologies | Neural interface system |
| US8870857B2 (en) * | 2009-11-05 | 2014-10-28 | Greatbatch Ltd. | Waveguide neural interface device |
| US9155861B2 (en) | 2010-09-20 | 2015-10-13 | Neuronexus Technologies, Inc. | Neural drug delivery system with fluidic threads |
| JP6901446B2 (ja) | 2018-09-03 | 2021-07-14 | 株式会社東芝 | 無線通信装置、無線通信システム、無線通信方法及びプログラム |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2665946A (en) * | 1951-05-29 | 1954-01-12 | Arthur E Broughton | Spray nozzle |
| US2834635A (en) * | 1955-06-22 | 1958-05-13 | Muellermist Irrigation Co | Liquid spray device |
| US2987262A (en) * | 1959-11-24 | 1961-06-06 | Lodding Engineering Corp | Removable and replaceable shower device |
| NL272692A (da) * | 1960-12-30 | |||
| US3211088A (en) * | 1962-05-04 | 1965-10-12 | Sperry Rand Corp | Exponential horn printer |
| JPS5040616B1 (da) * | 1970-03-18 | 1975-12-25 | ||
| US3655530A (en) * | 1970-06-15 | 1972-04-11 | Mead Corp | Fabrication of orifices |
| US3742230A (en) * | 1972-06-29 | 1973-06-26 | Massachusetts Inst Technology | Soft x-ray mask support substrate |
-
1974
- 1974-12-31 US US537799A patent/US3921916A/en not_active Expired - Lifetime
-
1975
- 1975-10-15 JP JP12333875A patent/JPS5516070B2/ja not_active Expired
- 1975-10-27 GB GB43997/75A patent/GB1492465A/en not_active Expired
- 1975-10-31 IT IT28866/75A patent/IT1054354B/it active
- 1975-11-21 CA CA240,350A patent/CA1037519A/en not_active Expired
- 1975-11-21 FR FR7536645A patent/FR2296504A1/fr active Granted
- 1975-12-10 DE DE2555462A patent/DE2555462C2/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5184641A (da) | 1976-07-24 |
| JPS5516070B2 (da) | 1980-04-28 |
| US3921916A (en) | 1975-11-25 |
| DE2555462C2 (de) | 1982-06-03 |
| GB1492465A (en) | 1977-11-23 |
| FR2296504A1 (fr) | 1976-07-30 |
| DE2555462A1 (de) | 1976-07-08 |
| FR2296504B1 (da) | 1978-05-12 |
| IT1054354B (it) | 1981-11-10 |
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