CA1007763A - Implantation of ions into a metal electrode - Google Patents
Implantation of ions into a metal electrodeInfo
- Publication number
- CA1007763A CA1007763A CA202,285A CA202285A CA1007763A CA 1007763 A CA1007763 A CA 1007763A CA 202285 A CA202285 A CA 202285A CA 1007763 A CA1007763 A CA 1007763A
- Authority
- CA
- Canada
- Prior art keywords
- implantation
- ions
- metal electrode
- electrode
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/30—Diffusion for doping of conductive or resistive layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/91—Controlling charging state at semiconductor-insulator interface
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US375278A US3871067A (en) | 1973-06-29 | 1973-06-29 | Method of manufacturing a semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1007763A true CA1007763A (en) | 1977-03-29 |
Family
ID=23480240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA202,285A Expired CA1007763A (en) | 1973-06-29 | 1974-06-12 | Implantation of ions into a metal electrode |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3871067A (enExample) |
| JP (1) | JPS5324300B2 (enExample) |
| CA (1) | CA1007763A (enExample) |
| DE (1) | DE2422120C3 (enExample) |
| FR (1) | FR2235483B1 (enExample) |
| GB (1) | GB1424959A (enExample) |
| IT (1) | IT1012364B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51123562A (en) * | 1975-04-21 | 1976-10-28 | Sony Corp | Production method of semiconductor device |
| US4062720A (en) * | 1976-08-23 | 1977-12-13 | International Business Machines Corporation | Process for forming a ledge-free aluminum-copper-silicon conductor structure |
| US4313768A (en) * | 1978-04-06 | 1982-02-02 | Harris Corporation | Method of fabricating improved radiation hardened self-aligned CMOS having Si doped Al field gate |
| US4402002A (en) * | 1978-04-06 | 1983-08-30 | Harris Corporation | Radiation hardened-self aligned CMOS and method of fabrication |
| US4263605A (en) * | 1979-01-04 | 1981-04-21 | The United States Of America As Represented By The Secretary Of The Navy | Ion-implanted, improved ohmic contacts for GaAs semiconductor devices |
| US4412376A (en) * | 1979-03-30 | 1983-11-01 | Ibm Corporation | Fabrication method for vertical PNP structure with Schottky barrier diode emitter utilizing ion implantation |
| JPS5723221A (en) * | 1980-07-16 | 1982-02-06 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| US4373966A (en) * | 1981-04-30 | 1983-02-15 | International Business Machines Corporation | Forming Schottky barrier diodes by depositing aluminum silicon and copper or binary alloys thereof and alloy-sintering |
| GB2107744B (en) * | 1981-10-06 | 1985-07-24 | Itt Ind Ltd | Making al/si films by ion implantation; integrated circuits |
| JPS58186967A (ja) * | 1982-04-26 | 1983-11-01 | Toshiba Corp | 薄膜半導体装置の製造方法 |
| JPH0750696B2 (ja) * | 1987-12-14 | 1995-05-31 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JPH0750697B2 (ja) * | 1989-02-20 | 1995-05-31 | 株式会社東芝 | 半導体装置の製造方法 |
| KR0161116B1 (ko) * | 1995-01-06 | 1999-02-01 | 문정환 | 반도체 장치의 금속층 형성방법 |
| WO2008073400A1 (en) | 2006-12-11 | 2008-06-19 | The Regents Of The University Of California | Transparent light emitting diodes |
| US11738813B2 (en) | 2016-11-01 | 2023-08-29 | Loc Performance Products, Llc | Urethane hybrid agricultural vehicle track |
| US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
| US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3382568A (en) * | 1965-07-22 | 1968-05-14 | Ibm | Method for providing electrical connections to semiconductor devices |
| US3600797A (en) * | 1967-12-26 | 1971-08-24 | Hughes Aircraft Co | Method of making ohmic contacts to semiconductor bodies by indirect ion implantation |
| BE759058A (enExample) * | 1969-11-19 | 1971-05-17 | Philips Nv | |
| US3620851A (en) * | 1969-12-04 | 1971-11-16 | William J King | Method for making a buried layer semiconductor device |
| US3682729A (en) * | 1969-12-30 | 1972-08-08 | Ibm | Method of changing the physical properties of a metallic film by ion beam formation and devices produced thereby |
-
1973
- 1973-06-29 US US375278A patent/US3871067A/en not_active Expired - Lifetime
-
1974
- 1974-04-24 GB GB1799074A patent/GB1424959A/en not_active Expired
- 1974-05-08 DE DE2422120A patent/DE2422120C3/de not_active Expired
- 1974-05-15 FR FR7417747A patent/FR2235483B1/fr not_active Expired
- 1974-05-15 IT IT22719/74A patent/IT1012364B/it active
- 1974-05-17 JP JP5462774A patent/JPS5324300B2/ja not_active Expired
- 1974-06-12 CA CA202,285A patent/CA1007763A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2235483B1 (enExample) | 1978-11-17 |
| DE2422120C3 (de) | 1982-03-25 |
| JPS5024080A (enExample) | 1975-03-14 |
| DE2422120A1 (de) | 1975-01-23 |
| IT1012364B (it) | 1977-03-10 |
| US3871067A (en) | 1975-03-18 |
| JPS5324300B2 (enExample) | 1978-07-20 |
| GB1424959A (en) | 1976-02-11 |
| FR2235483A1 (enExample) | 1975-01-24 |
| DE2422120B2 (de) | 1981-07-02 |
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