BRPI0911753A2 - resinas epóxi e materiais de compósito com propriedades de queima melhoradas. - Google Patents

resinas epóxi e materiais de compósito com propriedades de queima melhoradas.

Info

Publication number
BRPI0911753A2
BRPI0911753A2 BRPI0911753A BRPI0911753A BRPI0911753A2 BR PI0911753 A2 BRPI0911753 A2 BR PI0911753A2 BR PI0911753 A BRPI0911753 A BR PI0911753A BR PI0911753 A BRPI0911753 A BR PI0911753A BR PI0911753 A2 BRPI0911753 A2 BR PI0911753A2
Authority
BR
Brazil
Prior art keywords
epoxy resins
composite materials
burning properties
improved burning
improved
Prior art date
Application number
BRPI0911753A
Other languages
English (en)
Inventor
Yen-Seine Wang
Yi-Jui Wu
Original Assignee
Hexcel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/287,202 external-priority patent/US8039109B2/en
Application filed by Hexcel Corp filed Critical Hexcel Corp
Publication of BRPI0911753A2 publication Critical patent/BRPI0911753A2/pt
Publication of BRPI0911753B1 publication Critical patent/BRPI0911753B1/pt
Publication of BRPI0911753B8 publication Critical patent/BRPI0911753B8/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046Polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254Polymeric or resinous material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
BRPI0911753A 2008-10-07 2009-09-30 compósitos de resinas epóxi e materiais com propriedades de baixa flamabilidade BRPI0911753B8 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/287,202 US8039109B2 (en) 2008-10-07 2008-10-07 Epoxy resins with improved burn properties
US12/287,202 2008-10-07
US12/569,817 US8034453B2 (en) 2008-10-07 2009-09-29 Composite materials with improved burn properties
US11/569,817 2009-09-29
PCT/US2009/059088 WO2010042369A1 (en) 2008-10-07 2009-09-30 Epoxy resins and composite materials with improved burn properties

Publications (3)

Publication Number Publication Date
BRPI0911753A2 true BRPI0911753A2 (pt) 2015-10-06
BRPI0911753B1 BRPI0911753B1 (pt) 2020-03-24
BRPI0911753B8 BRPI0911753B8 (pt) 2020-11-03

Family

ID=41362784

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0911753A BRPI0911753B8 (pt) 2008-10-07 2009-09-30 compósitos de resinas epóxi e materiais com propriedades de baixa flamabilidade

Country Status (8)

Country Link
US (1) US8034453B2 (pt)
EP (1) EP2334711B1 (pt)
JP (1) JP5478628B2 (pt)
CN (1) CN102177187B (pt)
BR (1) BRPI0911753B8 (pt)
ES (1) ES2465518T3 (pt)
RU (1) RU2494126C2 (pt)
WO (1) WO2010042369A1 (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8283408B2 (en) 2010-02-26 2012-10-09 Hexcel Corporation Thermoplastic-toughened cyanate ester resin composites with low heat release properties
US8470923B2 (en) 2010-04-21 2013-06-25 Hexcel Corporation Composite material for structural applications
US8686069B2 (en) * 2010-10-12 2014-04-01 Hexcel Corporation Solvent resistance of epoxy resins toughened with polyethersulfone
US9068040B2 (en) * 2010-10-12 2015-06-30 Hexcel Corporation Solvent resistant thermoplastic toughened epoxy
CN103380161B (zh) * 2011-02-16 2016-04-20 三菱丽阳株式会社 获得纤维强化复合材料的制造方法及其所使用的环氧树脂组合物
US9359078B2 (en) * 2012-03-28 2016-06-07 B/E Aerospace, Inc. Aircraft galley monument structure
CN104364290B (zh) * 2012-06-08 2016-09-07 Adeka株式会社 固化性树脂组合物、树脂组合物、树脂片、及这些组合物和树脂片的固化物
CN102942765A (zh) * 2012-10-24 2013-02-27 中国航空工业集团公司北京航空材料研究院 一种用热熔法制备高韧环氧树脂基体的方法
RU2547506C1 (ru) * 2013-10-02 2015-04-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Российский химико-технологический университет им. Д.И. Менделеева (РХТУ им. Д.И. Менделеева) Эпоксидное связующее для армированных пластиков
JP6686763B2 (ja) * 2016-07-25 2020-04-22 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
US10710348B2 (en) * 2017-07-26 2020-07-14 The Boeing Company Methods and apparatus to increase fire resistance and fracture toughness of a composite structure
JP7297414B2 (ja) * 2018-06-20 2023-06-26 住友化学株式会社 エポキシ樹脂組成物、プリプレグおよび成形体
CN113248760A (zh) * 2020-02-07 2021-08-13 开封大学 一种制备耐温型复合材料用碳纤维预浸料制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4957801A (en) * 1989-05-17 1990-09-18 American Cyanamid Company Advance composites with thermoplastic particles at the interface between layers
EP0487452A3 (en) 1990-11-19 1993-04-28 Ciba-Geigy Ag Curable epoxy resin composition
US5268223A (en) * 1991-05-31 1993-12-07 Amoco Corporation Toughened fiber-reinforced composites
JPH0741575A (ja) * 1993-07-30 1995-02-10 Toray Ind Inc プリプレグおよび繊維強化複合材料
WO1996017006A1 (fr) * 1994-12-02 1996-06-06 Toray Industries, Inc. Preimpregne et materiau composite renforces par des fibres
WO2001055277A1 (fr) * 2000-01-19 2001-08-02 Hitachi Chemical Co., Ltd. Film adhesif pour semi-conducteurs grille de connexion a film adhesif pour semi-conducteurs et dispositif semi-conducteur les utilisant
JP2003231227A (ja) * 2002-02-07 2003-08-19 Sumitomo Bakelite Co Ltd 耐熱性多層シート及びフレキシブル回路基板用補強板
TWI335347B (en) 2003-05-27 2011-01-01 Ajinomoto Kk Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
JP2005122275A (ja) * 2003-10-14 2005-05-12 Canon Inc 情報処理装置及び方法及びプログラム
EP1621323A1 (en) * 2004-07-27 2006-02-01 Hexcel Composites GmbH Continuous pultrusion process for producing high performance structural profiles
RU2307136C1 (ru) * 2006-03-01 2007-09-27 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Эпоксидное связующее, препрег на его основе и изделие, выполненное из препрега
JP2008007682A (ja) * 2006-06-30 2008-01-17 Toray Ind Inc エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
GB0717507D0 (en) * 2007-09-07 2007-10-17 Cytec Tech Corp Composite materials and their use

Also Published As

Publication number Publication date
CN102177187B (zh) 2013-05-29
CN102177187A (zh) 2011-09-07
WO2010042369A1 (en) 2010-04-15
BRPI0911753B8 (pt) 2020-11-03
JP5478628B2 (ja) 2014-04-23
RU2494126C2 (ru) 2013-09-27
JP2012505267A (ja) 2012-03-01
BRPI0911753B1 (pt) 2020-03-24
EP2334711A1 (en) 2011-06-22
RU2011117933A (ru) 2012-11-20
US20100087587A1 (en) 2010-04-08
EP2334711B1 (en) 2014-03-26
ES2465518T3 (es) 2014-06-06
US8034453B2 (en) 2011-10-11

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 24/03/2020, OBSERVADAS AS CONDICOES LEGAIS.

B16C Correction of notification of the grant [chapter 16.3 patent gazette]

Free format text: REFERENTE AO DESPACHO 16.1 PUBLICADO NA RPI 2568 DE 24.03.2020, QUANTO AO NUMERO DA PRIORIDADE

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2690 DE 26-07-2022 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.