BRPI0811751A2 - Processos para produzir folhas de metal revestidas com polímero, e para produzir um suporte revestido com metal, e, uso da folha de metal revestida com polímero - Google Patents

Processos para produzir folhas de metal revestidas com polímero, e para produzir um suporte revestido com metal, e, uso da folha de metal revestida com polímero

Info

Publication number
BRPI0811751A2
BRPI0811751A2 BRPI0811751-9A2A BRPI0811751A BRPI0811751A2 BR PI0811751 A2 BRPI0811751 A2 BR PI0811751A2 BR PI0811751 A BRPI0811751 A BR PI0811751A BR PI0811751 A2 BRPI0811751 A2 BR PI0811751A2
Authority
BR
Brazil
Prior art keywords
metal
polymer coated
processes
produce
coated metal
Prior art date
Application number
BRPI0811751-9A2A
Other languages
English (en)
Inventor
Rene Lochtman
Juergen Kaczun
Norbert Wagner
Juergen Pfister
Dieter Hentschel
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of BRPI0811751A2 publication Critical patent/BRPI0811751A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B05D1/286—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers using a temporary backing to which the coating has been applied
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
    • B05D3/101—Pretreatment of polymeric substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/56—Three layers or more
    • B05D7/57—Three layers or more the last layer being a clear coat
    • B05D7/577—Three layers or more the last layer being a clear coat some layers being coated "wet-on-wet", the others not
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2350/00—Pretreatment of the substrate
    • B05D2350/30—Change of the surface
    • B05D2350/33—Roughening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0092—Metallizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
BRPI0811751-9A2A 2007-05-24 2008-05-20 Processos para produzir folhas de metal revestidas com polímero, e para produzir um suporte revestido com metal, e, uso da folha de metal revestida com polímero BRPI0811751A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07108828 2007-05-24
PCT/EP2008/056160 WO2008142070A2 (de) 2007-05-24 2008-05-20 Verfahren zur herstellung von polymerbeschichteten metallfolien sowie verwendung davon

Publications (1)

Publication Number Publication Date
BRPI0811751A2 true BRPI0811751A2 (pt) 2014-11-11

Family

ID=40032217

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0811751-9A2A BRPI0811751A2 (pt) 2007-05-24 2008-05-20 Processos para produzir folhas de metal revestidas com polímero, e para produzir um suporte revestido com metal, e, uso da folha de metal revestida com polímero

Country Status (11)

Country Link
US (1) US20100170626A1 (pt)
EP (1) EP2163146A2 (pt)
JP (1) JP2010528181A (pt)
KR (1) KR20100017927A (pt)
CN (1) CN101682996A (pt)
BR (1) BRPI0811751A2 (pt)
CA (1) CA2686000A1 (pt)
IL (1) IL201857A0 (pt)
RU (1) RU2009147814A (pt)
TW (1) TW200909076A (pt)
WO (1) WO2008142070A2 (pt)

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WO2009135780A1 (en) * 2008-05-08 2009-11-12 Basf Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
KR20120137481A (ko) * 2010-02-16 2012-12-21 바스프 에스이 시드 층을 인쇄하기 위한 조성물 및 전도체 트랙을 제조하기 위한 방법
US8895651B2 (en) 2010-02-16 2014-11-25 Basf Se Composition for printing a seed layer and process for producing conductor tracks
CN102071411B (zh) * 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
US9387511B1 (en) * 2012-04-15 2016-07-12 Cleanlogix Llc Particle-plasma ablation process for polymeric ophthalmic substrate surface
JP2013234345A (ja) * 2012-05-07 2013-11-21 Denshi Giken Co Ltd メッキ方法およびメッキ配線
CN102821565A (zh) * 2012-07-31 2012-12-12 深圳光启创新技术有限公司 一种电子设备及其壳体
CN102821570A (zh) * 2012-07-31 2012-12-12 深圳光启创新技术有限公司 电子设备及其壳体
CA2916516A1 (en) * 2013-06-28 2014-12-31 Graphene 3D Lab Inc. Dispersions for nanoplatelets of graphene-like materials
US10611098B2 (en) 2014-01-17 2020-04-07 G6 Materials Corp. Fused filament fabrication using multi-segment filament
TWI491683B (zh) * 2014-02-24 2015-07-11 石墨烯複合塗層
WO2015183304A1 (en) * 2014-05-30 2015-12-03 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
CN106663510B (zh) 2014-08-08 2019-05-03 东莞令特电子有限公司 具有多层涂层的变阻器以及制造方法
CA2959163C (en) 2014-09-02 2023-02-14 Graphene 3D Lab Inc. Electrochemical devices comprising nanoscopic carbon materials made by additive manufacturing
US11097492B2 (en) 2015-03-02 2021-08-24 G6 Materials Corp. Thermoplastic composites comprising water-soluble PEO graft polymers useful for 3-dimensional additive manufacturing
CN106311565A (zh) * 2015-06-30 2017-01-11 富钰精密组件（昆山）有限公司 金属与非导电材料的复合体的静电喷涂方法及壳体
US11591467B2 (en) 2015-07-29 2023-02-28 G6 Materials Corp. Thermoplastic polymer composites and methods for preparing, collecting, and tempering 3D printable materials and articles from same
US10689548B2 (en) * 2017-01-20 2020-06-23 Polyonics, Inc. Electrostatic dissipative surface coating and high temperature label employing same
EP3354629A1 (en) * 2017-01-31 2018-08-01 Centre National De La Recherche Scientifique Material having a metal layer and a process for preparing this material
US10392515B2 (en) * 2017-08-25 2019-08-27 Ppg Industries Ohio, Inc. Metal cans coated with shellac-containing coatings
WO2019171985A1 (ja) * 2018-03-06 2019-09-12 日産化学株式会社 高分子及び金属微粒子を含む無電解めっき下地剤
CN110871610B (zh) * 2018-08-30 2022-01-07 深圳市昱谷科技有限公司 碳纳米管复合材料覆铜板
US11453204B2 (en) * 2019-09-10 2022-09-27 Advanced Copper Foil Inc. Poly-supported copper foil
EP4200452A1 (en) 2020-08-18 2023-06-28 Enviro Metals, LLC Metal refinement
CN113529013B (zh) * 2021-06-21 2023-02-10 复旦大学 一种利用金属胶带解理二维材料的方法
DE102022120646A1 (de) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung

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Also Published As

Publication number Publication date
WO2008142070A2 (de) 2008-11-27
TW200909076A (en) 2009-03-01
IL201857A0 (en) 2010-06-16
KR20100017927A (ko) 2010-02-16
US20100170626A1 (en) 2010-07-08
CA2686000A1 (en) 2008-11-27
JP2010528181A (ja) 2010-08-19
CN101682996A (zh) 2010-03-24
WO2008142070A3 (de) 2009-04-09
EP2163146A2 (de) 2010-03-17
RU2009147814A (ru) 2011-06-27

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B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]