BRPI0510424A - processo para produção de placas de circuitos impressos e/ou constructos correspondentes - Google Patents
processo para produção de placas de circuitos impressos e/ou constructos correspondentesInfo
- Publication number
- BRPI0510424A BRPI0510424A BRPI0510424-6A BRPI0510424A BRPI0510424A BR PI0510424 A BRPI0510424 A BR PI0510424A BR PI0510424 A BRPI0510424 A BR PI0510424A BR PI0510424 A BRPI0510424 A BR PI0510424A
- Authority
- BR
- Brazil
- Prior art keywords
- printed circuit
- circuit boards
- producing printed
- connections
- corresponding constructs
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conveying And Assembling Of Building Elements In Situ (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
PROCESSO PARA A PRODUçãO DE PLACAS DE CIRCUITOS IMPRESSOS E/OU CONSTRUCTOS CORRESPONDENTES A presente invenção refere-se a um processo simplificado e económico para a produção de placas de circuitos impressos e/ou de constructos correspondentes, que apresentam pontos onde são concretizados contatos transversais. Um processo desse tipo prescinde de um processo de escavação muito complexo e emprega exclusivamente variantes de laca económicas. Apesar disso, consegue-se adicionalmente que outras tiras condutoras ou camadas correspondentes possam ser conduzidas não apenas até os contatos transversais, como também até mesmo além delas sem dificuldades.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004021062A DE102004021062A1 (de) | 2004-04-29 | 2004-04-29 | Verfahren zur Herstellung von Leiterplatten und/oder entsprechenden Konstrukten |
PCT/EP2005/050919 WO2005107342A1 (de) | 2004-04-29 | 2005-03-02 | Verfahren zur herstellung von leiterplatten und/oder entsprechenden konstrukten |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0510424A true BRPI0510424A (pt) | 2007-10-30 |
BRPI0510424B1 BRPI0510424B1 (pt) | 2018-09-18 |
Family
ID=34961742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0510424A BRPI0510424B1 (pt) | 2004-04-29 | 2005-03-02 | processo para a produção de placas de circuitos impressos e/ou estruturas correspondentes |
Country Status (9)
Country | Link |
---|---|
US (1) | US20070209202A1 (pt) |
EP (1) | EP1741322B1 (pt) |
JP (1) | JP2007535143A (pt) |
KR (1) | KR20070004828A (pt) |
CN (1) | CN1951160A (pt) |
AT (1) | ATE377927T1 (pt) |
BR (1) | BRPI0510424B1 (pt) |
DE (2) | DE102004021062A1 (pt) |
WO (1) | WO2005107342A1 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011504250A (ja) | 2007-11-21 | 2011-02-03 | エルジー エレクトロニクス インコーポレイティド | 信号処理方法及び装置 |
CN106304691A (zh) * | 2015-05-29 | 2017-01-04 | 深圳华祥荣正电子有限公司 | Hdi板及其制造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60219795A (ja) * | 1984-04-16 | 1985-11-02 | 日本電気株式会社 | 多層印刷配線板 |
US5001605A (en) * | 1988-11-30 | 1991-03-19 | Hughes Aircraft Company | Multilayer printed wiring board with single layer vias |
JPH02230792A (ja) * | 1989-03-03 | 1990-09-13 | Cmk Corp | プリント配線板の製造方法におけるソルダランドの形成方法 |
US5243142A (en) * | 1990-08-03 | 1993-09-07 | Hitachi Aic Inc. | Printed wiring board and process for producing the same |
JP3057766B2 (ja) * | 1990-12-18 | 2000-07-04 | 日本ケミコン株式会社 | 厚膜多層回路基板及びその製造方法 |
JPH06275959A (ja) * | 1993-03-22 | 1994-09-30 | Hitachi Ltd | 多層配線基板とその製造方法および両面プリント配線板の製造方法 |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
JP2889516B2 (ja) * | 1995-09-08 | 1999-05-10 | 株式会社ダイワ工業 | 多層配線基板の製造方法 |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
JPH09214136A (ja) * | 1996-01-31 | 1997-08-15 | Sony Corp | 多層回路基板 |
US6015520A (en) * | 1997-05-15 | 2000-01-18 | International Business Machines Corporation | Method for filling holes in printed wiring boards |
JPH11214830A (ja) * | 1998-01-22 | 1999-08-06 | Mitsui High Tec Inc | サブストレ−トの製造方法 |
US6407345B1 (en) * | 1998-05-19 | 2002-06-18 | Ibiden Co., Ltd. | Printed circuit board and method of production thereof |
JP4052434B2 (ja) * | 2001-02-05 | 2008-02-27 | Tdk株式会社 | 多層基板及びその製造方法 |
JP4863557B2 (ja) * | 2001-03-07 | 2012-01-25 | イビデン株式会社 | 多層プリント配線板の製造方法 |
EP1371275A1 (de) * | 2001-03-22 | 2003-12-17 | Siemens Aktiengesellschaft | Schaltungsträgerelement für elektronische geräte, insbesondere kommunikationsendgeräte |
DE10121673A1 (de) * | 2001-05-04 | 2002-11-07 | Thomson Brandt Gmbh | Gedruckte Leiterplatte |
EP1302247A1 (en) * | 2001-10-11 | 2003-04-16 | G.I.T. Co., Ltd. | Device for plugging holes in printed circuit boards |
-
2004
- 2004-04-29 DE DE102004021062A patent/DE102004021062A1/de not_active Withdrawn
-
2005
- 2005-03-02 DE DE502005001898T patent/DE502005001898D1/de active Active
- 2005-03-02 JP JP2007508887A patent/JP2007535143A/ja active Pending
- 2005-03-02 BR BRPI0510424A patent/BRPI0510424B1/pt active IP Right Grant
- 2005-03-02 CN CNA2005800135648A patent/CN1951160A/zh active Pending
- 2005-03-02 EP EP05716880A patent/EP1741322B1/de active Active
- 2005-03-02 KR KR1020067021172A patent/KR20070004828A/ko not_active Application Discontinuation
- 2005-03-02 US US10/599,901 patent/US20070209202A1/en not_active Abandoned
- 2005-03-02 AT AT05716880T patent/ATE377927T1/de not_active IP Right Cessation
- 2005-03-02 WO PCT/EP2005/050919 patent/WO2005107342A1/de active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2007535143A (ja) | 2007-11-29 |
WO2005107342A1 (de) | 2005-11-10 |
US20070209202A1 (en) | 2007-09-13 |
ATE377927T1 (de) | 2007-11-15 |
DE502005001898D1 (de) | 2007-12-20 |
KR20070004828A (ko) | 2007-01-09 |
CN1951160A (zh) | 2007-04-18 |
BRPI0510424B1 (pt) | 2018-09-18 |
EP1741322B1 (de) | 2007-11-07 |
EP1741322A1 (de) | 2007-01-10 |
DE102004021062A1 (de) | 2005-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 18/09/2018, OBSERVADAS AS CONDICOES LEGAIS. |