BRPI0503903A - cámara de corrosão portátil - Google Patents

cámara de corrosão portátil

Info

Publication number
BRPI0503903A
BRPI0503903A BRPI0503903-7A BRPI0503903A BRPI0503903A BR PI0503903 A BRPI0503903 A BR PI0503903A BR PI0503903 A BRPI0503903 A BR PI0503903A BR PI0503903 A BRPI0503903 A BR PI0503903A
Authority
BR
Brazil
Prior art keywords
corrosion
chamber
portable
substrate
mems substrate
Prior art date
Application number
BRPI0503903-7A
Other languages
English (en)
Inventor
William J Cummings
Brian W Arbuckle
Philip D Floyd
Original Assignee
Idc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc filed Critical Idc Llc
Publication of BRPI0503903A publication Critical patent/BRPI0503903A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67069Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

"CáMARA DE CORROSãO PORTáTIL". Uma câmara de corrosão é configurada para suportar um substrato de MEMS no interior da câmara. A câmara de corrosão está configurada para se movimentar e atar, de forma fácil, a uma estação de corrosão que inclui uma fonte de vapor ou decapante gasoso, uma fonte de gás de purga e/ou uma fonte de vácuo. A câmara de corrosão portátil pode facilitar um processo para corrosão do substrato de MEMS ali contido. Como exemplo, um substrato MEMS em tal câmara de corrosão pode ser corroído por conexão da câmara em uma estação de corrosão e exposição do substrato MEMS a um decapante de modo a corroer o substrato MENS. O substrato pode ser movimentado para a ou da estação de corrosão dentro da câmara de corrosão portátil. Em modalidades preferidas, o substrato MEMS é um modulador interferométrico e o decapante é o XeF~ 2~.
BRPI0503903-7A 2004-09-27 2005-09-27 cámara de corrosão portátil BRPI0503903A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61341704P 2004-09-27 2004-09-27
US11/045,588 US20060065366A1 (en) 2004-09-27 2005-01-28 Portable etch chamber

Publications (1)

Publication Number Publication Date
BRPI0503903A true BRPI0503903A (pt) 2006-05-09

Family

ID=35197914

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0503903-7A BRPI0503903A (pt) 2004-09-27 2005-09-27 cámara de corrosão portátil

Country Status (11)

Country Link
US (1) US20060065366A1 (pt)
EP (1) EP1641027A2 (pt)
JP (1) JP2006099055A (pt)
KR (1) KR20060087379A (pt)
AU (1) AU2005203283A1 (pt)
BR (1) BRPI0503903A (pt)
CA (1) CA2514350A1 (pt)
MX (1) MXPA05009545A (pt)
RU (1) RU2005129925A (pt)
SG (1) SG121043A1 (pt)
TW (1) TW200626480A (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI569322B (zh) * 2009-12-02 2017-02-01 史畢茲科技公司 高選擇性蝕刻系統與方法
US10029908B1 (en) * 2016-12-30 2018-07-24 Texas Instruments Incorporated Dielectric cladding of microelectromechanical systems (MEMS) elements for improved reliability

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US534846A (en) * 1895-02-26 Frederick j
US4377324A (en) * 1980-08-04 1983-03-22 Honeywell Inc. Graded index Fabry-Perot optical filter device
US4571603A (en) * 1981-11-03 1986-02-18 Texas Instruments Incorporated Deformable mirror electrostatic printer
US4500171A (en) * 1982-06-02 1985-02-19 Texas Instruments Incorporated Process for plastic LCD fill hole sealing
US4566935A (en) * 1984-07-31 1986-01-28 Texas Instruments Incorporated Spatial light modulator and method
US5096279A (en) * 1984-08-31 1992-03-17 Texas Instruments Incorporated Spatial light modulator and method
US4900136A (en) * 1987-08-11 1990-02-13 North American Philips Corporation Method of metallizing silica-containing gel and solid state light modulator incorporating the metallized gel
DE3735449A1 (de) * 1987-10-20 1989-05-03 Convac Gmbh Fertigungssystem fuer halbleitersubstrate
JP2700903B2 (ja) * 1988-09-30 1998-01-21 シャープ株式会社 液晶表示装置
US4982184A (en) * 1989-01-03 1991-01-01 General Electric Company Electrocrystallochromic display and element
US5287096A (en) * 1989-02-27 1994-02-15 Texas Instruments Incorporated Variable luminosity display system
US5192946A (en) * 1989-02-27 1993-03-09 Texas Instruments Incorporated Digitized color video display system
US5079544A (en) * 1989-02-27 1992-01-07 Texas Instruments Incorporated Standard independent digitized video system
US4900395A (en) * 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
US5381253A (en) * 1991-11-14 1995-01-10 Board Of Regents Of University Of Colorado Chiral smectic liquid crystal optical modulators having variable retardation
US5002631A (en) * 1990-03-09 1991-03-26 At&T Bell Laboratories Plasma etching apparatus and method
CH682523A5 (fr) * 1990-04-20 1993-09-30 Suisse Electronique Microtech Dispositif de modulation de lumière à adressage matriciel.
US5083857A (en) * 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
DE69113150T2 (de) * 1990-06-29 1996-04-04 Texas Instruments Inc Deformierbare Spiegelvorrichtung mit aktualisiertem Raster.
US5099353A (en) * 1990-06-29 1992-03-24 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5192395A (en) * 1990-10-12 1993-03-09 Texas Instruments Incorporated Method of making a digital flexure beam accelerometer
US5602671A (en) * 1990-11-13 1997-02-11 Texas Instruments Incorporated Low surface energy passivation layer for micromechanical devices
CA2063744C (en) * 1991-04-01 2002-10-08 Paul M. Urbanus Digital micromirror device architecture and timing for use in a pulse-width modulated display system
FR2679057B1 (fr) * 1991-07-11 1995-10-20 Morin Francois Structure d'ecran a cristal liquide, a matrice active et a haute definition.
US5179274A (en) * 1991-07-12 1993-01-12 Texas Instruments Incorporated Method for controlling operation of optical systems and devices
US5296950A (en) * 1992-01-31 1994-03-22 Texas Instruments Incorporated Optical signal free-space conversion board
US5312513A (en) * 1992-04-03 1994-05-17 Texas Instruments Incorporated Methods of forming multiple phase light modulators
JPH07508856A (ja) * 1992-04-08 1995-09-28 ジョージア テック リサーチ コーポレイション 成長基板から薄膜材料をリフトオフするためのプロセス
TW245772B (pt) * 1992-05-19 1995-04-21 Akzo Nv
JPH0651250A (ja) * 1992-05-20 1994-02-25 Texas Instr Inc <Ti> モノリシックな空間的光変調器およびメモリのパッケージ
US5818095A (en) * 1992-08-11 1998-10-06 Texas Instruments Incorporated High-yield spatial light modulator with light blocking layer
US5293272A (en) * 1992-08-24 1994-03-08 Physical Optics Corporation High finesse holographic fabry-perot etalon and method of fabricating
US6674562B1 (en) * 1994-05-05 2004-01-06 Iridigm Display Corporation Interferometric modulation of radiation
US5489952A (en) * 1993-07-14 1996-02-06 Texas Instruments Incorporated Method and device for multi-format television
US5497197A (en) * 1993-11-04 1996-03-05 Texas Instruments Incorporated System and method for packaging data into video processor
US5500761A (en) * 1994-01-27 1996-03-19 At&T Corp. Micromechanical modulator
JPH07253594A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 表示装置
US6680792B2 (en) * 1994-05-05 2004-01-20 Iridigm Display Corporation Interferometric modulation of radiation
US7550794B2 (en) * 2002-09-20 2009-06-23 Idc, Llc Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
US6040937A (en) * 1994-05-05 2000-03-21 Etalon, Inc. Interferometric modulation
US7460291B2 (en) * 1994-05-05 2008-12-02 Idc, Llc Separable modulator
US6710908B2 (en) * 1994-05-05 2004-03-23 Iridigm Display Corporation Controlling micro-electro-mechanical cavities
US5497172A (en) * 1994-06-13 1996-03-05 Texas Instruments Incorporated Pulse width modulation for spatial light modulator with split reset addressing
US5499062A (en) * 1994-06-23 1996-03-12 Texas Instruments Incorporated Multiplexed memory timing with block reset and secondary memory
US5610624A (en) * 1994-11-30 1997-03-11 Texas Instruments Incorporated Spatial light modulator with reduced possibility of an on state defect
US5726480A (en) * 1995-01-27 1998-03-10 The Regents Of The University Of California Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US5710656A (en) * 1996-07-30 1998-01-20 Lucent Technologies Inc. Micromechanical optical modulator having a reduced-mass composite membrane
US5884083A (en) * 1996-09-20 1999-03-16 Royce; Robert Computer system to compile non-incremental computer source code to execute within an incremental type computer system
DE69806846T2 (de) * 1997-05-08 2002-12-12 Texas Instruments Inc Verbesserungen für räumliche Lichtmodulatoren
US5867302A (en) * 1997-08-07 1999-02-02 Sandia Corporation Bistable microelectromechanical actuator
WO1999023832A1 (en) * 1997-10-31 1999-05-14 Daewoo Electronics Co., Ltd. Method for manufacturing thin film actuated mirror array in an optical projection system
US6028690A (en) * 1997-11-26 2000-02-22 Texas Instruments Incorporated Reduced micromirror mirror gaps for improved contrast ratio
US6180428B1 (en) * 1997-12-12 2001-01-30 Xerox Corporation Monolithic scanning light emitting devices using micromachining
US6016693A (en) * 1998-02-09 2000-01-25 The Regents Of The University Of California Microfabrication of cantilevers using sacrificial templates
US6195196B1 (en) * 1998-03-13 2001-02-27 Fuji Photo Film Co., Ltd. Array-type exposing device and flat type display incorporating light modulator and driving method thereof
JP4074714B2 (ja) * 1998-09-25 2008-04-09 富士フイルム株式会社 アレイ型光変調素子及び平面ディスプレイの駆動方法
US6391675B1 (en) * 1998-11-25 2002-05-21 Raytheon Company Method and apparatus for switching high frequency signals
US6194323B1 (en) * 1998-12-16 2001-02-27 Lucent Technologies Inc. Deep sub-micron metal etch with in-situ hard mask etch
US6335831B2 (en) * 1998-12-18 2002-01-01 Eastman Kodak Company Multilevel mechanical grating device
US6537427B1 (en) * 1999-02-04 2003-03-25 Micron Technology, Inc. Deposition of smooth aluminum films
JP3592136B2 (ja) * 1999-06-04 2004-11-24 キヤノン株式会社 液体吐出ヘッドおよびその製造方法と微小電気機械装置の製造方法
US6201633B1 (en) * 1999-06-07 2001-03-13 Xerox Corporation Micro-electromechanical based bistable color display sheets
WO2003007049A1 (en) * 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
US6351329B1 (en) * 1999-10-08 2002-02-26 Lucent Technologies Inc. Optical attenuator
US6960305B2 (en) * 1999-10-26 2005-11-01 Reflectivity, Inc Methods for forming and releasing microelectromechanical structures
US6993007B2 (en) * 1999-10-27 2006-01-31 Broadcom Corporation System and method for suppressing silence in voice traffic over an asynchronous communication medium
US6531945B1 (en) * 2000-03-10 2003-03-11 Micron Technology, Inc. Integrated circuit inductor with a magnetic core
EP1172681A3 (en) * 2000-07-13 2004-06-09 Creo IL. Ltd. Blazed micro-mechanical light modulator and array thereof
US6853129B1 (en) * 2000-07-28 2005-02-08 Candescent Technologies Corporation Protected substrate structure for a field emission display device
US6522801B1 (en) * 2000-10-10 2003-02-18 Agere Systems Inc. Micro-electro-optical mechanical device having an implanted dopant included therein and a method of manufacture therefor
US6859218B1 (en) * 2000-11-07 2005-02-22 Hewlett-Packard Development Company, L.P. Electronic display devices and methods
US7005314B2 (en) * 2001-06-27 2006-02-28 Intel Corporation Sacrificial layer technique to make gaps in MEMS applications
JP4032216B2 (ja) * 2001-07-12 2008-01-16 ソニー株式会社 光学多層構造体およびその製造方法、並びに光スイッチング素子および画像表示装置
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US7029829B2 (en) * 2002-04-18 2006-04-18 The Regents Of The University Of Michigan Low temperature method for forming a microcavity on a substrate and article having same
US6741377B2 (en) * 2002-07-02 2004-05-25 Iridigm Display Corporation Device having a light-absorbing mask and a method for fabricating same
US7071289B2 (en) * 2002-07-11 2006-07-04 The University Of Connecticut Polymers comprising thieno [3,4-b]thiophene and methods of making and using the same
US20040058531A1 (en) * 2002-08-08 2004-03-25 United Microelectronics Corp. Method for preventing metal extrusion in a semiconductor structure.
US6674033B1 (en) * 2002-08-21 2004-01-06 Ming-Shan Wang Press button type safety switch
TW544787B (en) * 2002-09-18 2003-08-01 Promos Technologies Inc Method of forming self-aligned contact structure with locally etched gate conductive layer
TW557395B (en) * 2003-01-29 2003-10-11 Yen Sun Technology Corp Optical interference type reflection panel and the manufacturing method thereof
TW567355B (en) * 2003-04-21 2003-12-21 Prime View Int Co Ltd An interference display cell and fabrication method thereof
US6829132B2 (en) * 2003-04-30 2004-12-07 Hewlett-Packard Development Company, L.P. Charge control of micro-electromechanical device
US7190380B2 (en) * 2003-09-26 2007-03-13 Hewlett-Packard Development Company, L.P. Generating and displaying spatially offset sub-frames
US7173314B2 (en) * 2003-08-13 2007-02-06 Hewlett-Packard Development Company, L.P. Storage device having a probe and a storage cell with moveable parts
TWI305599B (en) * 2003-08-15 2009-01-21 Qualcomm Mems Technologies Inc Interference display panel and method thereof
TW593127B (en) * 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
TWI231865B (en) * 2003-08-26 2005-05-01 Prime View Int Co Ltd An interference display cell and fabrication method thereof
US20050057442A1 (en) * 2003-08-28 2005-03-17 Olan Way Adjacent display of sequential sub-images
TWI232333B (en) * 2003-09-03 2005-05-11 Prime View Int Co Ltd Display unit using interferometric modulation and manufacturing method thereof
US6982820B2 (en) * 2003-09-26 2006-01-03 Prime View International Co., Ltd. Color changeable pixel
US20050068583A1 (en) * 2003-09-30 2005-03-31 Gutkowski Lawrence J. Organizing a digital image

Also Published As

Publication number Publication date
AU2005203283A1 (en) 2006-04-13
MXPA05009545A (es) 2006-04-18
SG121043A1 (en) 2006-04-26
EP1641027A2 (en) 2006-03-29
CA2514350A1 (en) 2006-03-27
JP2006099055A (ja) 2006-04-13
US20060065366A1 (en) 2006-03-30
RU2005129925A (ru) 2007-04-10
KR20060087379A (ko) 2006-08-02
TW200626480A (en) 2006-08-01

Similar Documents

Publication Publication Date Title
ATE438748T1 (de) Vorrichtung und verfahren zur kontinuierlichen gasphasenabscheidung unter atmosphärendruck und deren verwendung
ATE500348T1 (de) Verfahren und vorrichtung zur plasmagestützten chemischen gasphasenabscheidung an der innenwand eines hohlkörpers
SG155256A1 (en) Immersion liquid, exposure apparatus, and exposure process
DK3219806T3 (da) Fremgangsmåder til nedbrydning eller omdannelse af plantecellevægspolysaccharider
ITRM20080636A1 (it) Procedimento per la produzione di derivati funzionalizzati dell acido ialuronico e relativi idrogeli.
SG168509A1 (en) Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same
MXPA05000879A (es) Superimprimador.
TW200714709A (en) Polymer-stripping composition
BRPI0503893A (pt) método e sistema para corrosão por fluoreto de xenÈnio com eficiência aperfeiçoada
BR112012012236A2 (pt) processo para remover um metal de gasóleo de vácuo
AR058818A1 (es) Composiciones que contienen un polimero funcional de silanol y peliculas de recubrimiento hidrofilicas relacionadas
TW200739268A (en) Antireflection film composition, substrate, and patterning process
BRPI0513252A (pt) agente de revestimento de proteção contra corrosão para componentes de metal e processo para a sua preparação
TW200613543A (en) Aqueous resist stripper composition
BR112018015916A2 (pt) processo de conversão biológica
WO2007012832A3 (en) Aqueous aluminosilicate gel-forming composition
BR112012015192A2 (pt) &#34;proc esso para remover um composto de nitrogênio de um gasóleo em vácuo&#34;
DOP2007000028A (es) Composiciones de ramnolípidos y métodos relacionados con su uso
CO6341648A2 (es) Método y aparato para refinar carbón
BR112012029644A2 (pt) composições de decapagem e métodos de realizar e usar os mesmos
AR068926A1 (es) Metodos y sistemas para recubrir sustratos
BRPI0503903A (pt) cámara de corrosão portátil
BR0116163A (pt) Fotoiniciadores de superfìcie ativa
TW200501255A (en) Method for removal of residue from a substrate
MY177286A (en) Coating compositions and processes for making the same

Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]