BRPI0414090A - unidade de suprimento elétrico e dispositivo para o tratamento eletroquìmico de um material a ser tratado - Google Patents
unidade de suprimento elétrico e dispositivo para o tratamento eletroquìmico de um material a ser tratadoInfo
- Publication number
- BRPI0414090A BRPI0414090A BRPI0414090-7A BRPI0414090A BRPI0414090A BR PI0414090 A BRPI0414090 A BR PI0414090A BR PI0414090 A BRPI0414090 A BR PI0414090A BR PI0414090 A BRPI0414090 A BR PI0414090A
- Authority
- BR
- Brazil
- Prior art keywords
- treated
- electrochemical treatment
- supply unit
- electrical supply
- power supply
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
"UNIDADE DE SUPRIMENTO ELéTRICO E DISPOSITIVO PARA O TRATAMENTO ELETROQUìMICO DE UM MATERIAL A SER TRATADO". De modo que as alimentações elétricas (2, 3) de uma unidade de suprimento elétrico para um material (1) a ser tratado sejam tratadas, em um dispositivo para o tratamento eletroquímico do mesmo, sejam protegidas contra uma deposição de metal, é proposto que pelo menos uma carcaça eletricamente isolante (7, 8) seja provida, a qual envolve pelo menos uma alimentação elétrica (2, 3) por um comprimento em particular começando a partir de meios de contato (12) para a feitura de contato com o material a ser tratado, de modo que nenhum depósito de metal de mais do que 0,04 mm seja formado nas partes não cobertas da alimentação elétrica, quando a alimentação elétrica (2, 3) for imersa até seu comprimento em particular em um líquido, durante o tratamento eletroquímico do material (1) a ser tratado.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10340888.6 | 2003-09-04 | ||
DE10340888A DE10340888B3 (de) | 2003-09-04 | 2003-09-04 | Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung |
PCT/EP2004/009272 WO2005028718A2 (de) | 2003-09-04 | 2004-08-18 | Stromversorgungseinrichtung in einer vorrichtung zur elektrochemischen behandlung |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0414090A true BRPI0414090A (pt) | 2006-10-31 |
BRPI0414090B1 BRPI0414090B1 (pt) | 2015-08-11 |
Family
ID=34352764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0414090-7A BRPI0414090B1 (pt) | 2003-09-04 | 2004-08-18 | Unidade de suprimento elétrico e dispositivo para o tratamento eletroquímico de um material a ser tratado |
Country Status (11)
Country | Link |
---|---|
US (1) | US7815777B2 (pt) |
EP (1) | EP1660701B1 (pt) |
JP (1) | JP4621204B2 (pt) |
KR (1) | KR101120048B1 (pt) |
CN (1) | CN1839221B (pt) |
BR (1) | BRPI0414090B1 (pt) |
DE (1) | DE10340888B3 (pt) |
HK (1) | HK1090959A1 (pt) |
NO (1) | NO20060793L (pt) |
TW (1) | TWI349046B (pt) |
WO (1) | WO2005028718A2 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1032174C2 (nl) * | 2006-07-14 | 2008-01-15 | Elsyca N V | Inrichting geschikt voor het elektrochemisch bewerken van een voorwerp alsmede werkwijze voor het vervaardigen van een dergelijke inrichting, werkwijze voor het elektrochemisch bewerken van een voorwerp met een dergelijke inrichting alsmede voorwerp vervaardigd met een dergelijke werkwijze. |
NL2005480C2 (nl) | 2010-10-07 | 2012-04-11 | Meco Equip Eng | Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat. |
CN102601470A (zh) * | 2012-03-21 | 2012-07-25 | 南京航空航天大学 | 一种管电极电解加工过程稳定性提高方法 |
US20140033762A1 (en) | 2012-08-03 | 2014-02-06 | Air Products And Chemicals, Inc. | Heavy Hydrocarbon Removal From A Natural Gas Stream |
CN104805490A (zh) * | 2015-04-29 | 2015-07-29 | 广汽吉奥汽车有限公司 | 一种电镀单体零件、端部电镀结构及电镀方法 |
TWI692551B (zh) * | 2019-03-04 | 2020-05-01 | 聯策科技股份有限公司 | 不對稱式水封導電夾 |
CN111485276B (zh) * | 2020-06-05 | 2021-10-12 | 厦门通富微电子有限公司 | 一种电镀设备 |
EP4206364A1 (en) | 2022-01-03 | 2023-07-05 | Atotech Deutschland GmbH & Co. KG | Device for gripping a workpiece, method of manufacturing the device, and conveying system and apparatus for electrochemical surface treatment comprising at least one such device |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3616447A (en) * | 1969-01-21 | 1971-10-26 | Eastman Kodak Co | Apparatus for suspending a body in a corrosive solution |
DE3603856C2 (de) * | 1986-02-07 | 1994-05-05 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten |
EP0239736B2 (de) * | 1986-02-28 | 1995-10-25 | Schering Aktiengesellschaft | Langgestreckte Gestelle und zugehörige Teile zum lösbaren Befestigen von zu galvanisierenden Leiterplatten, sowie zugehörige Leiterplatten |
ATE93552T1 (de) * | 1988-07-07 | 1993-09-15 | Siemens Nixdorf Inf Syst | Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. |
DE3839972C1 (pt) * | 1988-11-26 | 1989-12-28 | Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De | |
JPH02118967U (pt) * | 1989-03-10 | 1990-09-25 | ||
DE3939256A1 (de) | 1989-11-28 | 1991-05-29 | Schering Ag | Halte- und kontakteinrichtung fuer in einem elektrolysebad zu behandelnde bauelemente |
JPH0385849U (pt) | 1989-12-19 | 1991-08-30 | ||
DE4211253A1 (de) * | 1992-04-03 | 1993-10-07 | Siemens Ag | Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten |
AT395915B (de) * | 1991-06-27 | 1993-04-26 | Avl Verbrennungskraft Messtech | Innenelektrode einer polarographischen elektrode |
US5223116A (en) * | 1992-05-11 | 1993-06-29 | Siemens Aktiengesellschaft | Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces |
US5405518A (en) * | 1994-04-26 | 1995-04-11 | Industrial Technology Research Institute | Workpiece holder apparatus |
DE19504517C1 (de) * | 1995-02-11 | 1996-08-08 | Atotech Deutschland Gmbh | Verfahren zum Galvanisieren von plattenförmigem Behandlungsgut in horizontalen Durchlaufanlagen sowie Vorrichtung zur Durchführung des Verfahrens |
JPH0931686A (ja) * | 1995-07-21 | 1997-02-04 | Toshiba Corp | 電気メッキ装置および電気メッキ方法 |
US6099712A (en) * | 1997-09-30 | 2000-08-08 | Semitool, Inc. | Semiconductor plating bowl and method using anode shield |
DE19717512C3 (de) | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
DE29708602U1 (de) * | 1997-05-14 | 1997-07-17 | Strecker Guenther | Haltevorrichtung für Tauchgalvanisierung |
WO2000011679A2 (de) | 1998-08-19 | 2000-03-02 | Atotech Deutschland Gmbh | Kontaktelement |
DE19736352C1 (de) | 1997-08-21 | 1998-12-10 | Atotech Deutschland Gmbh | Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen |
DE29721741U1 (de) * | 1997-12-09 | 1998-03-05 | Strecker Guenther | Klammerartige Haltevorrichtung für Tauchgalvanisierung |
US6322678B1 (en) * | 1998-07-11 | 2001-11-27 | Semitool, Inc. | Electroplating reactor including back-side electrical contact apparatus |
US6294060B1 (en) | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
DE10019720A1 (de) * | 2000-04-20 | 2001-10-31 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen |
DE10040935C2 (de) * | 2000-08-19 | 2003-05-15 | Adelwitz Technologie Zentrum G | Verfahren zur galvanischen Beschichtung von Hochtemperatur-Supraleitern mit Cu-Verbindungen |
DE10043815C2 (de) * | 2000-09-06 | 2002-08-08 | Egon Huebel | Verfahren und Vorrichtung zur elektrischen Kontaktierung von zu behandelndem Gut in elektrolytischen Anlagen |
DE10065643C2 (de) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut |
JP3677488B2 (ja) | 2002-05-14 | 2005-08-03 | 丸仲工業株式会社 | 電気メッキ装置におけるクリップ式のワークハンガー |
DE10207941A1 (de) | 2002-02-17 | 2003-09-04 | Egon Huebel | Verfahren und Vorrichtung zur elektrischen Kontaktierung von flachem Gut in elektrolytischen Anlagen |
US7118658B2 (en) * | 2002-05-21 | 2006-10-10 | Semitool, Inc. | Electroplating reactor |
-
2003
- 2003-09-04 DE DE10340888A patent/DE10340888B3/de not_active Expired - Lifetime
-
2004
- 2004-08-18 US US10/570,280 patent/US7815777B2/en active Active
- 2004-08-18 WO PCT/EP2004/009272 patent/WO2005028718A2/de active Application Filing
- 2004-08-18 EP EP04764258.2A patent/EP1660701B1/de active Active
- 2004-08-18 JP JP2006525062A patent/JP4621204B2/ja active Active
- 2004-08-18 BR BRPI0414090-7A patent/BRPI0414090B1/pt active IP Right Grant
- 2004-08-18 CN CN2004800239981A patent/CN1839221B/zh active Active
- 2004-08-18 KR KR1020067004262A patent/KR101120048B1/ko active IP Right Grant
- 2004-08-31 TW TW093126236A patent/TWI349046B/zh active
-
2006
- 2006-02-17 NO NO20060793A patent/NO20060793L/no not_active Application Discontinuation
- 2006-11-16 HK HK06112633.2A patent/HK1090959A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4621204B2 (ja) | 2011-01-26 |
EP1660701B1 (de) | 2015-02-25 |
WO2005028718A3 (de) | 2005-06-09 |
CN1839221A (zh) | 2006-09-27 |
KR20060118424A (ko) | 2006-11-23 |
EP1660701A2 (de) | 2006-05-31 |
DE10340888B3 (de) | 2005-04-21 |
JP2007504359A (ja) | 2007-03-01 |
TW200513547A (en) | 2005-04-16 |
WO2005028718A2 (de) | 2005-03-31 |
KR101120048B1 (ko) | 2012-03-23 |
NO20060793L (no) | 2006-04-04 |
US20070039816A1 (en) | 2007-02-22 |
CN1839221B (zh) | 2011-12-21 |
BRPI0414090B1 (pt) | 2015-08-11 |
HK1090959A1 (en) | 2007-01-05 |
US7815777B2 (en) | 2010-10-19 |
TWI349046B (en) | 2011-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B07A | Technical examination (opinion): publication of technical examination (opinion) [chapter 7.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 11/08/2015, OBSERVADAS AS CONDICOES LEGAIS. |