BR9911279A - Adesivos fundidos a quente à base de poliaminas de longo tempo abertos - Google Patents
Adesivos fundidos a quente à base de poliaminas de longo tempo abertosInfo
- Publication number
- BR9911279A BR9911279A BR9911279-5A BR9911279A BR9911279A BR 9911279 A BR9911279 A BR 9911279A BR 9911279 A BR9911279 A BR 9911279A BR 9911279 A BR9911279 A BR 9911279A
- Authority
- BR
- Brazil
- Prior art keywords
- diamines
- melt adhesives
- long open
- hot
- hot melt
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
- C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/34—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids using polymerised unsaturated fatty acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
- C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Patente de Invenção: <B>"ADESIVOS FUNDIDOS A QUENTE à BASE DE POLIAMIDAS DE LONGO TEMPO ABERTOS"<D>. A presente invenção refere-se a composições de poliamida úteis como adesivos fundidos a quente, que têm um tempo de montagem em aberto muito longo. Uma composição típica da presente invenção compreende o produto de condensação de quantidades substancialmente equimolares de um componente ácido, que consiste, essencialmente, de um ou mais ácidos graxos poliméricos e um ou mais ácidos dicarboxílicos, e um componente amina, que consiste em uma ou mais diaminas alifáticas, em que os grupos amina são ligados a um número ímpar de átomos de carbono na cadeia alifática ou superior a quatro, e uma ou mais diaminas selecionadas do grupo de diaminas e/ ou polioxialquileno diaminas cíclicas. Esses adesivos fundidos a quente combinam longo tempo de montagem em aberto com uma alta resistência à tração.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98110959A EP0965627A1 (en) | 1998-06-16 | 1998-06-16 | Long open time hotmelts based on polyamides |
PCT/EP1999/003901 WO1999066003A1 (en) | 1998-06-16 | 1999-06-05 | Long open time hotmelts based on polyamides |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9911279A true BR9911279A (pt) | 2001-03-13 |
Family
ID=8232127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9911279-5A BR9911279A (pt) | 1998-06-16 | 1999-06-05 | Adesivos fundidos a quente à base de poliaminas de longo tempo abertos |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0965627A1 (pt) |
JP (1) | JP2002518544A (pt) |
KR (1) | KR20010052930A (pt) |
BR (1) | BR9911279A (pt) |
CA (1) | CA2335375A1 (pt) |
WO (1) | WO1999066003A1 (pt) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10022701B4 (de) * | 2000-05-10 | 2006-03-23 | Ems-Chemie Ag | Niedrigschmelzende Copolyamide sowie deren Verwendung als Schmelzklebemittel |
EP1999184B1 (en) * | 2006-03-24 | 2018-11-07 | Henkel IP & Holding GmbH | Polyamides |
EP2094802B1 (de) | 2006-11-29 | 2012-11-21 | Henkel AG & Co. KGaA | Formteile aus schmelzklebstoffen |
US8362125B2 (en) | 2007-04-03 | 2013-01-29 | Henkel Ag & Co. Kgaa | Hot melt adhesive |
EP2298830B1 (de) | 2009-09-18 | 2011-11-09 | Henkel AG & Co. KGaA | Hydrolysestabile Polyamide |
US9771498B2 (en) * | 2009-11-20 | 2017-09-26 | Henkel IP & Holding GmbH | Moisture curable polyamides and methods for using the same |
BR112013020832A2 (pt) * | 2011-02-15 | 2016-10-04 | Dsm Ip Assets Bv | poliamida contendo unidades monoméricas de 1,4-butileno diamina |
CN102492135A (zh) * | 2011-11-30 | 2012-06-13 | 上海天洋热熔胶有限公司 | 一种二聚酸型聚酰胺热熔胶的合成方法 |
JP6024671B2 (ja) * | 2012-01-12 | 2016-11-16 | 三菱瓦斯化学株式会社 | ポリエーテルポリアミドエラストマー |
JP5929419B2 (ja) * | 2012-03-29 | 2016-06-08 | 日立化成株式会社 | 粘着剤組成物、フィルム状粘着剤及び被着体の剥離方法 |
JP6420581B2 (ja) * | 2014-07-15 | 2018-11-07 | 住友電気工業株式会社 | 高流動ポリアミド樹脂 |
WO2016009904A1 (ja) * | 2014-07-15 | 2016-01-21 | 住友電工ファインポリマー株式会社 | 熱収縮チューブ及び熱収縮キャップ並びに電線束の防水方法 |
US11492544B2 (en) | 2016-06-22 | 2022-11-08 | Hexion Inc. | Chemical products for adhesive applications |
MX2018015438A (es) | 2016-06-22 | 2019-04-22 | Hexion Inc | Productos quimicos para aplicaciones adhesivas. |
US10927234B2 (en) * | 2018-01-17 | 2021-02-23 | Kraton Polymers U.S. Llc | PVC plasticizers and methods for making thereof |
KR102211227B1 (ko) * | 2019-11-05 | 2021-02-02 | 실버스타케미칼(주) | 폴리아미드 수지 조성물을 이용한 핫멜트 접착제 |
EP3892246B1 (en) | 2020-04-08 | 2024-06-19 | The Procter & Gamble Company | Method for applying a polymeric composition and absorbent articles comprising such composition |
FR3114815B1 (fr) * | 2020-10-07 | 2023-04-28 | Bostik Sa | Composition polyamide |
FR3125534A1 (fr) * | 2021-07-22 | 2023-01-27 | Bostik Sa | Composition polyamide |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2601376B1 (fr) * | 1986-07-08 | 1988-10-21 | Rhone Poulenc Chimie | Procede de preparation de copolyamides a base d'hexamethylenediamine, d'acide adipique, eventuellement d'au moins un autre diacide carboxylique a chaine courte et acide dimere |
DE3723941A1 (de) * | 1987-07-20 | 1989-02-02 | Henkel Kgaa | Neue polyamide aus dimerisierten fettsaeuren und polyetherharnstoffdiaminen sowie deren verwendung als klebstoffe |
US4853460A (en) * | 1988-03-24 | 1989-08-01 | Union Camp Corporation | Long open assembly time vinyl-bonding polyamide from dimer acid |
US4946933A (en) * | 1989-02-27 | 1990-08-07 | Texaco Chemical Company | Elastomeric polyamide hot melt adhesive from low molecular weight polyoxyethylene diamine |
DE3934825A1 (de) * | 1989-10-19 | 1991-04-25 | Bayer Ag | Polyamidelastomere, ihre herstellung und ihre verwendung |
US5672677A (en) * | 1996-01-12 | 1997-09-30 | The Dexter Corporation | Long open time polyamide compositions |
US5807968A (en) * | 1996-04-04 | 1998-09-15 | Henkel Corporation | Polyamide compositions and related methods |
-
1998
- 1998-06-16 EP EP98110959A patent/EP0965627A1/en not_active Withdrawn
-
1999
- 1999-06-05 BR BR9911279-5A patent/BR9911279A/pt not_active IP Right Cessation
- 1999-06-05 WO PCT/EP1999/003901 patent/WO1999066003A1/en not_active Application Discontinuation
- 1999-06-05 JP JP2000554813A patent/JP2002518544A/ja active Pending
- 1999-06-05 CA CA002335375A patent/CA2335375A1/en not_active Abandoned
- 1999-06-05 KR KR1020007014299A patent/KR20010052930A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO1999066003A1 (en) | 1999-12-23 |
CA2335375A1 (en) | 1999-12-23 |
JP2002518544A (ja) | 2002-06-25 |
KR20010052930A (ko) | 2001-06-25 |
EP0965627A1 (en) | 1999-12-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 5,6,7 E 8A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1911 DE 21/08/2007. |