BR9901119A - Aparelho eletrônico - Google Patents

Aparelho eletrônico

Info

Publication number
BR9901119A
BR9901119A BR9901119-0A BR9901119A BR9901119A BR 9901119 A BR9901119 A BR 9901119A BR 9901119 A BR9901119 A BR 9901119A BR 9901119 A BR9901119 A BR 9901119A
Authority
BR
Brazil
Prior art keywords
housing
recess
heat pipe
evaporator
electronic device
Prior art date
Application number
BR9901119-0A
Other languages
English (en)
Inventor
William George Gates
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE69724972T priority Critical patent/DE69724972T2/de
Priority to EP97309028A priority patent/EP0917418B1/en
Priority to US09/232,418 priority patent/US6111750A/en
Priority to CA002260305A priority patent/CA2260305C/en
Priority to JP11024534A priority patent/JP3084015B2/ja
Priority to AU15433/99A priority patent/AU720799B1/en
Priority to KR1019990003869A priority patent/KR100324072B1/ko
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Priority to BR9901119-0A priority patent/BR9901119A/pt
Publication of BR9901119A publication Critical patent/BR9901119A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<B>APARELHO ELETRôNICO<D> Aparelho eletrônico está contido em um invólucro externo dissipativo de calor 2. O invólucro contem pelo menos uma unidade contida em um alojamento interno termicamente condutor 4,6 propiciando isolamento de RF e montado sobre uma parede 7 do invólucro em contato térmico com aquela. Uma parede 11 da unidade tem um primeiro rebaixo 14 recebendo o evaporador 13 do tubo calorífico 12. O tubo calorífico está encaixado entre o invólucro externo e o alojamento interno. O condensador 22 do tubo calorífico está mais baixo do que o evaporador, e é recebido por um rebaixo 24 na parede 7. O evaporador está encaixado no rebaixo por meio de um elemento de fixação, por exemplo, outra unidade 6. Uma vez que o tubo calorífico está encaixado nas suas extremidades, não necessita de ser um encaixe de interferência em qualquer rebaixo, e pode portanto ser facilmente removido. O alojamento interno pode manter isoladamente de RF.
BR9901119-0A 1997-11-11 1999-03-24 Aparelho eletrônico BR9901119A (pt)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE69724972T DE69724972T2 (de) 1997-11-11 1997-11-11 Elektronisches Gerät
EP97309028A EP0917418B1 (en) 1997-11-11 1997-11-11 Electronic apparatus
US09/232,418 US6111750A (en) 1997-11-11 1999-01-15 Electronic apparatus
CA002260305A CA2260305C (en) 1997-11-11 1999-01-25 Electronic apparatus
JP11024534A JP3084015B2 (ja) 1997-11-11 1999-02-02 電子装置
AU15433/99A AU720799B1 (en) 1997-11-11 1999-02-04 Electronic apparatus
KR1019990003869A KR100324072B1 (ko) 1997-11-11 1999-02-05 열 소산성 외부 밀폐체를 포함하는 전자 장치
BR9901119-0A BR9901119A (pt) 1997-11-11 1999-03-24 Aparelho eletrônico

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
EP97309028A EP0917418B1 (en) 1997-11-11 1997-11-11 Electronic apparatus
US09/232,418 US6111750A (en) 1997-11-11 1999-01-15 Electronic apparatus
CA002260305A CA2260305C (en) 1997-11-11 1999-01-25 Electronic apparatus
JP11024534A JP3084015B2 (ja) 1997-11-11 1999-02-02 電子装置
AU15433/99A AU720799B1 (en) 1997-11-11 1999-02-04 Electronic apparatus
KR1019990003869A KR100324072B1 (ko) 1997-11-11 1999-02-05 열 소산성 외부 밀폐체를 포함하는 전자 장치
BR9901119-0A BR9901119A (pt) 1997-11-11 1999-03-24 Aparelho eletrônico

Publications (1)

Publication Number Publication Date
BR9901119A true BR9901119A (pt) 2000-10-10

Family

ID=33033363

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9901119-0A BR9901119A (pt) 1997-11-11 1999-03-24 Aparelho eletrônico

Country Status (8)

Country Link
US (1) US6111750A (pt)
EP (1) EP0917418B1 (pt)
JP (1) JP3084015B2 (pt)
KR (1) KR100324072B1 (pt)
AU (1) AU720799B1 (pt)
BR (1) BR9901119A (pt)
CA (1) CA2260305C (pt)
DE (1) DE69724972T2 (pt)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0932330B1 (en) * 1998-01-27 2001-11-28 Lucent Technologies Inc. Electronic apparatus
DE19960840A1 (de) * 1999-12-16 2001-07-05 Siemens Ag Elektronische Schaltung mit Kühlvorrichtung
US6639799B2 (en) * 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US6412479B1 (en) 2001-06-20 2002-07-02 Dana Corporation Thermal management system for positive crankcase ventilation system
US7411337B2 (en) * 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6574963B1 (en) 2001-11-16 2003-06-10 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US7342788B2 (en) * 2004-03-12 2008-03-11 Powerwave Technologies, Inc. RF power amplifier assembly with heat pipe enhanced pallet
KR100687718B1 (ko) 2004-12-16 2007-02-27 한국전자통신연구원 히트파이프를 채용한 전자빔 장치
KR100628321B1 (ko) 2004-12-16 2006-09-27 한국전자통신연구원 마이크로 칼럼 전자빔 장치
US20080266801A1 (en) * 2007-04-30 2008-10-30 Rockwell Automation Technologies, Inc. Phase change cooled power electronic module
WO2010028350A1 (en) * 2008-09-08 2010-03-11 Intergraph Technologies Company Ruggedized computer capable of operating in high-temperature environments
US8988880B2 (en) * 2012-09-19 2015-03-24 Ge Intelligent Platforms, Inc. Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
JP6127429B2 (ja) * 2012-09-28 2017-05-17 富士通株式会社 冷却装置及び電子装置
JP6527879B2 (ja) 2014-03-20 2019-06-05 華為終端有限公司 モバイル端末
KR102546241B1 (ko) 2016-10-05 2023-06-22 삼성전자주식회사 반도체 패키지
GB2570462A (en) * 2018-01-24 2019-07-31 Moog Unna Gmbh Cabinet comprising heat pipes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012089A (en) * 1974-04-08 1977-03-15 The United States Of America As Represented By The Secretary Of The Navy Electronic equipment enclosure
FR2533364B1 (fr) * 1982-09-17 1985-11-08 Thomson Csf Dispositif de repartition de la chaleur pour composants electroniques du type comportant au moins un element chaud et un element froid tels que les tubes a ondes progressives et procede de realisation d'un tel dispositif
JP3385482B2 (ja) * 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation

Also Published As

Publication number Publication date
DE69724972D1 (de) 2003-10-23
JP3084015B2 (ja) 2000-09-04
KR20000055312A (ko) 2000-09-05
EP0917418B1 (en) 2003-09-17
EP0917418A1 (en) 1999-05-19
CA2260305C (en) 2002-09-03
CA2260305A1 (en) 2000-07-25
KR100324072B1 (ko) 2002-02-16
DE69724972T2 (de) 2004-07-22
US6111750A (en) 2000-08-29
JP2000223877A (ja) 2000-08-11
AU720799B1 (en) 2000-06-15

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]