BR9901119A - Aparelho eletrônico - Google Patents
Aparelho eletrônicoInfo
- Publication number
- BR9901119A BR9901119A BR9901119-0A BR9901119A BR9901119A BR 9901119 A BR9901119 A BR 9901119A BR 9901119 A BR9901119 A BR 9901119A BR 9901119 A BR9901119 A BR 9901119A
- Authority
- BR
- Brazil
- Prior art keywords
- housing
- recess
- heat pipe
- evaporator
- electronic device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
<B>APARELHO ELETRôNICO<D> Aparelho eletrônico está contido em um invólucro externo dissipativo de calor 2. O invólucro contem pelo menos uma unidade contida em um alojamento interno termicamente condutor 4,6 propiciando isolamento de RF e montado sobre uma parede 7 do invólucro em contato térmico com aquela. Uma parede 11 da unidade tem um primeiro rebaixo 14 recebendo o evaporador 13 do tubo calorífico 12. O tubo calorífico está encaixado entre o invólucro externo e o alojamento interno. O condensador 22 do tubo calorífico está mais baixo do que o evaporador, e é recebido por um rebaixo 24 na parede 7. O evaporador está encaixado no rebaixo por meio de um elemento de fixação, por exemplo, outra unidade 6. Uma vez que o tubo calorífico está encaixado nas suas extremidades, não necessita de ser um encaixe de interferência em qualquer rebaixo, e pode portanto ser facilmente removido. O alojamento interno pode manter isoladamente de RF.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69724972T DE69724972T2 (de) | 1997-11-11 | 1997-11-11 | Elektronisches Gerät |
EP97309028A EP0917418B1 (en) | 1997-11-11 | 1997-11-11 | Electronic apparatus |
US09/232,418 US6111750A (en) | 1997-11-11 | 1999-01-15 | Electronic apparatus |
CA002260305A CA2260305C (en) | 1997-11-11 | 1999-01-25 | Electronic apparatus |
JP11024534A JP3084015B2 (ja) | 1997-11-11 | 1999-02-02 | 電子装置 |
AU15433/99A AU720799B1 (en) | 1997-11-11 | 1999-02-04 | Electronic apparatus |
KR1019990003869A KR100324072B1 (ko) | 1997-11-11 | 1999-02-05 | 열 소산성 외부 밀폐체를 포함하는 전자 장치 |
BR9901119-0A BR9901119A (pt) | 1997-11-11 | 1999-03-24 | Aparelho eletrônico |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97309028A EP0917418B1 (en) | 1997-11-11 | 1997-11-11 | Electronic apparatus |
US09/232,418 US6111750A (en) | 1997-11-11 | 1999-01-15 | Electronic apparatus |
CA002260305A CA2260305C (en) | 1997-11-11 | 1999-01-25 | Electronic apparatus |
JP11024534A JP3084015B2 (ja) | 1997-11-11 | 1999-02-02 | 電子装置 |
AU15433/99A AU720799B1 (en) | 1997-11-11 | 1999-02-04 | Electronic apparatus |
KR1019990003869A KR100324072B1 (ko) | 1997-11-11 | 1999-02-05 | 열 소산성 외부 밀폐체를 포함하는 전자 장치 |
BR9901119-0A BR9901119A (pt) | 1997-11-11 | 1999-03-24 | Aparelho eletrônico |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9901119A true BR9901119A (pt) | 2000-10-10 |
Family
ID=33033363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9901119-0A BR9901119A (pt) | 1997-11-11 | 1999-03-24 | Aparelho eletrônico |
Country Status (8)
Country | Link |
---|---|
US (1) | US6111750A (pt) |
EP (1) | EP0917418B1 (pt) |
JP (1) | JP3084015B2 (pt) |
KR (1) | KR100324072B1 (pt) |
AU (1) | AU720799B1 (pt) |
BR (1) | BR9901119A (pt) |
CA (1) | CA2260305C (pt) |
DE (1) | DE69724972T2 (pt) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0932330B1 (en) * | 1998-01-27 | 2001-11-28 | Lucent Technologies Inc. | Electronic apparatus |
DE19960840A1 (de) * | 1999-12-16 | 2001-07-05 | Siemens Ag | Elektronische Schaltung mit Kühlvorrichtung |
US6639799B2 (en) * | 2000-12-22 | 2003-10-28 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
US6412479B1 (en) | 2001-06-20 | 2002-07-02 | Dana Corporation | Thermal management system for positive crankcase ventilation system |
US7411337B2 (en) * | 2001-11-16 | 2008-08-12 | Intel Corporation | Electrical energy-generating system and devices and methods related thereto |
US6574963B1 (en) | 2001-11-16 | 2003-06-10 | Intel Corporation | Electrical energy-generating heat sink system and method of using same to recharge an energy storage device |
US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
US7342788B2 (en) * | 2004-03-12 | 2008-03-11 | Powerwave Technologies, Inc. | RF power amplifier assembly with heat pipe enhanced pallet |
KR100687718B1 (ko) | 2004-12-16 | 2007-02-27 | 한국전자통신연구원 | 히트파이프를 채용한 전자빔 장치 |
KR100628321B1 (ko) | 2004-12-16 | 2006-09-27 | 한국전자통신연구원 | 마이크로 칼럼 전자빔 장치 |
US20080266801A1 (en) * | 2007-04-30 | 2008-10-30 | Rockwell Automation Technologies, Inc. | Phase change cooled power electronic module |
WO2010028350A1 (en) * | 2008-09-08 | 2010-03-11 | Intergraph Technologies Company | Ruggedized computer capable of operating in high-temperature environments |
US8988880B2 (en) * | 2012-09-19 | 2015-03-24 | Ge Intelligent Platforms, Inc. | Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly |
JP6127429B2 (ja) * | 2012-09-28 | 2017-05-17 | 富士通株式会社 | 冷却装置及び電子装置 |
JP6527879B2 (ja) | 2014-03-20 | 2019-06-05 | 華為終端有限公司 | モバイル端末 |
KR102546241B1 (ko) | 2016-10-05 | 2023-06-22 | 삼성전자주식회사 | 반도체 패키지 |
GB2570462A (en) * | 2018-01-24 | 2019-07-31 | Moog Unna Gmbh | Cabinet comprising heat pipes |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4012089A (en) * | 1974-04-08 | 1977-03-15 | The United States Of America As Represented By The Secretary Of The Navy | Electronic equipment enclosure |
FR2533364B1 (fr) * | 1982-09-17 | 1985-11-08 | Thomson Csf | Dispositif de repartition de la chaleur pour composants electroniques du type comportant au moins un element chaud et un element froid tels que les tubes a ondes progressives et procede de realisation d'un tel dispositif |
JP3385482B2 (ja) * | 1993-11-15 | 2003-03-10 | 株式会社日立製作所 | 電子機器 |
US5587880A (en) * | 1995-06-28 | 1996-12-24 | Aavid Laboratories, Inc. | Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation |
-
1997
- 1997-11-11 EP EP97309028A patent/EP0917418B1/en not_active Expired - Lifetime
- 1997-11-11 DE DE69724972T patent/DE69724972T2/de not_active Expired - Lifetime
-
1999
- 1999-01-15 US US09/232,418 patent/US6111750A/en not_active Expired - Lifetime
- 1999-01-25 CA CA002260305A patent/CA2260305C/en not_active Expired - Fee Related
- 1999-02-02 JP JP11024534A patent/JP3084015B2/ja not_active Expired - Lifetime
- 1999-02-04 AU AU15433/99A patent/AU720799B1/en not_active Ceased
- 1999-02-05 KR KR1019990003869A patent/KR100324072B1/ko not_active IP Right Cessation
- 1999-03-24 BR BR9901119-0A patent/BR9901119A/pt unknown
Also Published As
Publication number | Publication date |
---|---|
DE69724972D1 (de) | 2003-10-23 |
JP3084015B2 (ja) | 2000-09-04 |
KR20000055312A (ko) | 2000-09-05 |
EP0917418B1 (en) | 2003-09-17 |
EP0917418A1 (en) | 1999-05-19 |
CA2260305C (en) | 2002-09-03 |
CA2260305A1 (en) | 2000-07-25 |
KR100324072B1 (ko) | 2002-02-16 |
DE69724972T2 (de) | 2004-07-22 |
US6111750A (en) | 2000-08-29 |
JP2000223877A (ja) | 2000-08-11 |
AU720799B1 (en) | 2000-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |