BR9004392A - Processo para a preparacao de compositos de polimida metalizados - Google Patents
Processo para a preparacao de compositos de polimida metalizadosInfo
- Publication number
- BR9004392A BR9004392A BR909004392A BR9004392A BR9004392A BR 9004392 A BR9004392 A BR 9004392A BR 909004392 A BR909004392 A BR 909004392A BR 9004392 A BR9004392 A BR 9004392A BR 9004392 A BR9004392 A BR 9004392A
- Authority
- BR
- Brazil
- Prior art keywords
- polymide
- metallized
- composites
- preparation
- polymide composites
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40237289A | 1989-09-05 | 1989-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9004392A true BR9004392A (pt) | 1991-09-10 |
Family
ID=23591610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR909004392A BR9004392A (pt) | 1989-09-05 | 1990-09-04 | Processo para a preparacao de compositos de polimida metalizados |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0419845A3 (pt) |
JP (1) | JPH03150392A (pt) |
KR (1) | KR910006008A (pt) |
BR (1) | BR9004392A (pt) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19624071A1 (de) * | 1996-06-17 | 1997-12-18 | Bayer Ag | Verfahren zur Herstellung von bahnförmigen metallbeschichteten Folien |
SG87814A1 (en) | 1999-06-29 | 2002-04-16 | Univ Singapore | Method for low temperature lamination of metals to polyimides |
EP1069210A1 (en) * | 1999-07-12 | 2001-01-17 | Applied Materials, Inc. | Process for electrochemical deposition of high aspect ratio structures |
JP2002050868A (ja) * | 1999-08-06 | 2002-02-15 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
DE60045566D1 (de) | 1999-08-06 | 2011-03-03 | Ibiden Co Ltd | Mehrschicht-Leiterplatte |
US6406609B1 (en) * | 2000-02-25 | 2002-06-18 | Agere Systems Guardian Corp. | Method of fabricating an integrated circuit |
US20020112964A1 (en) * | 2000-07-12 | 2002-08-22 | Applied Materials, Inc. | Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths |
US6884338B2 (en) | 2002-12-16 | 2005-04-26 | 3M Innovative Properties Company | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
US7147767B2 (en) * | 2002-12-16 | 2006-12-12 | 3M Innovative Properties Company | Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
US6858124B2 (en) | 2002-12-16 | 2005-02-22 | 3M Innovative Properties Company | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
JP4636790B2 (ja) * | 2003-11-27 | 2011-02-23 | 柿原工業株式会社 | 樹脂製筐体の高剛性・高硬度めっき方法 |
KR100845534B1 (ko) * | 2004-12-31 | 2008-07-10 | 엘지전자 주식회사 | 전도성 금속 도금 폴리이미드 기판 및 그 제조 방법 |
EP2568063A1 (en) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
JP2013159784A (ja) * | 2012-02-01 | 2013-08-19 | Toyota Motor Corp | めっき処理材の製造方法およびめっき処理材 |
CN114107965A (zh) * | 2021-10-29 | 2022-03-01 | 北京卫星制造厂有限公司 | 一种聚酰亚胺表面金属层制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU384941A1 (pt) * | 1970-10-05 | 1973-05-29 | О. Я. Нейланд, В. А. Крикис, Т. Вейхерт , Д. В. Давыдов Рижский политехнический институт | |
JPS534499B2 (pt) * | 1972-11-13 | 1978-02-17 | ||
JPS50104143A (pt) * | 1974-01-23 | 1975-08-16 | ||
JPS5654076A (en) * | 1979-10-09 | 1981-05-13 | Toshiba Corp | Detector for semiconductor radioactive ray |
US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
JPS58136794A (ja) * | 1982-02-10 | 1983-08-13 | Nippon Mining Co Ltd | 酸性銅めつき液 |
JPS6133077A (ja) * | 1984-07-26 | 1986-02-15 | Hitachi Ltd | 高圧安定化回路 |
JPS63195292A (ja) * | 1987-02-10 | 1988-08-12 | Kureha Chem Ind Co Ltd | 含フツ素オレフイン樹脂成形物に厚い金属皮膜を形成する方法 |
US4832799A (en) * | 1987-02-24 | 1989-05-23 | Polyonics Corporation | Process for coating at least one surface of a polyimide sheet with copper |
US4725504A (en) * | 1987-02-24 | 1988-02-16 | Polyonics Corporation | Metal coated laminate products made from textured polyimide film |
JPH01123093A (ja) * | 1987-11-05 | 1989-05-16 | Seiko Epson Corp | プラスチックへのメッキ方法 |
US4873136A (en) * | 1988-06-16 | 1989-10-10 | General Electric Company | Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
-
1990
- 1990-08-22 EP EP19900116061 patent/EP0419845A3/en not_active Withdrawn
- 1990-09-04 KR KR1019900013919A patent/KR910006008A/ko not_active Application Discontinuation
- 1990-09-04 BR BR909004392A patent/BR9004392A/pt not_active Application Discontinuation
- 1990-09-05 JP JP2233473A patent/JPH03150392A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR910006008A (ko) | 1991-04-27 |
JPH03150392A (ja) | 1991-06-26 |
EP0419845A2 (en) | 1991-04-03 |
EP0419845A3 (en) | 1991-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD3 | Appl. lapsed due to non-payment of renewal fee |