BR9002105A - Conjunto de pelicula metalica condutiva protegida,processo para proteger uma pelicula metalica condutiva eletrodepositada durante o processo adicional e laminado de pelicula metalica condutiva protegida - Google Patents

Conjunto de pelicula metalica condutiva protegida,processo para proteger uma pelicula metalica condutiva eletrodepositada durante o processo adicional e laminado de pelicula metalica condutiva protegida

Info

Publication number
BR9002105A
BR9002105A BR909002105A BR9002105A BR9002105A BR 9002105 A BR9002105 A BR 9002105A BR 909002105 A BR909002105 A BR 909002105A BR 9002105 A BR9002105 A BR 9002105A BR 9002105 A BR9002105 A BR 9002105A
Authority
BR
Brazil
Prior art keywords
conductive metal
protected
electrodepositated
protect
during additional
Prior art date
Application number
BR909002105A
Other languages
English (en)
Inventor
Rolland D Savage
John P Callahan
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of BR9002105A publication Critical patent/BR9002105A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/021—Treatment by energy or chemical effects using electrical effects
    • B32B2310/025—Electrostatic charges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wrappers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BR909002105A 1989-05-05 1990-05-04 Conjunto de pelicula metalica condutiva protegida,processo para proteger uma pelicula metalica condutiva eletrodepositada durante o processo adicional e laminado de pelicula metalica condutiva protegida BR9002105A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34784189A 1989-05-05 1989-05-05

Publications (1)

Publication Number Publication Date
BR9002105A true BR9002105A (pt) 1991-08-13

Family

ID=23365507

Family Applications (1)

Application Number Title Priority Date Filing Date
BR909002105A BR9002105A (pt) 1989-05-05 1990-05-04 Conjunto de pelicula metalica condutiva protegida,processo para proteger uma pelicula metalica condutiva eletrodepositada durante o processo adicional e laminado de pelicula metalica condutiva protegida

Country Status (11)

Country Link
EP (1) EP0395871A3 (pt)
JP (1) JP2790708B2 (pt)
KR (1) KR900019550A (pt)
CN (1) CN1047049A (pt)
AU (1) AU631872B2 (pt)
BR (1) BR9002105A (pt)
CA (1) CA2016105A1 (pt)
DD (1) DD300087A5 (pt)
IL (1) IL94190A0 (pt)
MX (1) MX171790B (pt)
MY (1) MY105514A (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
JPH04369290A (ja) * 1991-06-18 1992-12-22 Furukawa Saakitsuto Foil Kk 保護フィルム付き両面粗化処理銅箔及びその製法
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
CA2078955A1 (en) * 1991-10-01 1993-04-02 Jamie H. Chamberlain Protected conductive foil assemblage and procedure for preparing same using static electrical forces
US5399239A (en) * 1992-12-18 1995-03-21 Ceridian Corporation Method of fabricating conductive structures on substrates
SG66765A1 (en) * 1993-12-02 2001-01-16 Heraeus Gmbh W C Process and apparatus for producing a laminate
ATE392726T1 (de) * 1999-02-10 2008-05-15 Amc Centurion Ab Verfahren und vorrichtung zur herstellung einer rolle von gegenständen
CN1104328C (zh) * 1999-04-08 2003-04-02 孟庆连 半连续周期式生产金属复合带卷的方法
CN1081128C (zh) * 1999-08-18 2002-03-20 湖北省化学研究所 软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法
CN101437367B (zh) * 2007-11-14 2011-03-02 比亚迪股份有限公司 一种印刷线路板的制作方法
CN101987522B (zh) * 2009-08-06 2013-01-30 烟台万泰通信科技有限公司 双层塑料薄膜复合带制作方法
CN102216078B (zh) * 2009-12-22 2015-03-25 Jx日矿日石金属株式会社 层积体的制造方法及层积体
JP5190553B1 (ja) * 2012-03-06 2013-04-24 フリージア・マクロス株式会社 キャリア付き金属箔
CN106658952A (zh) * 2017-03-01 2017-05-10 苏州思诺林电子有限公司 一种线路板铜箔表面保护结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246220B (de) * 1965-10-15 1967-08-03 Licentia Gmbh Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw. Schichtpressstoffen
DE1778825A1 (de) * 1968-06-10 1971-08-26 Licentia Gmbh Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw.Schichtpressstoffen
US3655496A (en) * 1969-09-25 1972-04-11 Vitta Corp Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates
JPS5517507B2 (pt) * 1972-06-29 1980-05-12
GB2091634B (en) * 1981-01-22 1984-12-05 Gen Electric Transfer lamination of vapour deposited copper thin sheets and films
JPS588636A (ja) * 1981-07-08 1983-01-18 旭化成株式会社 ロ−ル状に巻取られた光重合性エレメント
JPS588637A (ja) * 1981-07-08 1983-01-18 旭化成株式会社 ロ−ル状に巻取られた光重合性エレメント
US4568413A (en) * 1983-07-25 1986-02-04 James J. Toth Metallized and plated laminates

Also Published As

Publication number Publication date
CA2016105A1 (en) 1990-11-05
JPH02307296A (ja) 1990-12-20
JP2790708B2 (ja) 1998-08-27
EP0395871A2 (en) 1990-11-07
AU5461190A (en) 1990-11-08
AU631872B2 (en) 1992-12-10
IL94190A0 (en) 1991-01-31
MX171790B (es) 1993-11-15
DD300087A5 (de) 1992-05-21
CN1047049A (zh) 1990-11-21
EP0395871A3 (en) 1991-09-18
KR900019550A (ko) 1990-12-24
MY105514A (en) 1994-10-31

Similar Documents

Publication Publication Date Title
DE59401033D1 (de) Kühlmittelkreislauf
ES516540A0 (es) "un metodo mejorado para proporcionar proteccion dielectrica y contra altas temperaturas a componentes electricos y electronicos".
BR8306839A (pt) Protecao de metal,cobertura de peca inteirica em combinacao com um conector eletrico e processo para se prover uma protecao rf-iem para um conector eletrico
BR9002105A (pt) Conjunto de pelicula metalica condutiva protegida,processo para proteger uma pelicula metalica condutiva eletrodepositada durante o processo adicional e laminado de pelicula metalica condutiva protegida
BR9305736A (pt) Limitador eletronico de corrente de curto-circuito
IT1139146B (it) Complesso di confezionamento per componenti elettrici e/o elettronici
EP0088312A3 (en) H-switch circuit with an overcurrent protection circuit
DE69410450D1 (de) Schutzschild
BR8303906A (pt) Involucro protetor e processo para sua aplicacao
BR9306711A (pt) Processo para recuperação de valores metálicos e processo para recuperação de valores metálicos e ácidos
DE3574692D1 (de) Schutzschaltung gegen unterspannungen im bordnetz eines kraftfahrzeuges.
IT1139147B (it) Complesso di confezionamento per componenti elettrici e/o elettronici
IT7923826A0 (it) Composizione e processo per il rivestimento protettivo di componenti elettronici.
DE3887873D1 (de) Phantom-esd-schutzschaltung mit e-feldverdichtung.
IT8619627A0 (it) Copertina di protezione adattabile, suo procedimento di fabbricazione e suo procedimento di adattamento ad un oggetto da proteggere.
GR900100172A (en) Method and composition for protecting and enhancing the solderability of metallic surfaces
BR8603660A (pt) Aperfeicoamento no processo de galvanizacao eletrolitica
KR950009175U (ko) 전자식 금고
BR8202322A (pt) Aparelho de remanchar e processo para fabricar conjunto de canhao eletronico
DE69423694D1 (de) Volladdiererschaltung
DE59403487D1 (de) Schutzschaltungsanordnung
BR8506821A (pt) Laminado composto de mica e processo para produzir o mesmo
IT8224332A0 (it) Procedimento e cassa di protezione per incorporare un apparecchio in modo che risulti protetto da vibrazioni.
ATA161393A (de) Schutzschild
ITRM930724A1 (it) Dispositivo e procedimento per il pretrattamento di rottame elettronico.

Legal Events

Date Code Title Description
KF Request for proof of payment of annual fee
FD5 Application fees: dismissal - article 86 of industrial property law