BR8803411A - Fita adesiva curavel por radiacao - Google Patents
Fita adesiva curavel por radiacaoInfo
- Publication number
- BR8803411A BR8803411A BR8803411A BR8803411A BR8803411A BR 8803411 A BR8803411 A BR 8803411A BR 8803411 A BR8803411 A BR 8803411A BR 8803411 A BR8803411 A BR 8803411A BR 8803411 A BR8803411 A BR 8803411A
- Authority
- BR
- Brazil
- Prior art keywords
- adhesive tape
- radiation curing
- curing adhesive
- radiation
- tape
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16851587A JPH07120640B2 (ja) | 1987-07-08 | 1987-07-08 | 半導体用放射線硬化性粘着テ−プ |
JP63076185A JPH01249877A (ja) | 1988-03-31 | 1988-03-31 | 放射線硬化性粘着テープ |
JP7618688A JP2661950B2 (ja) | 1988-03-31 | 1988-03-31 | 半導体ウエハ固定用放射線硬化性粘着テープ |
JP63078202A JPH01252685A (ja) | 1988-04-01 | 1988-04-01 | 放射線硬化性粘着テープ |
JP63078201A JPH01252684A (ja) | 1988-04-01 | 1988-04-01 | 放射線硬化性粘着テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8803411A true BR8803411A (pt) | 1989-01-24 |
Family
ID=27524608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8803411A BR8803411A (pt) | 1987-07-08 | 1988-07-07 | Fita adesiva curavel por radiacao |
Country Status (6)
Country | Link |
---|---|
US (1) | US4999242A (pt) |
EP (1) | EP0298448B1 (pt) |
KR (1) | KR960001663B1 (pt) |
BR (1) | BR8803411A (pt) |
DE (1) | DE3850451T2 (pt) |
MY (1) | MY104320A (pt) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5281473A (en) * | 1987-07-08 | 1994-01-25 | Furakawa Electric Co., Ltd. | Radiation-curable adhesive tape |
JPH0353546A (ja) * | 1989-07-21 | 1991-03-07 | Mitsubishi Electric Corp | 半導体装置の製造方法およびその製造装置 |
JP3181284B2 (ja) * | 1990-01-12 | 2001-07-03 | 旭電化工業株式会社 | エネルギー線反応性粘着剤組成物 |
MY107463A (en) * | 1991-02-28 | 1995-12-30 | Sumitomo Bakelite Co | Cover tape for packaging chip type electronic parts. |
US5538771A (en) * | 1991-06-28 | 1996-07-23 | Furukawa Electric Co., Ltd. | Semiconductor wafer-securing adhesive tape |
JPH05179211A (ja) * | 1991-12-30 | 1993-07-20 | Nitto Denko Corp | ダイシング・ダイボンドフイルム |
DE69307008T2 (de) * | 1992-03-27 | 1997-04-17 | Nitto Denko Corp | Druckempfindliche Klebstoffe mit guter Wärmebeständigkeit, Klebplatten daraus und Verfahren zur deren Herstellung |
US5283467A (en) * | 1992-06-05 | 1994-02-01 | Eaton Corporation | Heat sink mounting system for semiconductor devices |
DE4230784A1 (de) * | 1992-09-15 | 1994-03-17 | Beiersdorf Ag | Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape) |
JP3410202B2 (ja) * | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法 |
US5670260A (en) * | 1995-04-21 | 1997-09-23 | Adhesives Research, Inc. | Radiation-cured adhesive film having differential surface adhesion |
DE19520238C2 (de) * | 1995-06-02 | 1998-01-15 | Beiersdorf Ag | Selbstklebeband |
GB2320615B (en) * | 1996-12-19 | 2001-06-20 | Lintec Corp | Process for producing a chip and pressure sensitive adhesive sheet for said process |
US6174578B1 (en) * | 1997-10-24 | 2001-01-16 | Rexam Industries Corp. | Radiation deactivatable adhesive tape |
DE19853813A1 (de) * | 1997-12-10 | 1999-06-17 | Henkel Kgaa | Klebstoff mit mehrstufiger Aushärtung und dessen Verwendung bei der Herstellung von Verbundmaterialien |
JP2000038556A (ja) * | 1998-07-22 | 2000-02-08 | Nitto Denko Corp | 半導体ウエハ保持保護用ホットメルトシート及びその貼り付け方法 |
DE69914418T2 (de) * | 1998-08-10 | 2004-12-02 | Lintec Corp. | Dicing tape und Verfahren zum Zerteilen einer Halbleiterscheibe |
US7641966B2 (en) | 1999-06-14 | 2010-01-05 | Nitto Denko Corporation | Re-release adhesive and re-release adhesive sheet |
JP5201768B2 (ja) * | 1999-06-14 | 2013-06-05 | 日東電工株式会社 | 再剥離型粘着剤及び再剥離型粘着シート |
JP4230080B2 (ja) * | 2000-02-18 | 2009-02-25 | リンテック株式会社 | ウエハ貼着用粘着シート |
US6472065B1 (en) * | 2000-07-13 | 2002-10-29 | 3M Innovative Properties Company | Clear adhesive sheet |
US6759121B2 (en) | 2000-07-13 | 2004-07-06 | 3M Innovative Properties Company | Clear adhesive sheet |
KR100907331B1 (ko) * | 2003-01-23 | 2009-07-13 | 엘지.필립스 디스플레이 주식회사 | 평면형 칼라 음극선관 |
JP2005150235A (ja) | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
JP4677758B2 (ja) * | 2004-10-14 | 2011-04-27 | 日立化成工業株式会社 | ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法 |
JP4776188B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | 半導体装置製造方法およびウエハ加工用テープ |
JP4776189B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP4493643B2 (ja) * | 2006-12-06 | 2010-06-30 | 日東電工株式会社 | 再剥離型粘着剤組成物、及び粘着テープ又はシート |
JP4778472B2 (ja) * | 2007-05-08 | 2011-09-21 | 日東電工株式会社 | 粘着型光学フィルムおよび画像表示装置 |
US20090017248A1 (en) * | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
KR100922684B1 (ko) * | 2007-08-31 | 2009-10-19 | 제일모직주식회사 | 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프 |
JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
GB0904582D0 (en) * | 2008-09-24 | 2009-04-29 | Lumina Adhesives | Switchable adhesives |
EP2371920A1 (en) | 2010-03-31 | 2011-10-05 | Lumina Adhesives AB | Switchable adhesives |
JP5130405B2 (ja) * | 2010-09-16 | 2013-01-30 | 積水化学工業株式会社 | 粘着剤組成物、粘着テープ、及び、ウエハの処理方法 |
CN103180402B (zh) * | 2010-11-05 | 2015-09-23 | 3M创新有限公司 | 具有防滑性质的有机硅改性粘合剂 |
JP5998730B2 (ja) | 2011-09-16 | 2016-09-28 | 日立化成株式会社 | 粘着フィルム及び粘着フィルムの製造方法 |
US20150034238A1 (en) * | 2012-03-20 | 2015-02-05 | 3M Innovative Properties Company | Laminate body, method, and materials for temporary substrate support and support separation |
JP6156443B2 (ja) * | 2014-08-13 | 2017-07-05 | Jsr株式会社 | 積層体および基材の処理方法 |
TWI586780B (zh) | 2015-03-23 | 2017-06-11 | 阿科瑪法國公司 | 壓敏性黏合劑 |
TWI692517B (zh) | 2015-09-30 | 2020-05-01 | 日商富士軟片股份有限公司 | 暫時接著劑、積層體、積層體的製造方法、元件基板的製造方法及半導體元件的製造方法 |
GB202002659D0 (en) | 2020-02-25 | 2020-04-08 | Lumina Adhesives Ab | Switchable adhesive compositions |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3318147A1 (de) * | 1983-05-18 | 1984-11-22 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von, isocyanuratgruppen und olefinische doppelbindungen aufweisenden verbindungen, die nach diesem verfahren erhaeltlichen verbindungen und ihre verwendung als bindemittel bzw. bindemittelkomponente in ueberzugsmitteln |
JPS604579A (ja) * | 1983-06-22 | 1985-01-11 | Nitto Electric Ind Co Ltd | マスキング用感圧性接着テ−プまたはシ−ト |
JPH0616524B2 (ja) * | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
JPS60201642A (ja) * | 1984-03-27 | 1985-10-12 | Nitto Electric Ind Co Ltd | 半導体ウエハの処理方法 |
JPS6128572A (ja) * | 1984-07-19 | 1986-02-08 | F S K Kk | 半導体ウエハー用粘着シートの使用法 |
DE3501726A1 (de) * | 1985-01-19 | 1986-07-24 | Hoechst Ag, 6230 Frankfurt | Polypropylen-klebeband |
US4640727A (en) * | 1985-01-28 | 1987-02-03 | Minnesota Mining And Manufacturing Company | Graphic design article |
EP0194706B1 (en) * | 1985-02-14 | 1989-08-23 | Bando Chemical Industries, Ltd. | A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
JPS6210180A (ja) * | 1985-07-05 | 1987-01-19 | Hitachi Chem Co Ltd | 表面保護用粘着フイルムの剥離方法 |
JPH0823001B2 (ja) * | 1985-09-10 | 1996-03-06 | 日東電工株式会社 | 接着フィルム |
US4773920B1 (en) * | 1985-12-16 | 1995-05-02 | Minnesota Mining & Mfg | Coated abrasive suitable for use as a lapping material. |
DE3639266A1 (de) * | 1985-12-27 | 1987-07-02 | Fsk K K | Haftfolie |
JPS6317980A (ja) * | 1986-07-09 | 1988-01-25 | F S K Kk | ウエハ貼着用粘着シ−ト |
JPS6327580A (ja) * | 1986-07-18 | 1988-02-05 | Hitachi Ltd | 粘着テ−プ |
-
1988
- 1988-07-06 EP EP88110785A patent/EP0298448B1/en not_active Expired - Lifetime
- 1988-07-06 DE DE3850451T patent/DE3850451T2/de not_active Expired - Fee Related
- 1988-07-07 US US07/216,269 patent/US4999242A/en not_active Expired - Lifetime
- 1988-07-07 BR BR8803411A patent/BR8803411A/pt not_active Application Discontinuation
- 1988-07-07 MY MYPI88000751A patent/MY104320A/en unknown
- 1988-07-08 KR KR1019880008509A patent/KR960001663B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0298448A2 (en) | 1989-01-11 |
US4999242A (en) | 1991-03-12 |
EP0298448B1 (en) | 1994-06-29 |
EP0298448A3 (en) | 1992-04-15 |
DE3850451D1 (de) | 1994-08-04 |
KR890002364A (ko) | 1989-04-10 |
MY104320A (en) | 1994-03-31 |
KR960001663B1 (ko) | 1996-02-03 |
DE3850451T2 (de) | 1995-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FB19 | Grant procedure suspended (art. 19) | ||
FA2 | Application deemed withdrawn (art. 19(5)) | ||
HO | Change of classification |
Free format text: INT.CL.5 |
|
B15K | Others concerning applications: alteration of classification |
Ipc: H01L 21/683 (2006.01), C09J 4/06 (2006.0 |