BR8703504A - Folha de cobre,metodo de produzir uma folha de cobre e laminado para uso na fabricacao de circuitos impressos - Google Patents

Folha de cobre,metodo de produzir uma folha de cobre e laminado para uso na fabricacao de circuitos impressos

Info

Publication number
BR8703504A
BR8703504A BR8703504A BR8703504A BR8703504A BR 8703504 A BR8703504 A BR 8703504A BR 8703504 A BR8703504 A BR 8703504A BR 8703504 A BR8703504 A BR 8703504A BR 8703504 A BR8703504 A BR 8703504A
Authority
BR
Brazil
Prior art keywords
copper
sheet
manufacture
producing
printed circuits
Prior art date
Application number
BR8703504A
Other languages
English (en)
Portuguese (pt)
Inventor
Peter Peckham
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of BR8703504A publication Critical patent/BR8703504A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
BR8703504A 1986-06-20 1987-06-19 Folha de cobre,metodo de produzir uma folha de cobre e laminado para uso na fabricacao de circuitos impressos BR8703504A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87721186A 1986-06-20 1986-06-20
US4160687A 1987-04-23 1987-04-23

Publications (1)

Publication Number Publication Date
BR8703504A true BR8703504A (pt) 1988-03-22

Family

ID=26718334

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8703504A BR8703504A (pt) 1986-06-20 1987-06-19 Folha de cobre,metodo de produzir uma folha de cobre e laminado para uso na fabricacao de circuitos impressos

Country Status (7)

Country Link
EP (1) EP0250195A3 (enExample)
KR (1) KR880000625A (enExample)
CN (1) CN87104293A (enExample)
AU (1) AU579517B2 (enExample)
BR (1) BR8703504A (enExample)
DK (1) DK311387A (enExample)
IN (1) IN168328B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE151474T1 (de) * 1990-05-30 1997-04-15 Gould Electronics Inc Elektroplattierte kupferfolie und deren herstellung unter verwendung elektrolytischer lösungen mit niedrigen konzentrationen von chlor ionen
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
WO1994021097A2 (en) * 1993-03-05 1994-09-15 Polyclad Laminates, Inc. Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
JPH08222857A (ja) * 1995-02-16 1996-08-30 Mitsui Mining & Smelting Co Ltd 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
TW432124B (en) 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
JP3258308B2 (ja) * 2000-02-03 2002-02-18 株式会社日鉱マテリアルズ レーザー穴開け性に優れた銅箔及びその製造方法
ES2203324B1 (es) 2002-05-23 2005-02-16 Antonio Rodriguez Siurana Lamina de cobre, material laminar compuesto que comprende dicha lamina de cobre y procedimiento para su obtencion.
TWI396779B (zh) * 2005-02-21 2013-05-21 古河電氣工業股份有限公司 Copper foil and its manufacturing method, and flexible printed circuit board
CN111485260B (zh) * 2020-04-30 2020-12-08 广东嘉元科技股份有限公司 二次电池用低翘曲电解铜箔、制造方法
CN120291167B (zh) * 2025-06-09 2025-09-12 陕西优卡曼材料科技有限公司 具有双重电解槽的铜箔制备系统、电解铜箔及制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900383A (en) * 1974-07-24 1975-08-19 Nat Steel Corp Apparatus for electroplating
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
US4549940A (en) * 1984-04-23 1985-10-29 Karwan Steven J Method for surface treating copper foil
EP0181430A1 (en) * 1984-11-13 1986-05-21 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4572768A (en) * 1985-06-28 1986-02-25 Square D Company Treatment for copper foil

Also Published As

Publication number Publication date
KR880000625A (ko) 1988-03-28
EP0250195A2 (en) 1987-12-23
DK311387D0 (da) 1987-06-18
DK311387A (da) 1987-12-21
EP0250195A3 (en) 1988-08-31
CN87104293A (zh) 1988-03-16
IN168328B (enExample) 1991-03-16
AU579517B2 (en) 1988-11-24
AU7386587A (en) 1988-01-07

Similar Documents

Publication Publication Date Title
AR240278A1 (es) Un procedimiento para producir chapa metalica laminada y para laminar chapa metalica producida de este modo.
DE3786600D1 (de) Mehrschichtige gedruckte schaltung und verfahren zu ihrer herstellung.
BR8304887A (pt) Processo para produzir uma folha microporosa,material de folha microporosa e estrutura laminada
KR860700108A (ko) 적층 시이트 및 그의 제조방법
DE3570235D1 (en) Method for producing multilayer ceramic circuit board
IT8449295A0 (it) Stampa litrografica metodo per controllare il rapporto inchiostro-acqua in una macchina da
EP0249051A3 (en) Composition, process for producing the same and multilayer structure
DE3280409D1 (de) Mehrschichtige gedruckte leiterplatte und verfahren zu ihrer herstellung.
DK437984D0 (da) Trykpresse
BR8701271A (pt) Pelicula multicamadas orientada;pelicula multicamadas biaxialmente orientada;processo de preparacao das mesmas
FI892905A7 (fi) Laminoitu metallilevy
GB2155853B (en) Laminated sheet
DE3679627D1 (de) Mehrschichtige gedruckte schaltungsplatte.
KR880702043A (ko) 다층프린트배선판 및 그 제조방법
AU579577B2 (en) Printed circuits
GB8630392D0 (en) Producing printed circuit boards
ES529404A0 (es) Una hoja exterior para uso en la fabricacion de laminados decorativos resistentes al rayado
GB2139615B (en) Forming holes in vitreous sheets
JPS5678199A (en) Method of laminating multilayer printed board
BR8702520A (pt) Laminado multi-camada e processo para produzir recipientesretortaveis
IT1241204B (it) Metodo per fabbricare piastrine per circuiti stampati
JPS55150296A (en) Method of fabricating multilayer printed board
GB2218671B (en) Laminated sheet production method
BR8906749A (pt) Processo para a preparacao de um laminado e lamindao
GB8328663D0 (en) Producing printed panels