DK311387D0 - Matteret kobberfolie - Google Patents

Matteret kobberfolie

Info

Publication number
DK311387D0
DK311387D0 DK311387A DK311387A DK311387D0 DK 311387 D0 DK311387 D0 DK 311387D0 DK 311387 A DK311387 A DK 311387A DK 311387 A DK311387 A DK 311387A DK 311387 D0 DK311387 D0 DK 311387D0
Authority
DK
Denmark
Prior art keywords
mattered
copper film
copper
film
mattered copper
Prior art date
Application number
DK311387A
Other languages
English (en)
Other versions
DK311387A (da
Inventor
Peter Peckham
Original Assignee
Goulod Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goulod Inc filed Critical Goulod Inc
Publication of DK311387D0 publication Critical patent/DK311387D0/da
Publication of DK311387A publication Critical patent/DK311387A/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
DK311387A 1986-06-20 1987-06-18 Matteret kobberfolie DK311387A (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87721186A 1986-06-20 1986-06-20
US4160687A 1987-04-23 1987-04-23

Publications (2)

Publication Number Publication Date
DK311387D0 true DK311387D0 (da) 1987-06-18
DK311387A DK311387A (da) 1987-12-21

Family

ID=26718334

Family Applications (1)

Application Number Title Priority Date Filing Date
DK311387A DK311387A (da) 1986-06-20 1987-06-18 Matteret kobberfolie

Country Status (7)

Country Link
EP (1) EP0250195A3 (da)
KR (1) KR880000625A (da)
CN (1) CN87104293A (da)
AU (1) AU579517B2 (da)
BR (1) BR8703504A (da)
DK (1) DK311387A (da)
IN (1) IN168328B (da)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0485588B1 (en) * 1990-05-30 1997-04-09 Gould Electronics Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
CA2157587C (en) * 1993-03-05 2004-12-07 D. Eric Seip Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
JPH08222857A (ja) * 1995-02-16 1996-08-30 Mitsui Mining & Smelting Co Ltd 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
JP3258308B2 (ja) * 2000-02-03 2002-02-18 株式会社日鉱マテリアルズ レーザー穴開け性に優れた銅箔及びその製造方法
ES2203324B1 (es) 2002-05-23 2005-02-16 Antonio Rodriguez Siurana Lamina de cobre, material laminar compuesto que comprende dicha lamina de cobre y procedimiento para su obtencion.
TWI396779B (zh) * 2005-02-21 2013-05-21 Copper foil and its manufacturing method, and flexible printed circuit board
CN111485260B (zh) * 2020-04-30 2020-12-08 广东嘉元科技股份有限公司 二次电池用低翘曲电解铜箔、制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5016624A (da) * 1973-06-08 1975-02-21
US3900383A (en) * 1974-07-24 1975-08-19 Nat Steel Corp Apparatus for electroplating
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
US4549940A (en) * 1984-04-23 1985-10-29 Karwan Steven J Method for surface treating copper foil
EP0181430A1 (en) * 1984-11-13 1986-05-21 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4572768A (en) * 1985-06-28 1986-02-25 Square D Company Treatment for copper foil

Also Published As

Publication number Publication date
AU579517B2 (en) 1988-11-24
CN87104293A (zh) 1988-03-16
IN168328B (da) 1991-03-16
EP0250195A3 (en) 1988-08-31
AU7386587A (en) 1988-01-07
EP0250195A2 (en) 1987-12-23
BR8703504A (pt) 1988-03-22
DK311387A (da) 1987-12-21
KR880000625A (ko) 1988-03-28

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment