BR7808124A - Dispositivo semicondutor - Google Patents

Dispositivo semicondutor

Info

Publication number
BR7808124A
BR7808124A BR7808124A BR7808124A BR7808124A BR 7808124 A BR7808124 A BR 7808124A BR 7808124 A BR7808124 A BR 7808124A BR 7808124 A BR7808124 A BR 7808124A BR 7808124 A BR7808124 A BR 7808124A
Authority
BR
Brazil
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
BR7808124A
Other languages
English (en)
Portuguese (pt)
Inventor
G Schermer
P Breuning
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of BR7808124A publication Critical patent/BR7808124A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
BR7808124A 1977-12-13 1978-12-11 Dispositivo semicondutor BR7808124A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7713758A NL7713758A (nl) 1977-12-13 1977-12-13 Halfgeleiderinrichting.

Publications (1)

Publication Number Publication Date
BR7808124A true BR7808124A (pt) 1979-07-31

Family

ID=19829740

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7808124A BR7808124A (pt) 1977-12-13 1978-12-11 Dispositivo semicondutor

Country Status (7)

Country Link
US (1) US4215359A (OSRAM)
JP (1) JPS5489571A (OSRAM)
BR (1) BR7808124A (OSRAM)
DE (1) DE2853328C2 (OSRAM)
FR (1) FR2412167A1 (OSRAM)
GB (1) GB2010013B (OSRAM)
NL (1) NL7713758A (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3061383D1 (en) * 1979-02-19 1983-01-27 Fujitsu Ltd Semiconductor device and method for manufacturing the same
JPS57173113A (en) * 1981-04-17 1982-10-25 Mitsubishi Heavy Ind Ltd Continuous mixer for powdered body milk of cement, etc.
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
EP0092019A3 (en) * 1982-04-19 1985-12-27 Olin Corporation Improved semiconductor package
US4819041A (en) * 1983-12-30 1989-04-04 Amp Incorporated Surface mounted integrated circuit chip package and method for making same
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
DE69010546T2 (de) * 1989-04-17 1995-02-09 Matsushita Electric Ind Co Ltd Hochfrequenz-Halbleiteranordnung.
DE3912893A1 (de) * 1989-04-19 1990-10-25 Siemens Ag Als mikropack montierte halbleiteranordnung
US5077598A (en) * 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
US5639990A (en) * 1992-06-05 1997-06-17 Mitsui Toatsu Chemicals, Inc. Solid printed substrate and electronic circuit package using the same
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
CA2302957C (en) * 1999-03-24 2009-06-30 Morgan Adhesives Company Circuit chip connector and method of connecting a circuit chip
EP1109214A1 (de) 1999-12-16 2001-06-20 Infineon Technologies AG Anordnung und Verfahren zur Kontaktierung von Schaltkreisen
RU2190768C1 (ru) * 2001-02-07 2002-10-10 Военный автомобильный институт Каталитический нейтрализатор для двс
NL1021245C2 (nl) * 2002-08-09 2004-02-10 Tno Drager voor tenminste een IC en systemen omvattende een dergelijke drager en een IC en/of een dergelijke drager en een verbindingsplaat.
US20050282355A1 (en) * 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices
DE102004030383A1 (de) * 2004-06-23 2006-01-12 Infineon Technologies Ag Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung
US8067253B2 (en) * 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
US3743893A (en) * 1971-05-27 1973-07-03 Mitsubishi Electric Corp Fluid cooled compression bonded semiconductor device structure
DE2253627A1 (de) * 1972-11-02 1974-05-16 Philips Patentverwaltung Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement

Also Published As

Publication number Publication date
DE2853328A1 (de) 1979-06-21
FR2412167B1 (OSRAM) 1984-10-19
GB2010013B (en) 1982-02-17
JPS5746662B2 (OSRAM) 1982-10-05
NL7713758A (nl) 1979-06-15
FR2412167A1 (fr) 1979-07-13
JPS5489571A (en) 1979-07-16
DE2853328C2 (de) 1985-08-01
GB2010013A (en) 1979-06-20
US4215359A (en) 1980-07-29

Similar Documents

Publication Publication Date Title
BR7900229A (pt) Dispositivo semicondutor
AT358639B (de) Lichtaussendende halbleitereinrichtung
SE410911B (sv) Halvledaranordning
SE7803106L (sv) Halvledaranordning
SE7800917L (sv) Halvledaranordning
SE7900083L (sv) Halvledaranordning
NL191914C (nl) Halfgeleiderinrichting.
SE7701434L (sv) Halvledaranordning
SE7701316L (sv) Halvledaranordning
BR7803561A (pt) Dispositivo e conjunto semicondutor
SE7810315L (sv) Halvledaranordning
SE7709146L (sv) Halvledaranordning
BR7705488A (pt) Dispositivo semicondutor
BR7800627A (pt) Dispositivo semicondutor
SE7902980L (sv) Halvledaranordning
SE7709019L (sv) Halvledaranordning
DE3022122A1 (de) Halbleitervorrichtung
IT7831321A0 (it) Dispositivo semiconduttore.
SE7805782L (sv) Halvledaranordning
BR8000967A (pt) Dispositivo semicondutor
SE7709857L (sv) Halvledardiodanordning
BR7904692A (pt) Dispositivo semicondutor
BR7800732A (pt) Dispositivo semi-condutor
SE8001042L (sv) Halvledaranordning
SE7606293L (sv) Halvledaranordning