BR7105954D0 - Um processo para prevenir a formacao de bolhas dos revestimentos de cobre depositados eletroliticamente sobre substratos de cobre - Google Patents

Um processo para prevenir a formacao de bolhas dos revestimentos de cobre depositados eletroliticamente sobre substratos de cobre

Info

Publication number
BR7105954D0
BR7105954D0 BR5954/71A BR595471A BR7105954D0 BR 7105954 D0 BR7105954 D0 BR 7105954D0 BR 5954/71 A BR5954/71 A BR 5954/71A BR 595471 A BR595471 A BR 595471A BR 7105954 D0 BR7105954 D0 BR 7105954D0
Authority
BR
Brazil
Prior art keywords
copper
eletrolitically
deposited
bubble formation
prevent bubble
Prior art date
Application number
BR5954/71A
Other languages
English (en)
Portuguese (pt)
Inventor
C Hamilton
E Oles
Original Assignee
Uss Eng & Consult
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uss Eng & Consult filed Critical Uss Eng & Consult
Publication of BR7105954D0 publication Critical patent/BR7105954D0/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C23/00—Tools; Devices not mentioned before for moulding
    • B22C23/02—Devices for coating moulds or cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Mold Materials And Core Materials (AREA)
BR5954/71A 1970-09-11 1971-09-10 Um processo para prevenir a formacao de bolhas dos revestimentos de cobre depositados eletroliticamente sobre substratos de cobre BR7105954D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7155970A 1970-09-11 1970-09-11

Publications (1)

Publication Number Publication Date
BR7105954D0 true BR7105954D0 (pt) 1973-04-05

Family

ID=22102108

Family Applications (1)

Application Number Title Priority Date Filing Date
BR5954/71A BR7105954D0 (pt) 1970-09-11 1971-09-10 Um processo para prevenir a formacao de bolhas dos revestimentos de cobre depositados eletroliticamente sobre substratos de cobre

Country Status (12)

Country Link
US (1) US3671407A (OSRAM)
JP (1) JPS5625519B1 (OSRAM)
BE (1) BE772249A (OSRAM)
BR (1) BR7105954D0 (OSRAM)
CA (1) CA999554A (OSRAM)
DE (1) DE2144280C3 (OSRAM)
ES (1) ES394896A1 (OSRAM)
FR (1) FR2106446B1 (OSRAM)
GB (1) GB1369507A (OSRAM)
IT (1) IT939804B (OSRAM)
NL (1) NL7112504A (OSRAM)
ZA (1) ZA715792B (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
EP0342669B1 (en) * 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
DE202009013126U1 (de) * 2009-09-29 2009-12-10 Egon Evertz Kg (Gmbh & Co.) Kokille zum Stranggießen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2461228A (en) * 1949-02-08 Donald lee miles
US1918159A (en) * 1932-01-19 1933-07-11 Weisberg & Greenwald Inc Electrodeposition
US1995200A (en) * 1932-08-30 1935-03-19 Union Switch & Signal Co Manufacture of photo-electric cells
DE715515C (de) * 1940-04-27 1942-01-03 Richard Beck Verfahren zur anodischen Vorbehandlung zuvor in ueblicher Weise entfetteter Metalloberflaechen
US3202589A (en) * 1963-09-12 1965-08-24 Diamond Alkali Co Electroplating

Also Published As

Publication number Publication date
US3671407A (en) 1972-06-20
NL7112504A (OSRAM) 1972-03-14
BE772249A (fr) 1972-03-06
GB1369507A (en) 1974-10-09
IT939804B (it) 1973-02-10
AU3301871A (en) 1973-03-08
DE2144280C3 (de) 1982-05-27
DE2144280A1 (de) 1972-03-16
JPS5625519B1 (OSRAM) 1981-06-12
FR2106446A1 (OSRAM) 1972-05-05
ES394896A1 (es) 1974-12-01
FR2106446B1 (OSRAM) 1975-07-11
DE2144280B2 (de) 1980-04-10
CA999554A (en) 1976-11-09
ZA715792B (en) 1972-04-26

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