BR6913676D0 - Processo de fabricacao de dispositivos semicondutores - Google Patents
Processo de fabricacao de dispositivos semicondutoresInfo
- Publication number
- BR6913676D0 BR6913676D0 BR213676/69A BR21367669A BR6913676D0 BR 6913676 D0 BR6913676 D0 BR 6913676D0 BR 213676/69 A BR213676/69 A BR 213676/69A BR 21367669 A BR21367669 A BR 21367669A BR 6913676 D0 BR6913676 D0 BR 6913676D0
- Authority
- BR
- Brazil
- Prior art keywords
- manufacturing process
- semiconductor devices
- devices manufacturing
- semiconductor
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB5103568 | 1968-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR6913676D0 true BR6913676D0 (pt) | 1973-01-11 |
Family
ID=10458386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR213676/69A BR6913676D0 (pt) | 1968-10-28 | 1969-10-27 | Processo de fabricacao de dispositivos semicondutores |
Country Status (4)
| Country | Link |
|---|---|
| AT (1) | AT324435B (pt) |
| BG (1) | BG19606A3 (pt) |
| BR (1) | BR6913676D0 (pt) |
| ZA (1) | ZA696999B (pt) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10029035C1 (de) * | 2000-06-13 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Bearbeitung eines Wafers |
-
1969
- 1969-10-03 ZA ZA696999A patent/ZA696999B/xx unknown
- 1969-10-21 AT AT992372*1A patent/AT324435B/de not_active IP Right Cessation
- 1969-10-27 BR BR213676/69A patent/BR6913676D0/pt unknown
- 1969-10-27 BG BG013254A patent/BG19606A3/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AT324435B (de) | 1975-08-25 |
| ZA696999B (en) | 1971-05-27 |
| BG19606A3 (bg) | 1975-06-25 |
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