ZA696999B - Semi-conductor devices - Google Patents
Semi-conductor devicesInfo
- Publication number
- ZA696999B ZA696999B ZA696999A ZA696999A ZA696999B ZA 696999 B ZA696999 B ZA 696999B ZA 696999 A ZA696999 A ZA 696999A ZA 696999 A ZA696999 A ZA 696999A ZA 696999 B ZA696999 B ZA 696999B
- Authority
- ZA
- South Africa
- Prior art keywords
- semi
- conductor devices
- conductor
- devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5103568 | 1968-10-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA696999B true ZA696999B (en) | 1971-05-27 |
Family
ID=10458386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA696999A ZA696999B (en) | 1968-10-28 | 1969-10-03 | Semi-conductor devices |
Country Status (4)
Country | Link |
---|---|
AT (1) | AT324435B (xx) |
BG (1) | BG19606A3 (xx) |
BR (1) | BR6913676D0 (xx) |
ZA (1) | ZA696999B (xx) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10029035C1 (de) * | 2000-06-13 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Bearbeitung eines Wafers |
-
1969
- 1969-10-03 ZA ZA696999A patent/ZA696999B/xx unknown
- 1969-10-21 AT AT992372*1A patent/AT324435B/de not_active IP Right Cessation
- 1969-10-27 BR BR213676/69A patent/BR6913676D0/pt unknown
- 1969-10-27 BG BG013254A patent/BG19606A3/xx unknown
Also Published As
Publication number | Publication date |
---|---|
AT324435B (de) | 1975-08-25 |
BG19606A3 (bg) | 1975-06-25 |
BR6913676D0 (pt) | 1973-01-11 |
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