BR112019008552A2 - dispositivo de evacuação de calor - Google Patents

dispositivo de evacuação de calor

Info

Publication number
BR112019008552A2
BR112019008552A2 BR112019008552A BR112019008552A BR112019008552A2 BR 112019008552 A2 BR112019008552 A2 BR 112019008552A2 BR 112019008552 A BR112019008552 A BR 112019008552A BR 112019008552 A BR112019008552 A BR 112019008552A BR 112019008552 A2 BR112019008552 A2 BR 112019008552A2
Authority
BR
Brazil
Prior art keywords
electronics
stage
evacuation device
chassis
drain
Prior art date
Application number
BR112019008552A
Other languages
English (en)
Other versions
BR112019008552B1 (pt
Inventor
Tisne Alain
Bourgoin Gilles
Original Assignee
Sagemcom Broadband Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagemcom Broadband Sas filed Critical Sagemcom Broadband Sas
Publication of BR112019008552A2 publication Critical patent/BR112019008552A2/pt
Publication of BR112019008552B1 publication Critical patent/BR112019008552B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers

Abstract

dispositivo de evacuação que compreende: um dissipador térmico (16) montado sobre uma platina (14) para que o dissipador se estenda acima e à distância de um componente eletrônico; um chassi (17) que se estende entre o componente eletrônico e a platina, e meios de fixação do chassi na platina ou na placa eletrônica; um dreno térmico rígido (18) que é montado sobre o chassi para deslizar perpendicularmente à placa eletrônica (12) e que tem uma primeira extremidade de contato com o componente e uma segunda extremidade em apoio sobre uma camada termicamente condutora (19) fixada na platina para solicitar elasticamente o dreno térmico rígido (18) em apoio contra o componente eletrônico (11) qualquer que seja a espessura do componente eletrônico. equipamento eletrônico que compreende um tal dispositivo de evacuação.
BR112019008552-1A 2016-11-30 2017-11-16 Dispositivo de evacuação de calor e equipamento eletrônico BR112019008552B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1661677A FR3059466B1 (fr) 2016-11-30 2016-11-30 Dispositif d'evacuation de chaleur
FR1661677 2016-11-30
PCT/EP2017/079460 WO2018099729A1 (fr) 2016-11-30 2017-11-16 Dispositif d'evacuation de chaleur

Publications (2)

Publication Number Publication Date
BR112019008552A2 true BR112019008552A2 (pt) 2019-07-09
BR112019008552B1 BR112019008552B1 (pt) 2023-04-04

Family

ID=57755373

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112019008552-1A BR112019008552B1 (pt) 2016-11-30 2017-11-16 Dispositivo de evacuação de calor e equipamento eletrônico

Country Status (6)

Country Link
US (1) US10665527B2 (pt)
EP (1) EP3549164B1 (pt)
CN (1) CN110024109B (pt)
BR (1) BR112019008552B1 (pt)
FR (1) FR3059466B1 (pt)
WO (1) WO2018099729A1 (pt)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5805417A (en) * 1995-10-13 1998-09-08 Hitachi, Ltd. Heat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit board
US5804875A (en) * 1996-12-10 1998-09-08 Dell Computer Corporation Computer system with heat sink having an integrated grounding tab
US6705388B1 (en) * 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
JP4079604B2 (ja) * 2001-05-30 2008-04-23 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4265307B2 (ja) * 2003-06-27 2009-05-20 パナソニック株式会社 電子冷却装置とそれを備えた機器
JP2005109005A (ja) * 2003-09-29 2005-04-21 Murata Mfg Co Ltd モジュールの放熱構造
DE102006023123B4 (de) * 2005-06-01 2011-01-13 Infineon Technologies Ag Abstandserfassungsradar für Fahrzeuge mit einem Halbleitermodul mit Komponenten für Höchstfrequenztechnik in Kunststoffgehäuse und Verfahren zur Herstellung eines Halbleitermoduls mit Komponenten für ein Abstandserfassungsradar für Fahrzeuge in einem Kunststoffgehäuse
JP2006210940A (ja) * 2006-03-23 2006-08-10 Mitsubishi Electric Corp 通信機器
US20090200007A1 (en) * 2008-02-13 2009-08-13 Lockheed Martin Corporation Heat exchanger having temperature-actuated valves
JP5322282B2 (ja) * 2009-04-24 2013-10-23 Ｎｅｃエンジニアリング株式会社 電子機器の放熱装置
US9888568B2 (en) * 2012-02-08 2018-02-06 Crane Electronics, Inc. Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
WO2015111242A1 (ja) * 2014-01-21 2015-07-30 富士通株式会社 放熱部品、放熱部品の製造方法、電子装置、電子装置の製造方法、一体型モジュール、情報処理システム
JP2016096249A (ja) * 2014-11-14 2016-05-26 富士通株式会社 シールドカバー及び電子装置
TWI618477B (zh) * 2016-02-25 2018-03-11 台達電子工業股份有限公司 射頻放大系統及其散熱裝置

Also Published As

Publication number Publication date
US10665527B2 (en) 2020-05-26
EP3549164B1 (fr) 2021-09-29
CN110024109B (zh) 2023-06-27
FR3059466A1 (fr) 2018-06-01
US20190341333A1 (en) 2019-11-07
EP3549164A1 (fr) 2019-10-09
FR3059466B1 (fr) 2019-07-05
CN110024109A (zh) 2019-07-16
WO2018099729A1 (fr) 2018-06-07
BR112019008552B1 (pt) 2023-04-04

Similar Documents

Publication Publication Date Title
BR112019000641A2 (pt) material de interface térmica do tipo gel
BR112014010607A2 (pt) refreador para reter um dissipador de calor
MY191083A (en) Electronic device having heat collection/diffusion structure
ATE527510T1 (de) Kühlsystem auf thermosiphonbasis mit niedrigem profil für computer und andere elektrische geräte
AR076174A1 (es) Sistema de refrigeracion de equipos compactos
BRPI0713191A2 (pt) dispositivo compreendendo um equipamento com uma fonte de calor e aeronave
NO20084351L (no) Baererlegeme for komponenter og kretser
TW200631491A (en) Sandwiched thermal solution
TW200943038A (en) Apparatuses and methods for dissipating heat from a computer component
BR112018010875A2 (pt) substrato de dissipação de calor e dispositivo de direção de potência elétrica
BR112018011113A2 (pt) estrutura de substrato tendo peças eletrônicas nele montadas e alojamento para acomodação do substrato
JP2015206815A5 (pt)
BR112017002082A2 (pt) órgão de resfriamento para sistema de iluminação e/ou de sinalização
TW200707167A (en) Housing for a computer
JP2016152536A5 (pt)
AR097348A1 (es) Sistemas de enfriamiento de dispositivos electrónicos
BR112016015445A8 (pt) motor magnético lateral e ventilador de resfriamento com o uso do motor magnético lateral
JP6885194B2 (ja) 電子機器
BR112015006787A2 (pt) componentes elétricos e métodos e sistemas de fabricação de componentes elétricos
BR112015011097A2 (pt) sistema de isolamento para um dispositivo eletrônico
BR112019008552A2 (pt) dispositivo de evacuação de calor
BR112016029109A2 (pt) montagem de resfriamento submarino.
BR112019005846A2 (pt) unidade de fonte de calor
BR112015004706A2 (pt) equipamento eletrônico resfriado por ar e dispositivo de resfriamento de um componente eletrônico
JP2012129379A (ja) 放熱フィン

Legal Events

Date Code Title Description
B350 Update of information on the portal [chapter 15.35 patent gazette]
B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 16/11/2017, OBSERVADAS AS CONDICOES LEGAIS