BR112018010666A8 - dispositivo elétrico com camada de máscara de solda fina e método para produção - Google Patents

dispositivo elétrico com camada de máscara de solda fina e método para produção

Info

Publication number
BR112018010666A8
BR112018010666A8 BR112018010666A BR112018010666A BR112018010666A8 BR 112018010666 A8 BR112018010666 A8 BR 112018010666A8 BR 112018010666 A BR112018010666 A BR 112018010666A BR 112018010666 A BR112018010666 A BR 112018010666A BR 112018010666 A8 BR112018010666 A8 BR 112018010666A8
Authority
BR
Brazil
Prior art keywords
mask layer
fixture
production method
welding mask
thin welding
Prior art date
Application number
BR112018010666A
Other languages
English (en)
Portuguese (pt)
Other versions
BR112018010666A2 (pt
Inventor
Schmajew Alexander
Original Assignee
Snaptrack Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snaptrack Inc filed Critical Snaptrack Inc
Publication of BR112018010666A2 publication Critical patent/BR112018010666A2/pt
Publication of BR112018010666A8 publication Critical patent/BR112018010666A8/pt

Links

Classifications

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    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/384—Bump effects
    • H01L2924/3841—Solder bridging

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
BR112018010666A 2015-11-27 2016-09-06 dispositivo elétrico com camada de máscara de solda fina e método para produção BR112018010666A8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015120647.1A DE102015120647B4 (de) 2015-11-27 2015-11-27 Elektrisches Bauelement mit dünner Lot-Stopp-Schicht und Verfahren zur Herstellung
PCT/EP2016/070973 WO2017088998A1 (de) 2015-11-27 2016-09-06 Elektrisches bauelement mit dünner lot-stopp-schicht und verfahren zu seiner herstellung

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BR112018010666A2 BR112018010666A2 (pt) 2018-11-13
BR112018010666A8 true BR112018010666A8 (pt) 2019-02-26

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EP (1) EP3381052A1 (enExample)
JP (1) JP2018536994A (enExample)
KR (1) KR20180088798A (enExample)
CN (1) CN108369935A (enExample)
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DE (1) DE102015120647B4 (enExample)
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Publication number Priority date Publication date Assignee Title
FI130166B (en) 2019-03-08 2023-03-23 Picosun Oy Solder mask
DE102023116055A1 (de) * 2023-06-20 2024-12-24 Ams-Osram International Gmbh Anschlussträger, verfahren zur herstellung einer lotverbindung und bauelement

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US6645791B2 (en) * 2001-04-23 2003-11-11 Fairchild Semiconductor Semiconductor die package including carrier with mask
WO2004027850A1 (en) * 2002-09-20 2004-04-01 Honeywell International, Inc. Interlayer adhesion promoter for low k materials
JP2006511938A (ja) * 2002-12-20 2006-04-06 アギア システムズ インコーポレーテッド 銅相互接続構造に結合するための構造および方法
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CN108369935A (zh) 2018-08-03
KR20180088798A (ko) 2018-08-07
WO2017088998A1 (de) 2017-06-01
DE102015120647B4 (de) 2017-12-28
US20180331062A1 (en) 2018-11-15
BR112018010666A2 (pt) 2018-11-13
EP3381052A1 (de) 2018-10-03
JP2018536994A (ja) 2018-12-13
DE102015120647A1 (de) 2017-06-01

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