BR112017002554B1 - Unidade de controle eletrônico e processo para produção de uma unidade de controle eletrônico - Google Patents
Unidade de controle eletrônico e processo para produção de uma unidade de controle eletrônico Download PDFInfo
- Publication number
- BR112017002554B1 BR112017002554B1 BR112017002554-0A BR112017002554A BR112017002554B1 BR 112017002554 B1 BR112017002554 B1 BR 112017002554B1 BR 112017002554 A BR112017002554 A BR 112017002554A BR 112017002554 B1 BR112017002554 B1 BR 112017002554B1
- Authority
- BR
- Brazil
- Prior art keywords
- circuit support
- region
- control unit
- tool
- connection region
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000000465 moulding Methods 0.000 claims abstract description 58
- 238000007789 sealing Methods 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000004519 grease Substances 0.000 abstract 1
- OPFJDXRVMFKJJO-ZHHKINOHSA-N N-{[3-(2-benzamido-4-methyl-1,3-thiazol-5-yl)-pyrazol-5-yl]carbonyl}-G-dR-G-dD-dD-dD-NH2 Chemical compound S1C(C=2NN=C(C=2)C(=O)NCC(=O)N[C@H](CCCN=C(N)N)C(=O)NCC(=O)N[C@H](CC(O)=O)C(=O)N[C@H](CC(O)=O)C(=O)N[C@H](CC(O)=O)C(N)=O)=C(C)N=C1NC(=O)C1=CC=CC=C1 OPFJDXRVMFKJJO-ZHHKINOHSA-N 0.000 description 6
- 239000004927 clay Substances 0.000 description 6
- 229940126086 compound 21 Drugs 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 229920000965 Duroplast Polymers 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14418—Sealing means between mould and article
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014216518.0 | 2014-08-20 | ||
DE102014216518.0A DE102014216518A1 (de) | 2014-08-20 | 2014-08-20 | Elektronische Steuereinheit sowie Moldwerkzeug und Verfahren zum Herstellen einer elektronischen Steuereinheit |
PCT/EP2015/067948 WO2016026692A1 (de) | 2014-08-20 | 2015-08-04 | Elektronische steuereinheit sowie moldwerkzeug und verfahren zum herstellen einer elektronischen steuereinheit |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112017002554A2 BR112017002554A2 (pt) | 2017-12-05 |
BR112017002554B1 true BR112017002554B1 (pt) | 2022-11-29 |
Family
ID=53785640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112017002554-0A BR112017002554B1 (pt) | 2014-08-20 | 2015-08-04 | Unidade de controle eletrônico e processo para produção de uma unidade de controle eletrônico |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3183946A1 (ko) |
KR (1) | KR102382143B1 (ko) |
CN (1) | CN106660243B (ko) |
BR (1) | BR112017002554B1 (ko) |
DE (1) | DE102014216518A1 (ko) |
FR (1) | FR3025062B1 (ko) |
WO (1) | WO2016026692A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018220012A1 (de) * | 2018-11-22 | 2020-05-28 | Zf Friedrichshafen Ag | Leiterplatte, Umspritzwerkzeug und Verfahren zum Umspritzen einer Leiterplatte |
DE102019203422A1 (de) * | 2019-03-13 | 2020-09-17 | Robert Bosch Gmbh | Adapterelement für eine Getriebe-Antriebseinrichtung, Getriebe-Antriebseinrichtung und Werkzeug zur Herstellung eines Adapterelements |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2559834B2 (ja) * | 1989-01-12 | 1996-12-04 | 三菱電機株式会社 | Icカード |
TW560241B (en) * | 2001-05-18 | 2003-11-01 | Hosiden Corp | Printed circuit board mounted connector |
JP3829327B2 (ja) * | 2002-05-20 | 2006-10-04 | 日本電気株式会社 | カードエッジコネクタ及びカード部材 |
JP4478007B2 (ja) * | 2004-12-16 | 2010-06-09 | 日立オートモティブシステムズ株式会社 | 電子回路装置及びその製造方法 |
JP2007109499A (ja) * | 2005-10-13 | 2007-04-26 | Fujitsu Ltd | コンタクト部材、コネクタ、基板、およびコネクタシステム |
US20070279877A1 (en) * | 2006-05-30 | 2007-12-06 | Stephan Dobritz | Circuit board arrangement |
DE202010018233U1 (de) * | 2010-08-08 | 2015-01-21 | Ssb Wind Systems Gmbh & Co. Kg | Elektrische Vorrichtung |
DE102011055442A1 (de) | 2011-11-17 | 2013-05-23 | Rud. Starcke Gmbh & Co. Kg | Flächiges, stauboffenes Schleifelement |
DE102011122037A1 (de) * | 2011-12-22 | 2013-06-27 | Kathrein-Werke Kg | Verfahren zur Herstellung einer elektrischen Hochfrequenz-Verbindung zwischen zwei Plattenabschnitten sowie eine zugehörige elektrische Hochfrequenz-Verbindung |
DE102012204904A1 (de) * | 2012-03-27 | 2013-10-02 | Robert Bosch Gmbh | Sensoreinheit |
DE102012213917A1 (de) * | 2012-08-06 | 2014-02-20 | Robert Bosch Gmbh | Bauelemente-Ummantelung für ein Elektronikmodul |
WO2014122867A1 (ja) * | 2013-02-08 | 2014-08-14 | 株式会社ケーヒン | 電子回路装置及びその製造方法 |
-
2014
- 2014-08-20 DE DE102014216518.0A patent/DE102014216518A1/de not_active Withdrawn
-
2015
- 2015-08-04 EP EP15747796.9A patent/EP3183946A1/de not_active Withdrawn
- 2015-08-04 WO PCT/EP2015/067948 patent/WO2016026692A1/de active Application Filing
- 2015-08-04 CN CN201580044043.2A patent/CN106660243B/zh active Active
- 2015-08-04 BR BR112017002554-0A patent/BR112017002554B1/pt active IP Right Grant
- 2015-08-04 KR KR1020177004438A patent/KR102382143B1/ko active IP Right Grant
- 2015-08-13 FR FR1557722A patent/FR3025062B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
CN106660243A (zh) | 2017-05-10 |
FR3025062A1 (fr) | 2016-02-26 |
FR3025062B1 (fr) | 2019-07-12 |
KR102382143B1 (ko) | 2022-04-05 |
DE102014216518A1 (de) | 2016-02-25 |
BR112017002554A2 (pt) | 2017-12-05 |
CN106660243B (zh) | 2019-03-05 |
KR20170043535A (ko) | 2017-04-21 |
EP3183946A1 (de) | 2017-06-28 |
WO2016026692A1 (de) | 2016-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 04/08/2015, OBSERVADAS AS CONDICOES LEGAIS |