BR112016029321A2 - método de formação de um dispositivo eletrônico sobre um substrato flexível - Google Patents

método de formação de um dispositivo eletrônico sobre um substrato flexível

Info

Publication number
BR112016029321A2
BR112016029321A2 BR112016029321A BR112016029321A BR112016029321A2 BR 112016029321 A2 BR112016029321 A2 BR 112016029321A2 BR 112016029321 A BR112016029321 A BR 112016029321A BR 112016029321 A BR112016029321 A BR 112016029321A BR 112016029321 A2 BR112016029321 A2 BR 112016029321A2
Authority
BR
Brazil
Prior art keywords
flexible substrate
electronic device
forming
porous membrane
deposited
Prior art date
Application number
BR112016029321A
Other languages
English (en)
Inventor
Merkoçi Hyka Arben
Clotilde Mayorga Martínez Carmen
Miguel Baptista Pires Luiz
Original Assignee
Fundacio Inst Catala De Nanociencia I Nanotecnologia
Inst Catalana Recerca Estudis Avancats
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fundacio Inst Catala De Nanociencia I Nanotecnologia, Inst Catalana Recerca Estudis Avancats filed Critical Fundacio Inst Catala De Nanociencia I Nanotecnologia
Publication of BR112016029321A2 publication Critical patent/BR112016029321A2/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
    • B01D67/0002—Organic membrane manufacture
    • B01D67/0023—Organic membrane manufacture by inducing porosity into non porous precursor membranes
    • B01D67/0032—Organic membrane manufacture by inducing porosity into non porous precursor membranes by elimination of segments of the precursor, e.g. nucleation-track membranes, lithography or laser methods
    • B01D67/0034—Organic membrane manufacture by inducing porosity into non porous precursor membranes by elimination of segments of the precursor, e.g. nucleation-track membranes, lithography or laser methods by micromachining techniques, e.g. using masking and etching steps, photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
    • B01D69/02—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor characterised by their properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/02—Inorganic material
    • B01D71/021—Carbon
    • B01D71/0211—Graphene or derivates thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/06—Organic material
    • B01D71/08—Polysaccharides
    • B01D71/12—Cellulose derivatives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Printing Methods (AREA)
  • Electroluminescent Light Sources (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

resumo "método de formação de um dispositivo eletrônico sobre um substrato flexível" a presente invenção se refere a um método de formação de um dispositivo eletrônico (20) sobre um substrato flexível (30) sem o uso de um dissolvente à base de acetona, o método compreendendo as etapas de: imprimir uma máscara hidrófoba (12) sobre uma membrana porosa (10) de modo a formar uma estampa sobre a mesma, complementar a uma estampa desejada; filtrar uma suspensão aquosa de um material eletrônico (22) através da região não impressa (11) da membrana porosa, em função do que uma determinada quantidade de material eletrônico é depositada sobre a dita região não impressa seguindo a estampa desejada; pressionar o substrato flexível contra a face impressa da membrana a fim de transferir o material eletrônico estampado que é depositado sobre a membrana porosa para o substrato flexível de modo a formar o dispositivo eletrônico sobre o mesmo.
BR112016029321A 2014-06-20 2015-06-19 método de formação de um dispositivo eletrônico sobre um substrato flexível BR112016029321A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14382240 2014-06-20
PCT/EP2015/063842 WO2015193486A1 (en) 2014-06-20 2015-06-19 Method of forming an electronic device on a flexible substrate

Publications (1)

Publication Number Publication Date
BR112016029321A2 true BR112016029321A2 (pt) 2017-08-22

Family

ID=51211160

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016029321A BR112016029321A2 (pt) 2014-06-20 2015-06-19 método de formação de um dispositivo eletrônico sobre um substrato flexível

Country Status (13)

Country Link
US (1) US20170123310A1 (pt)
EP (1) EP3158397B1 (pt)
JP (1) JP6734787B2 (pt)
KR (1) KR102375841B1 (pt)
CN (1) CN106662805B (pt)
AU (1) AU2015276028A1 (pt)
BR (1) BR112016029321A2 (pt)
CA (1) CA2954435C (pt)
DK (1) DK3158397T3 (pt)
ES (1) ES2664346T3 (pt)
IL (1) IL249534B (pt)
SG (1) SG11201610437TA (pt)
WO (1) WO2015193486A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3530617A1 (en) 2018-02-27 2019-08-28 Fundacio Privada Institut Catala de Nanociencia I Nanotecnologia (ICN2) Method of forming a porous graphene-based macroscopic structure
KR102130323B1 (ko) * 2018-06-04 2020-07-06 한국화학연구원 기능성 물질을 이용한 패턴 필름의 제조방법 및 기능성 물질을 이용한 패턴 필름의 전사방법
JP7190129B2 (ja) * 2018-10-01 2022-12-15 ヒューグルエレクトロニクス株式会社 イオン分布可視化装置及びイオン分布可視化システム
EP3772086A1 (en) 2019-08-01 2021-02-03 Fundació Institut Català de Nanociència i Nanotecnologia (ICN2) Method to form a laser-scribed rgo pattern on a substrate
CN110972411B (zh) * 2019-10-22 2022-12-06 深圳丹邦科技股份有限公司 基于量子碳基膜的柔性线路板基材及其制备方法
CN110658677B (zh) * 2019-11-12 2021-08-13 京东方科技集团股份有限公司 一种压印方法、压印结构及显示基板
CN111554756B (zh) * 2020-05-15 2022-04-15 京东方科技集团股份有限公司 光电探测器、显示基板
US20230127465A1 (en) * 2021-10-26 2023-04-27 Ford Global Technologies, Llc System and method for approaching vehicle detection

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Publication number Priority date Publication date Assignee Title
JPH11174017A (ja) * 1997-12-08 1999-07-02 Akebono Brake Res & Dev Center Ltd 微生物電極及び微生物センサ
JP2003262635A (ja) * 2002-03-08 2003-09-19 Nitto Denko Corp 吸水性基材を用いた、生物学的親和性に基づく物質の測定方法およびそのためのキット
AU2003249324A1 (en) * 2002-07-19 2004-02-09 University Of Florida Transparent electrodes from single wall carbon nanotubes
KR100719547B1 (ko) * 2005-03-24 2007-05-17 삼성에스디아이 주식회사 유기박막 패터닝방법, 이를 이용한 유기박막 트랜지스터 및그의 제조방법과 유기 박막 트랜지스터를 구비한평판표시장치
JP2009509358A (ja) * 2005-09-21 2009-03-05 ユニバーシティ オブ フロリダ リサーチ ファンデーション インコーポレーティッド パターン化導電性薄膜を形成するための低温法およびそれに由来するパターン化物品
US8540922B2 (en) * 2007-08-27 2013-09-24 Hewlett-Packard Development Company, L.P. Laser patterning of a carbon nanotube layer
US8847313B2 (en) * 2008-11-24 2014-09-30 University Of Southern California Transparent electronics based on transfer printed carbon nanotubes on rigid and flexible substrates
KR101502172B1 (ko) * 2008-12-12 2015-03-13 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
CN102452239A (zh) * 2010-10-22 2012-05-16 韩国科学技术院 图案转印方法和图案转印装置以及利用该方法制造的产品
JP2013058599A (ja) * 2011-09-08 2013-03-28 Sumitomo Chemical Co Ltd 有機半導体素子用電極及びその製造方法
LT5943B (lt) * 2011-10-20 2013-06-25 Vilniaus Universitetas Plono elektrai laidaus permatomo grafeno sluoksnio gamybos būdas

Also Published As

Publication number Publication date
JP6734787B2 (ja) 2020-08-05
KR102375841B1 (ko) 2022-03-17
JP2017526165A (ja) 2017-09-07
EP3158397B1 (en) 2018-01-03
US20170123310A1 (en) 2017-05-04
CA2954435A1 (en) 2015-12-23
KR20170023959A (ko) 2017-03-06
AU2015276028A1 (en) 2017-02-02
EP3158397A1 (en) 2017-04-26
IL249534A0 (en) 2017-02-28
DK3158397T3 (en) 2018-04-16
CN106662805A (zh) 2017-05-10
CA2954435C (en) 2023-02-14
SG11201610437TA (en) 2017-01-27
ES2664346T3 (es) 2018-04-19
IL249534B (en) 2021-12-01
CN106662805B (zh) 2020-07-28
WO2015193486A1 (en) 2015-12-23

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]