BR112015030279A2 - sensor ultrassônico com camada piezelétrica ligada - Google Patents

sensor ultrassônico com camada piezelétrica ligada

Info

Publication number
BR112015030279A2
BR112015030279A2 BR112015030279A BR112015030279A BR112015030279A2 BR 112015030279 A2 BR112015030279 A2 BR 112015030279A2 BR 112015030279 A BR112015030279 A BR 112015030279A BR 112015030279 A BR112015030279 A BR 112015030279A BR 112015030279 A2 BR112015030279 A2 BR 112015030279A2
Authority
BR
Brazil
Prior art keywords
ultrasonic sensor
piezoelectric layer
pixel
methods
ultrasonic
Prior art date
Application number
BR112015030279A
Other languages
English (en)
Inventor
william burns David
Conway Ii Kitchens Jack
keith schneider John
Dimitrov Djordjev Kostadin
Andrew Lavery Kristopher
Eugene Fennell Leonard
Robert Bennett Nathaniel
Ian Buchan Nicholas
Michael Gojevic Setephen
Original Assignee
Qualcomm Mems Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Mems Technologies Inc filed Critical Qualcomm Mems Technologies Inc
Publication of BR112015030279A2 publication Critical patent/BR112015030279A2/pt

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1306Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/03Assembling devices that include piezoelectric or electrostrictive parts
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Human Computer Interaction (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Thin Film Transistor (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

1/1 resumo sensor ultrassônico com camada piezelétrica ligada essa revelação proporciona sistemas, métodos e aparelho relacionados a um sensor ultrassônico para detectar energia ultrassônica. em algumas implementações, o sensor ultrassônico inclui uma camada de receptor piezelétrico ligada com um adesivo a um arranjo de circuitos de pixels dispostos sobre um substrato, cada circuito de pixel no arranjo incluindo pelo menos um elemento de transistor de película fina (tft) e tendo um eletrodo de entrada de pixel acoplada eletricamente ao circuito de pixel. métodos de formar os sensores ultrassônicos incluem ligar as camadas de receptor piezelétrico aos arranjos tft.
BR112015030279A 2013-06-03 2014-06-03 sensor ultrassônico com camada piezelétrica ligada BR112015030279A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361830615P 2013-06-03 2013-06-03
US14/293,841 US10036734B2 (en) 2013-06-03 2014-06-02 Ultrasonic sensor with bonded piezoelectric layer
PCT/US2014/040746 WO2014197504A1 (en) 2013-06-03 2014-06-03 Ultrasonic sensor with bonded piezoelectric layer

Publications (1)

Publication Number Publication Date
BR112015030279A2 true BR112015030279A2 (pt) 2017-07-25

Family

ID=51983611

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015030279A BR112015030279A2 (pt) 2013-06-03 2014-06-03 sensor ultrassônico com camada piezelétrica ligada

Country Status (8)

Country Link
US (1) US10036734B2 (pt)
EP (1) EP3005227B1 (pt)
JP (1) JP6254689B2 (pt)
KR (1) KR101890738B1 (pt)
CN (1) CN105264543B (pt)
BR (1) BR112015030279A2 (pt)
TW (1) TWI637190B (pt)
WO (1) WO2014197504A1 (pt)

Families Citing this family (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140355387A1 (en) 2013-06-03 2014-12-04 Qualcomm Incorporated Ultrasonic receiver with coated piezoelectric layer
CN107077588A (zh) * 2014-03-12 2017-08-18 艾戴克斯公司 指纹检测装置及其驱动方法
US9613246B1 (en) * 2014-09-16 2017-04-04 Apple Inc. Multiple scan element array ultrasonic biometric scanner
US9952095B1 (en) 2014-09-29 2018-04-24 Apple Inc. Methods and systems for modulation and demodulation of optical signals
US9979955B1 (en) 2014-09-30 2018-05-22 Apple Inc. Calibration methods for near-field acoustic imaging systems
US9747488B2 (en) 2014-09-30 2017-08-29 Apple Inc. Active sensing element for acoustic imaging systems
US9824254B1 (en) 2014-09-30 2017-11-21 Apple Inc. Biometric sensing device with discrete ultrasonic transducers
US9904836B2 (en) 2014-09-30 2018-02-27 Apple Inc. Reducing edge effects within segmented acoustic imaging systems
US9984271B1 (en) 2014-09-30 2018-05-29 Apple Inc. Ultrasonic fingerprint sensor in display bezel
US9607203B1 (en) 2014-09-30 2017-03-28 Apple Inc. Biometric sensing device with discrete ultrasonic transducers
US10133904B2 (en) 2014-09-30 2018-11-20 Apple Inc. Fully-addressable sensor array for acoustic imaging systems
CN104680126B (zh) 2014-11-24 2018-05-08 麦克思智慧资本股份有限公司 指纹识别装置及其制作方法
TWI585375B (zh) * 2014-12-05 2017-06-01 麥克思股份有限公司 超音波感測器及其製造方法
CN104553113A (zh) * 2014-12-11 2015-04-29 业成光电(深圳)有限公司 声波式指纹识别组件及其制造方法
CN104777483B (zh) * 2015-04-17 2017-09-29 业成光电(深圳)有限公司 高解析触觉感测装置
DE102015210384A1 (de) * 2015-06-05 2016-12-08 Soitec Verfahren zur mechanischen Trennung für eine Doppelschichtübertragung
CN105101002B (zh) * 2015-07-23 2018-10-09 京东方科技集团股份有限公司 一种音响装置和显示装置
US11048902B2 (en) 2015-08-20 2021-06-29 Appple Inc. Acoustic imaging system architecture
US10004432B2 (en) 2015-09-01 2018-06-26 Qualcomm Incorporated Pixel receiver with capacitance cancellation for ultrasonic imaging apparatus
US10275638B1 (en) 2015-09-29 2019-04-30 Apple Inc. Methods of biometric imaging of input surfaces
WO2017079496A1 (en) * 2015-11-04 2017-05-11 Quantum Technolgy Sciences, Inc. (Qtsi) Acoustic and seismic sensor device provding improved sensitivity
CN105445992A (zh) * 2015-12-02 2016-03-30 小米科技有限责任公司 液晶显示组件及电子设备
US9851848B2 (en) 2015-12-14 2017-12-26 Microsoft Technology Licensing, Llc Touch sensitive device casing
US11020057B2 (en) * 2016-02-12 2021-06-01 Qualcomm Incorporated Ultrasound devices for estimating blood pressure and other cardiovascular properties
CN105893985B (zh) * 2016-05-05 2018-04-03 京东方科技集团股份有限公司 显示装置及其制造方法
US11003884B2 (en) 2016-06-16 2021-05-11 Qualcomm Incorporated Fingerprint sensor device and methods thereof
CN105997146A (zh) * 2016-06-27 2016-10-12 麦克思商务咨询(深圳)有限公司 超声波传感器
TWI636511B (zh) * 2016-06-29 2018-09-21 致伸科技股份有限公司 超音波式指紋辨識模組及其製造方法
CN106203392B (zh) * 2016-07-25 2019-07-09 业成科技(成都)有限公司 电子装置
FR3054698B1 (fr) * 2016-07-29 2018-09-28 Commissariat A L'energie Atomique Et Aux Energies Alternatives Capteur de motif thermique actif comprenant une matrice passive de pixels
CN106332448B (zh) * 2016-08-06 2019-04-12 业成科技(成都)有限公司 超声波传感器及具有该超声波传感器的电子装置
US10095907B2 (en) 2016-08-11 2018-10-09 Qualcomm Incorporated Single transducer fingerprint system
EP3285207A1 (en) * 2016-08-16 2018-02-21 Guangdong Oppo Mobile Telecommunications Corp., Ltd Input assembly and manufacturing method
US20180055369A1 (en) * 2016-08-31 2018-03-01 Qualcomm Incorporated Layered sensing including rf-acoustic imaging
US10387706B2 (en) * 2016-09-05 2019-08-20 Nanchang O-Film Bio-Identification Technology Co., Ltd. Ultrasonic transducer of ultrasonic fingerprint sensor and manufacturing method thereof
CN109791081B (zh) * 2016-09-21 2022-02-11 株式会社村田制作所 压电传感器、触摸式输入装置
WO2018065582A1 (en) * 2016-10-07 2018-04-12 Jaguar Land Rover Limited Control unit
CN106373977B (zh) * 2016-10-09 2019-07-02 中山大学 一种光增强的振动能量采集器件和阵列
CN106557741A (zh) * 2016-10-20 2017-04-05 麦克思商务咨询(深圳)有限公司 指纹识别装置、其制造方法、显示装置
US10038264B2 (en) 2016-11-14 2018-07-31 Microsoft Technology Licensing, Llc Universal coupling for electrically connecting a flexible printed circuit to another flexible printed circuit in multiple different orientations
CN106775117B (zh) * 2017-01-13 2019-09-13 业成科技(成都)有限公司 声波式触控装置及应用该声波式触控装置的电子装置
CN106895862A (zh) * 2017-01-13 2017-06-27 麦克思商务咨询(深圳)有限公司 超声波元件
CN106895863B (zh) * 2017-01-13 2020-11-06 业成科技(成都)有限公司 超声波传感器及使用该超声波传感器的电子装置
CN106886753B (zh) * 2017-01-16 2020-12-15 业泓科技(成都)有限公司 声波式指纹识别装置应用其的电子装置
WO2018133059A1 (zh) * 2017-01-22 2018-07-26 深圳市汇顶科技股份有限公司 一种指纹模组
JP2018128990A (ja) * 2017-02-10 2018-08-16 アルプス電気株式会社 タッチパッドおよびその製造方法
CN108509829B (zh) * 2017-02-28 2019-11-26 京东方科技集团股份有限公司 显示基板及其驱动方法、显示装置
US10275634B2 (en) * 2017-03-16 2019-04-30 Qualcomm Incorporated Ultrasonic fingerprint sensor with acoustic shielding
CN107292226A (zh) * 2017-04-24 2017-10-24 麦克思商务咨询(深圳)有限公司 指纹识别装置及电子装置
CN107194324A (zh) * 2017-04-28 2017-09-22 广东欧珀移动通信有限公司 指纹识别区域显示方法及相关产品
CN107220630B (zh) * 2017-06-07 2021-09-03 京东方科技集团股份有限公司 显示基板及其驱动方法、显示装置
US20180373913A1 (en) * 2017-06-26 2018-12-27 Qualcomm Incorporated Ultrasonic fingerprint sensor for under-display applications
US20190025953A1 (en) * 2017-07-24 2019-01-24 Microsoft Technology Licensing, Llc Forming touch sensor on fabric
KR102376692B1 (ko) * 2017-07-31 2022-03-21 엘지이노텍 주식회사 압전 초음파 변환 장치, 이 장치를 포함하는 생체 정보 측정 장치 및 이 장치를 포함하는 디스플레이 장치
CN107426434B (zh) * 2017-08-01 2020-04-24 京东方科技集团股份有限公司 输入装置和电子设备
CN107657210A (zh) * 2017-08-07 2018-02-02 吴露 复合式指纹识别方法、复合式指纹识别模组及电子设备
CN107451573A (zh) * 2017-08-07 2017-12-08 吴露 复合式指纹识别模组、复合式指纹识别器件及电子设备
US10873020B2 (en) * 2017-08-08 2020-12-22 Texas Instruments Incorporated Piezoelectric sensing apparatus and method
CN109472182B (zh) * 2017-09-08 2020-09-22 茂丞科技(深圳)有限公司 晶圆级超声波芯片规模制造及封装方法
CN109492491B (zh) * 2017-09-12 2023-09-08 江西欧迈斯微电子有限公司 超声波指纹识别模组及电子设备制造方法
CN109492500B (zh) * 2017-09-12 2023-01-17 江西欧迈斯微电子有限公司 超声波生物识别装置及其制备方法和电子设备
CN109496085A (zh) * 2017-09-12 2019-03-19 南昌欧菲生物识别技术有限公司 盖板组件及其制造方法与电子装置
CN109492497A (zh) * 2017-09-12 2019-03-19 南昌欧菲生物识别技术有限公司 超声波指纹识别模组及电子设备制造方法
CN107665335B (zh) * 2017-09-18 2020-06-12 维沃移动通信有限公司 一种指纹识别模组和终端设备
EP3685309A4 (en) * 2017-09-22 2021-03-17 Fingerprint Cards AB ULTRASONIC TRANSDUCER DEVICE, ACOUSTIC BIOMETRIC IMAGING SYSTEM AND MANUFACTURING PROCESS
KR102541554B1 (ko) * 2017-09-29 2023-06-08 엘지이노텍 주식회사 압전 초음파 변환 장치, 이 장치를 포함하는 생체 정보 측정 장치 및 이 장치를 포함하는 디스플레이 장치
CN107565950B (zh) * 2017-10-23 2020-09-29 业成科技(成都)有限公司 触控开关及电子装置
FR3074575B1 (fr) * 2017-12-04 2020-10-16 Commissariat Energie Atomique Capteur de motif thermique a capacite pyroelectrique
KR20190066795A (ko) * 2017-12-06 2019-06-14 삼성전자주식회사 디스플레이와 초음파 센서 사이에 디스플레이에서 발생된 노이즈를 차단하기 위한 도전성 부재가 배치된 전자 장치
US10802651B2 (en) 2018-01-30 2020-10-13 Apple Inc. Ultrasonic touch detection through display
TWI662557B (zh) * 2018-02-12 2019-06-11 National Taipei University Of Technology 超音波傳感裝置
KR102481973B1 (ko) * 2018-02-14 2022-12-27 엘지이노텍 주식회사 압전 초음파 변환 장치, 이 장치를 포함하는 생체 정보 측정 장치 및 이 장치를 포함하는 디스플레이 장치
CN108491113B (zh) * 2018-03-05 2021-03-23 业成科技(成都)有限公司 超声波触控装置及其制作方法
CN108846318B (zh) * 2018-05-24 2021-08-31 业泓科技(成都)有限公司 超声波指纹识别装置及其制作方法以及应用其的电子装置
US11651610B2 (en) 2018-05-31 2023-05-16 Qualcomm Incorporated Heart rate and respiration rate measurement using a fingerprint sensor
CN108921115B (zh) * 2018-07-10 2022-04-22 京东方科技集团股份有限公司 超声波指纹识别传感器及其制作方法
CN108982668B (zh) * 2018-08-02 2021-09-24 武汉科技大学 传播方向可选、谐振频率可调的压电智能骨料
CN109330623A (zh) * 2018-10-11 2019-02-15 业成科技(成都)有限公司 超声波传感器及超声波传感器的制造方法
US11126814B2 (en) * 2018-10-17 2021-09-21 Qualcomm Incorporated Ultrasonic fingerprint sensor with flexible substrate
KR102646718B1 (ko) * 2018-11-16 2024-03-14 삼성디스플레이 주식회사 전자장치
US11476312B2 (en) * 2018-11-23 2022-10-18 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate comprising fingerprint recognition sensors, method for manufacturing the same, and display device
US10929636B2 (en) 2019-01-18 2021-02-23 Qualcomm Incorporated Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer
CN109815918B (zh) * 2019-01-28 2021-11-05 京东方科技集团股份有限公司 指纹识别模组及其制作方法和驱动方法、显示装置
US10891458B2 (en) * 2019-02-28 2021-01-12 Qualcomm Incorporated Module architecture for large area ultrasonic fingerprint sensor
FR3093801B1 (fr) * 2019-03-15 2021-04-16 Commissariat Energie Atomique Dispositif comprenant un substrat en verre ou en polymere recouvert par une couche en pvdf ou en un de ses copolymeres
US10877606B2 (en) * 2019-04-22 2020-12-29 Apple Inc. Method and apparatus for isolating ultrasonic touch sensor from reflections in a device housing
KR102662218B1 (ko) * 2019-06-17 2024-05-02 엘지디스플레이 주식회사 초음파 센서 및 디스플레이 장치
CN110245629B (zh) * 2019-06-19 2021-07-27 业成科技(成都)有限公司 电子装置及其制造方法
KR20210000766A (ko) * 2019-06-25 2021-01-06 삼성디스플레이 주식회사 초음파 감지 장치와 이를 포함하는 표시 장치
US11438703B2 (en) * 2019-06-27 2022-09-06 Qualcomm Incorporated Ultrasonic sensor array
CN110276325B (zh) * 2019-06-27 2021-09-03 京东方科技集团股份有限公司 超声波指纹识别组件、超声波指纹识别器件和显示装置
US11482663B2 (en) * 2019-06-28 2022-10-25 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectromechanical system with piezoelectric film and manufacturing method thereof
AU2020314327A1 (en) * 2019-07-16 2021-11-25 Smilesonica Inc. Ultrasound apparatus and related methods of use
CN110261480B (zh) * 2019-07-16 2024-03-12 中国工程物理研究院化工材料研究所 一种快速测试压电材料声发射响应性能的系统及方法
US20210056276A1 (en) * 2019-08-19 2021-02-25 Qualcomm Incorporated Apparatus and method for improved biometric sensing
CN110458135B (zh) * 2019-08-19 2022-04-15 京东方科技集团股份有限公司 一种超声波传感器及其制备方法、显示装置
CN112420616A (zh) * 2019-08-23 2021-02-26 南昌欧菲生物识别技术有限公司 超声波生物识别模组及其制备方法和电子设备
CN110542476A (zh) * 2019-09-24 2019-12-06 成都大超科技有限公司 超声波模组及其制备方法、超声传感器
US11531045B2 (en) 2019-10-23 2022-12-20 Rohde & Schwarz Gmbh & Co. Kg Measurement apparatus and method for controlling a measurement apparatus
US11093090B2 (en) 2019-12-06 2021-08-17 Fingerprint Cards Ab TFT-based fingerprint sensing system with corrected read-out
CN110942981A (zh) * 2019-12-10 2020-03-31 上海华力微电子有限公司 涂胶方法及半导体结构
US11950512B2 (en) 2020-03-23 2024-04-02 Apple Inc. Thin-film acoustic imaging system for imaging through an exterior surface of an electronic device housing
CN111635692B (zh) * 2020-05-30 2022-08-12 江西欧迈斯微电子有限公司 可剥胶及其制备方法和应用
CN111814572A (zh) * 2020-06-12 2020-10-23 欧菲微电子技术有限公司 触控模组及智能终端
KR20210158459A (ko) * 2020-06-23 2021-12-31 삼성디스플레이 주식회사 표시 장치
CN111866680B (zh) * 2020-07-15 2022-08-30 深圳市汇顶科技股份有限公司 超声换能器与电子设备
US12039800B2 (en) 2021-03-31 2024-07-16 Apple Inc. Signal processing for segmented thin-film acoustic imaging systems for portable electronic devices
US12000967B2 (en) 2021-03-31 2024-06-04 Apple Inc. Regional gain control for segmented thin-film acoustic imaging systems
CN113180722A (zh) * 2021-04-20 2021-07-30 武汉大学 一种电子听诊器声学探头
US11798307B2 (en) 2021-08-30 2023-10-24 Qualcomm Incorporated Under-display ultrasonic fingerprint sensors for foldable displays
TWI795006B (zh) * 2021-09-30 2023-03-01 台灣立訊精密有限公司 圖形化超音波模組及駕駛輔助系統
JP7546026B2 (ja) * 2021-12-31 2024-09-05 エルジー ディスプレイ カンパニー リミテッド 装置
EP4209760A1 (en) * 2022-01-10 2023-07-12 Elmos Semiconductor SE Ultrasonic liquid sensing transducer and method for producing such
WO2024049340A1 (en) * 2022-08-29 2024-03-07 Fingerprint Cards Anacatum Ip Ab Biometric imaging device and method for manufacturing the biometric imaging device

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186981A (ja) 1982-04-26 1983-11-01 Toray Ind Inc 入出力変換素子
TW241352B (en) 1994-03-30 1995-02-21 Whitaker Corp Reflective mode ultrasonic touch sensitive switch
DE19833928B4 (de) 1998-07-28 2005-05-25 Infineon Technologies Ag Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen
KR20010110247A (ko) 2001-11-05 2001-12-12 주식회사 이지메딕스 이방 전도성 접착 필름을 이용한 초음파 탐촉자 적층구조
WO2004086419A1 (ja) 2003-03-26 2004-10-07 Daikin Industries Ltd. 強誘電性薄膜の形成方法
US7616786B2 (en) 2003-09-24 2009-11-10 Authentec, Inc. Finger biometric sensor with sensor electronics distributed over thin film and monocrystalline substrates and related methods
US7223243B2 (en) 2003-11-14 2007-05-29 General Electric Co. Thin film ultrasonic transmitter/receiver
KR100561851B1 (ko) 2003-11-18 2006-03-16 삼성전자주식회사 지문 인식 센서 및 그 제조 방법
DE112004002281B4 (de) 2003-11-27 2016-12-22 Kyocera Corp. Drucksensorvorrichtung
US7739912B2 (en) * 2004-10-07 2010-06-22 Ultra-Scan Corporation Ultrasonic fingerprint scanning utilizing a plane wave
US8247802B2 (en) 2005-04-28 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device
CN1876760A (zh) 2005-06-08 2006-12-13 富士胶片株式会社 非线性光学材料用组合物、光学部件、非线性光学材料及其制造方法
JP4682927B2 (ja) 2005-08-03 2011-05-11 セイコーエプソン株式会社 静電型超音波トランスデューサ、超音波スピーカ、音声信号再生方法、超音波トランスデューサの電極の製造方法、超音波トランスデューサの製造方法、超指向性音響システム、および表示装置
US8183745B2 (en) 2006-05-08 2012-05-22 The Penn State Research Foundation High frequency ultrasound transducers
US8098915B2 (en) * 2006-05-25 2012-01-17 Ultra-Scan Corporation Longitudinal pulse wave array
US8139827B2 (en) * 2006-05-25 2012-03-20 Ultra-Scan Corporation Biometrical object reader having an ultrasonic wave manipulation device
WO2008015917A1 (fr) 2006-08-02 2008-02-07 Konica Minolta Medical & Graphic, Inc. Sonde à ultrasons et son procédé de fabrication
US8069549B2 (en) 2007-03-22 2011-12-06 Seiko Epson Corporation Method for sealing a quartz crystal device
CN101315823A (zh) 2007-06-01 2008-12-03 聚鼎科技股份有限公司 过电流保护元件的制作方法
KR100914026B1 (ko) 2007-06-12 2009-08-28 한국세라믹기술원 압전 박막형 지문 센서 제조방법
WO2009004558A2 (en) 2007-07-03 2009-01-08 Koninklijke Philips Electronics N. V. Thin film detector for presence detection
GB2464066A (en) 2007-08-13 2010-04-07 Ultra Scan Corp Method of making a piezoelectric device
KR100934957B1 (ko) 2008-02-22 2010-01-06 한국과학기술연구원 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법
KR101493840B1 (ko) 2008-03-14 2015-02-17 삼성디스플레이 주식회사 액정 표시 장치, 표시 시스템, 및 액정 표시 장치를 이용한물체 형상의 인식 방법
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
JP5535313B2 (ja) 2009-05-29 2014-07-02 エックスルミナ, インコーポレイテッド 隣接する組織層にわたってステントを展開するための装置および方法
CN101691202B (zh) 2009-08-11 2012-01-04 西安交通大学 一种具有微结构的聚偏氟乙烯压电薄膜的制备方法
US20120230574A1 (en) 2009-09-29 2012-09-13 University Of Wollongong Imaging method and system
WO2011112622A1 (en) * 2010-03-08 2011-09-15 Ultra-Scan Corporation Biometric sensor with delay layer
US20110279662A1 (en) 2010-05-11 2011-11-17 Schneider John K Reflex Longitudinal Imaging Using Through Sensor Insonification
US8711128B2 (en) 2010-11-05 2014-04-29 Synaptics Incorporated Method and apparatus for sensing an input object relative to a sensing region of an ultrasound sensor device
US9259961B2 (en) 2010-12-10 2016-02-16 Palo Alto Research Center Incorporated Large-area ultrasound contact imaging
US8539837B2 (en) 2010-12-10 2013-09-24 Palo Alto Research Center Incorporated Ultrasonic imaging using thin film transistor backplane
US8724832B2 (en) 2011-08-30 2014-05-13 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
BR112014019107B1 (pt) 2012-02-02 2021-05-04 Qualcomm Incorporated Monitor com tela sensível ao toque e método para coletar informação sobre um objeto que está em contato com um monitor com tela sensível ao toque
US20140035935A1 (en) 2012-08-03 2014-02-06 Qualcomm Mems Technologies, Inc. Passives via bar
US8890853B2 (en) 2013-01-11 2014-11-18 Sharp Laboratories Of America, Inc. In-pixel ultrasonic touch sensor for display applications
US20140355387A1 (en) * 2013-06-03 2014-12-04 Qualcomm Incorporated Ultrasonic receiver with coated piezoelectric layer
US9798372B2 (en) * 2013-06-03 2017-10-24 Qualcomm Incorporated Devices and methods of sensing combined ultrasonic and infrared signal
US9262003B2 (en) * 2013-11-04 2016-02-16 Qualcomm Incorporated Piezoelectric force sensing array
US20140359757A1 (en) * 2013-06-03 2014-12-04 Qualcomm Incorporated User authentication biometrics in mobile devices
US9323393B2 (en) * 2013-06-03 2016-04-26 Qualcomm Incorporated Display with peripherally configured ultrasonic biometric sensor
WO2015105320A1 (en) 2014-01-07 2015-07-16 Samsung Electronics Co., Ltd. Sensor device and electronic device having the same
US9945818B2 (en) * 2014-02-23 2018-04-17 Qualcomm Incorporated Ultrasonic authenticating button
US10042488B2 (en) 2014-04-04 2018-08-07 Synaptics Incorporated Through silicon vias for backside connection
US9558390B2 (en) 2014-07-25 2017-01-31 Qualcomm Incorporated High-resolution electric field sensor in cover glass
US20160171276A1 (en) 2014-12-11 2016-06-16 Elan Microelectronics Corporation Fingerprint Sensor Having ESD Protection Structure
TWI594341B (zh) 2015-01-19 2017-08-01 神盾股份有限公司 指紋辨識裝置封裝及其製造方法
US11003884B2 (en) 2016-06-16 2021-05-11 Qualcomm Incorporated Fingerprint sensor device and methods thereof

Also Published As

Publication number Publication date
TWI637190B (zh) 2018-10-01
KR101890738B1 (ko) 2018-08-22
JP6254689B2 (ja) 2017-12-27
US10036734B2 (en) 2018-07-31
KR20160016958A (ko) 2016-02-15
JP2016522650A (ja) 2016-07-28
EP3005227B1 (en) 2017-04-19
WO2014197504A1 (en) 2014-12-11
EP3005227A1 (en) 2016-04-13
TW201510555A (zh) 2015-03-16
CN105264543A (zh) 2016-01-20
US20140352440A1 (en) 2014-12-04
CN105264543B (zh) 2019-01-01

Similar Documents

Publication Publication Date Title
BR112015030279A2 (pt) sensor ultrassônico com camada piezelétrica ligada
BR112015030409A2 (pt) receptor ultrassônico com camada piezoelétrica revestida
ES2618728T3 (es) Sensores, interfaces y sistemas de sensores para la recolección de data y la integración del monitoreo remoto de condiciones cercanas o sobre las superficies del cuerpo
DK3863575T3 (da) Stomianordning med konduktivt blækkredsløb til lækagedetektion
EP2983108A3 (en) Fingerprint sensor and touch device including the same
BR112017003628A2 (pt) curvatura de sensor de imagem por expansão induzida de substrato
WO2014084882A3 (en) Pressure sensitive key normalization
WO2016057588A3 (en) Direct view display device and light unit for direct view display device
JP2015228018A5 (ja) 表示装置
EP2829957A3 (en) Flexible touch screen panel and flexible display device with the same
JP2015228014A5 (ja) 表示装置
JP2016021230A5 (ja) タッチパネル及びタッチパネルモジュール
BR112013012673B8 (pt) Arranjo de mangueira sensível a pressão e método de detecção de uma pressão interna de um arranjo de mangueira
EA201892751A1 (ru) Аппараты и способы регистрации температуры вдоль ствола скважины с использованием резистивных элементов
JP2016522650A5 (pt)
JP2014179062A5 (pt)
EP3340306A3 (en) Physical layout and structure of rgbz pixel cell unit for rgbz image sensor
JP2015073101A5 (ja) 半導体装置
JP2015148699A5 (ja) 表示装置
JP2013137552A5 (pt)
WO2013106773A3 (en) Single layer capacitive imaging sensors
EP2772797A3 (en) Display device
CO2019014448A2 (es) Sistema sensor
JP2014006518A5 (pt)
TW201614824A (en) Pressure array sensor module and manufacturing method thereof and monitoring system and monitoring method using the same

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B25C Requirement related to requested transfer of rights

Owner name: QUALCOMM MEMS TECHNOLOGIES, INC. (US)

Free format text: A FIM DE ATENDER A TRANSFERENCIA, REQUERIDA ATRAVES DA PETICAO NO 870210025701 DE 18/03/2021, E NECESSARIO ESCLARECER A DIVERGENCIA ENTRE O NOME DA EMPRESA TITULAR DO PEDIDO E O NOME DA EMPRESA CEDENTE. ALEM DISSO, E PRECISO APRESENTAR A GUIA DE CUMPRIMENTO DE EXIGENCIA.

B25B Requested transfer of rights rejected

Owner name: QUALCOMM MEMS TECHNOLOGIES, INC. (US)

Free format text: INDEFERIDO O PEDIDO DE TRANSFERENCIA CONTIDO NA PETICAO 870210025701 DE 18/03/2021, POR AUSENCIA DE CUMPRIMENTO DA EXIGENCIA PUBLICADA NA RPI NO 2640, DE 10/08/2021.

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time