BR112015029690A2 - cobertura de dispositivo para gerenciamento térmico - Google Patents

cobertura de dispositivo para gerenciamento térmico

Info

Publication number
BR112015029690A2
BR112015029690A2 BR112015029690A BR112015029690A BR112015029690A2 BR 112015029690 A2 BR112015029690 A2 BR 112015029690A2 BR 112015029690 A BR112015029690 A BR 112015029690A BR 112015029690 A BR112015029690 A BR 112015029690A BR 112015029690 A2 BR112015029690 A2 BR 112015029690A2
Authority
BR
Brazil
Prior art keywords
heat
generating components
cover
depression
cooling
Prior art date
Application number
BR112015029690A
Other languages
English (en)
Other versions
BR112015029690A8 (pt
BR112015029690B1 (pt
Inventor
Michael William Proctor Christopher
Naganathan Girish
Hui Cheah Sin
Original Assignee
Thomson Licensing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing filed Critical Thomson Licensing
Publication of BR112015029690A2 publication Critical patent/BR112015029690A2/pt
Publication of BR112015029690A8 publication Critical patent/BR112015029690A8/pt
Publication of BR112015029690B1 publication Critical patent/BR112015029690B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

resumo “cobertura de dispositivo para gerenciamento térmico” um dispositivo eletrônico inclui uma cobertura para um ou mais componentes de geração de calor, com a cobertura fornecendo pelo menos um resfriamento condutor, convectivo e radiante combinado para os componentes de geração de calor enquanto mantendo o dispositivo dentro de uma faixa de temperatura prescrita. resfriamento condutor é realizado fornecendo acoplamento térmico entre cada das duas ou mais regiões de depressão na cobertura e um ou mais componentes de geração de calor. colocação apropriada de entradas e saídas de ar através da cobertura fornecem resfriamento condutor dos componentes de geração de calor e as regiões de depressão ligadas termicamente. calor dos componentes de geração de calor ligados termicamente a uma região de depressão é efetivamente isolado do calor gerado por outros componentes de geração de calor termicamente ligados a outra região de depressão adjacente pelo menos em parte através das saídas de ar através de uma região interna entre as duas regiões de depressão adjacentes. resfriamento radiante pode também ser melhorado aumentando a emissividade do material de cobertura do dispositivo.
BR112015029690-4A 2013-06-27 2013-06-27 Cobertura de gerenciamento térmico para um dispositivo eletrônico e dispositivo eletrônico BR112015029690B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2013/048124 WO2014209316A1 (en) 2013-06-27 2013-06-27 Device cover for thermal management

Publications (3)

Publication Number Publication Date
BR112015029690A2 true BR112015029690A2 (pt) 2017-07-25
BR112015029690A8 BR112015029690A8 (pt) 2021-02-23
BR112015029690B1 BR112015029690B1 (pt) 2021-11-23

Family

ID=48795906

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015029690-4A BR112015029690B1 (pt) 2013-06-27 2013-06-27 Cobertura de gerenciamento térmico para um dispositivo eletrônico e dispositivo eletrônico

Country Status (9)

Country Link
US (1) US9736964B2 (pt)
EP (1) EP3014963B1 (pt)
JP (1) JP2016525278A (pt)
KR (1) KR102090357B1 (pt)
CN (1) CN105409342A (pt)
BR (1) BR112015029690B1 (pt)
ES (1) ES2747480T3 (pt)
PL (1) PL3014963T3 (pt)
WO (1) WO2014209316A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016045120A1 (en) * 2014-09-28 2016-03-31 Intel Corporation Passive radiator cooling for electronic devices
US9690338B2 (en) * 2015-02-10 2017-06-27 ScienBiziP Consulting(Shenzhen)Co., Ltd. Electronic device with cooling facility
DE202016001447U1 (de) * 2016-03-03 2016-04-25 André Runge Vorrichtung zum Kühlen elektrischer und elektronischer Komponenten
CA2924437C (en) * 2016-03-18 2023-09-12 Logisig Inc. Electronic cabinet, and air inlet therefore
US9961806B2 (en) * 2016-05-19 2018-05-01 Power Distribution Systems Development LLC Systems and methods for transformer cooling by vertical airflow
JP2020057701A (ja) * 2018-10-02 2020-04-09 シャープ株式会社 電子機器
US11714469B2 (en) * 2018-12-14 2023-08-01 Samsung Electronics Co., Ltd. Temperature control management of electronic device based on number of heat-emitting components in compartment
US11317539B2 (en) * 2019-10-11 2022-04-26 Arris Enterprises Llc Hybrid heat sink

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
US6049469A (en) 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
JP4438164B2 (ja) * 2000-03-01 2010-03-24 ソニー株式会社 シールドケース
US6900984B2 (en) 2001-04-24 2005-05-31 Apple Computer, Inc. Computer component protection
KR100445033B1 (ko) * 2002-08-26 2004-08-18 삼성에스디아이 주식회사 전자부품 수납용 케이스 및 이를 구비한 화상표시장치
TWI247574B (en) 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
CN100502627C (zh) * 2004-12-01 2009-06-17 展讯通信（上海）有限公司 一种移动通讯设备散热装置
US7158380B2 (en) * 2005-03-25 2007-01-02 Scientific-Atlanta, Inc. Heatsink for digital video recorder
CN2907178Y (zh) * 2006-05-22 2007-05-30 友讯科技股份有限公司 具隐藏通风孔的外壳结构
BR112012014093B1 (pt) 2009-12-09 2020-09-29 Interdigital Ce Patent Holdings Dispositivo eletrônico tendo microperfurações
JP2011170566A (ja) * 2010-02-17 2011-09-01 Toshiba Corp 半導体記憶装置および電子機器
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
KR20130029044A (ko) 2010-02-25 2013-03-21 톰슨 라이센싱 퀵 릴리스 스냅들이 은닉된 소형 다층 방사성 냉각 케이스
CN103262675B (zh) 2010-05-19 2016-03-30 汤姆森特许公司 能散失热负荷的机顶盒
KR101261443B1 (ko) * 2010-10-13 2013-05-10 주식회사 에이치앤에스 Ｔｖ 셋톱박스의 방열장치
US20120217870A1 (en) * 2011-02-24 2012-08-30 Soni Vimal J LED Light Assembly
EP2684375B8 (en) 2011-03-09 2017-12-13 Thomson Licensing Set top box or server having snap-in heat sink and smart card reader
JP2013051294A (ja) 2011-08-30 2013-03-14 Sony Corp 電子機器

Also Published As

Publication number Publication date
JP2016525278A (ja) 2016-08-22
EP3014963A1 (en) 2016-05-04
EP3014963B1 (en) 2019-08-07
WO2014209316A1 (en) 2014-12-31
CN105409342A (zh) 2016-03-16
KR20160022296A (ko) 2016-02-29
US9736964B2 (en) 2017-08-15
BR112015029690A8 (pt) 2021-02-23
PL3014963T3 (pl) 2019-11-29
ES2747480T3 (es) 2020-03-10
KR102090357B1 (ko) 2020-03-17
US20160044827A1 (en) 2016-02-11
BR112015029690B1 (pt) 2021-11-23

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B25G Requested change of headquarter approved

Owner name: THOMSON LICENSING (FR)

B25A Requested transfer of rights approved

Owner name: INTERDIGITAL CE PATENT HOLDINGS (FR)

B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B25A Requested transfer of rights approved

Owner name: INTERDIGITAL MADISON PATENT HOLDINGS, SAS (FR)

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 27/06/2013, OBSERVADAS AS CONDICOES LEGAIS.