PL3014963T3 - Pokrywa urządzenia do zarządzania ciepłem - Google Patents

Pokrywa urządzenia do zarządzania ciepłem

Info

Publication number
PL3014963T3
PL3014963T3 PL13737914T PL13737914T PL3014963T3 PL 3014963 T3 PL3014963 T3 PL 3014963T3 PL 13737914 T PL13737914 T PL 13737914T PL 13737914 T PL13737914 T PL 13737914T PL 3014963 T3 PL3014963 T3 PL 3014963T3
Authority
PL
Poland
Prior art keywords
thermal management
device cover
cover
management
thermal
Prior art date
Application number
PL13737914T
Other languages
English (en)
Inventor
Christopher Michael William Proctor
Sin Hui Cheah
Girish Naganathan
Original Assignee
Interdigital Ce Patent Holdings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interdigital Ce Patent Holdings filed Critical Interdigital Ce Patent Holdings
Publication of PL3014963T3 publication Critical patent/PL3014963T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL13737914T 2013-06-27 2013-06-27 Pokrywa urządzenia do zarządzania ciepłem PL3014963T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/US2013/048124 WO2014209316A1 (en) 2013-06-27 2013-06-27 Device cover for thermal management
EP13737914.5A EP3014963B1 (en) 2013-06-27 2013-06-27 Device cover for thermal management

Publications (1)

Publication Number Publication Date
PL3014963T3 true PL3014963T3 (pl) 2019-11-29

Family

ID=48795906

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13737914T PL3014963T3 (pl) 2013-06-27 2013-06-27 Pokrywa urządzenia do zarządzania ciepłem

Country Status (9)

Country Link
US (1) US9736964B2 (pl)
EP (1) EP3014963B1 (pl)
JP (1) JP2016525278A (pl)
KR (1) KR102090357B1 (pl)
CN (1) CN105409342A (pl)
BR (1) BR112015029690B1 (pl)
ES (1) ES2747480T3 (pl)
PL (1) PL3014963T3 (pl)
WO (1) WO2014209316A1 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10317960B2 (en) * 2014-09-28 2019-06-11 Intel Corporation Passive radiator cooling for electronic devices
US9690338B2 (en) * 2015-02-10 2017-06-27 ScienBiziP Consulting(Shenzhen)Co., Ltd. Electronic device with cooling facility
DE202016001447U1 (de) * 2016-03-03 2016-04-25 André Runge Vorrichtung zum Kühlen elektrischer und elektronischer Komponenten
CA2924437C (en) * 2016-03-18 2023-09-12 Logisig Inc. Electronic cabinet, and air inlet therefore
US9961806B2 (en) * 2016-05-19 2018-05-01 Power Distribution Systems Development LLC Systems and methods for transformer cooling by vertical airflow
JP2020057701A (ja) * 2018-10-02 2020-04-09 シャープ株式会社 電子機器
US11714469B2 (en) * 2018-12-14 2023-08-01 Samsung Electronics Co., Ltd. Temperature control management of electronic device based on number of heat-emitting components in compartment
US11317539B2 (en) * 2019-10-11 2022-04-26 Arris Enterprises Llc Hybrid heat sink

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
JP4438164B2 (ja) * 2000-03-01 2010-03-24 ソニー株式会社 シールドケース
US6900984B2 (en) 2001-04-24 2005-05-31 Apple Computer, Inc. Computer component protection
KR100445033B1 (ko) * 2002-08-26 2004-08-18 삼성에스디아이 주식회사 전자부품 수납용 케이스 및 이를 구비한 화상표시장치
TWI247574B (en) * 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
CN100502627C (zh) * 2004-12-01 2009-06-17 展讯通信（上海）有限公司 一种移动通讯设备散热装置
US7158380B2 (en) * 2005-03-25 2007-01-02 Scientific-Atlanta, Inc. Heatsink for digital video recorder
CN2907178Y (zh) * 2006-05-22 2007-05-30 友讯科技股份有限公司 具隐藏通风孔的外壳结构
WO2011071516A1 (en) * 2009-12-09 2011-06-16 Thomson Licensing Set-top box having microperforations
JP2011170566A (ja) * 2010-02-17 2011-09-01 Toshiba Corp 半導体記憶装置および電子機器
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
US9578783B2 (en) * 2010-02-25 2017-02-21 Thomson Licensing Miniature multilayer radiative cooling case wtih hidden quick release snaps
US9220185B2 (en) 2010-05-19 2015-12-22 Thomson Licensing Set-top box having dissipating thermal loads
KR101261443B1 (ko) 2010-10-13 2013-05-10 주식회사 에이치앤에스 Ｔｖ 셋톱박스의 방열장치
US20120217870A1 (en) * 2011-02-24 2012-08-30 Soni Vimal J LED Light Assembly
US9392317B2 (en) * 2011-03-09 2016-07-12 Thomson Licensing Set top box or server having snap-in heat sink and smart card reader
JP2013051294A (ja) * 2011-08-30 2013-03-14 Sony Corp 電子機器

Also Published As

Publication number Publication date
KR102090357B1 (ko) 2020-03-17
ES2747480T3 (es) 2020-03-10
US9736964B2 (en) 2017-08-15
BR112015029690B1 (pt) 2021-11-23
BR112015029690A8 (pt) 2021-02-23
KR20160022296A (ko) 2016-02-29
EP3014963B1 (en) 2019-08-07
CN105409342A (zh) 2016-03-16
BR112015029690A2 (pt) 2017-07-25
JP2016525278A (ja) 2016-08-22
US20160044827A1 (en) 2016-02-11
WO2014209316A1 (en) 2014-12-31
EP3014963A1 (en) 2016-05-04

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