BR112014008177A2 - caixa de processo, arranjos, e métodos para processar substratos revestidos - Google Patents

caixa de processo, arranjos, e métodos para processar substratos revestidos

Info

Publication number
BR112014008177A2
BR112014008177A2 BR112014008177A BR112014008177A BR112014008177A2 BR 112014008177 A2 BR112014008177 A2 BR 112014008177A2 BR 112014008177 A BR112014008177 A BR 112014008177A BR 112014008177 A BR112014008177 A BR 112014008177A BR 112014008177 A2 BR112014008177 A2 BR 112014008177A2
Authority
BR
Brazil
Prior art keywords
cover
substrates
base
arrangements
process box
Prior art date
Application number
BR112014008177A
Other languages
English (en)
Inventor
Cuong Phan Dang
Fürfanger Martin
Jost Stefan
Original Assignee
Saint Gobain
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain filed Critical Saint Gobain
Publication of BR112014008177A2 publication Critical patent/BR112014008177A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1864—Annealing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/541—CuInSe2 material PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Photovoltaic Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Tunnel Furnaces (AREA)
  • Coating Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

1/1 resumo “caixa de processo, arranjos, e métodos para processar substratos revestidos” a presente invenção diz respeito a uma caixa de processo transportável para processar substratos revestidos em um lado, que compreende: uma base para a colocação em suporte de área total de um primeiro substrato, em que a base é implementada de tal modo que os revestimentos dos substratos possam ser termicamente tratados pela energia de radiação fornecida no lado de baixo da base, uma estrutura, uma cobertura, que é montada na estrutura, um elemento intermediário disposto entre a base e a cobertura para a colocação em suporte de área total de um segundo substrato, em que a cobertura é implementada tal que os revestimentos dos substratos são termicamente tratáveis pela radiação fornecida no lado de topo da cobertura. a invenção estende-se ainda aos arranjos e métodos para processar substratos, em que uma caixa de processo ou um carregador de processo seja instalado e carregado com os substratos, transportados para dentro de uma câmara de processo, e energia de radiação é irradiada de cima da cobertura e/ou de baixo da base. no caso de um carregador de processo pré-instalado, a cobertura ou uma cobertura conectada à estrutura é posicionada sobre o carregador de processo para formar a caixa de processo.
BR112014008177A 2012-02-16 2013-02-08 caixa de processo, arranjos, e métodos para processar substratos revestidos BR112014008177A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12155848 2012-02-16
PCT/EP2013/052520 WO2013120779A1 (de) 2012-02-16 2013-02-08 Prozessbox, anordnungen und verfahren zum prozessieren beschichteter substrate

Publications (1)

Publication Number Publication Date
BR112014008177A2 true BR112014008177A2 (pt) 2017-04-11

Family

ID=47827142

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014008177A BR112014008177A2 (pt) 2012-02-16 2013-02-08 caixa de processo, arranjos, e métodos para processar substratos revestidos

Country Status (9)

Country Link
US (1) US9799543B2 (pt)
EP (1) EP2815426B1 (pt)
JP (1) JP6076377B2 (pt)
KR (1) KR101680950B1 (pt)
CN (1) CN104106131B (pt)
BR (1) BR112014008177A2 (pt)
ES (1) ES2841067T3 (pt)
WO (1) WO2013120779A1 (pt)
ZA (1) ZA201405481B (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2360720A1 (de) * 2010-02-23 2011-08-24 Saint-Gobain Glass France Vorrichtung zum Positionieren von mindestens zwei Gegenständen, Anordnungen, insbesondere Mehrschichtkörperanordnungen, Anlage zum Prozessieren, insbesondere zum Selenisieren, von Gegenständen, Verfahren zum Positionieren von mindestens zwei Gegenständen
KR101698281B1 (ko) * 2012-07-09 2017-01-19 쌩-고벵 글래스 프랑스 기판을 가공하기 위한 시스템 및 방법
EP3664130B1 (de) * 2018-12-06 2022-02-02 Heraeus Deutschland GmbH & Co. KG Verpackungseinheit für ein substrat
EP3664128B1 (de) * 2018-12-06 2021-03-31 Heraeus Deutschland GmbH & Co. KG Verpackungseinheit für substrate
WO2023245550A1 (en) * 2022-06-23 2023-12-28 Cnbm Research Institute For Advanced Glass Materials Group Co., Ltd. Energy-saving heat treatment device for metal substrate in corrosive gas

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JPH06818Y2 (ja) * 1989-09-21 1994-01-05 日本エー・エス・エム株式会社 Ｃｖｄ装置のための基板支持装置
US5578503A (en) 1992-09-22 1996-11-26 Siemens Aktiengesellschaft Rapid process for producing a chalcopyrite semiconductor on a substrate
US5607009A (en) 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
DE4324318C1 (de) 1993-07-20 1995-01-12 Siemens Ag Verfahren zur Serienverschaltung einer integrierten Dünnfilmsolarzellenanordnung
JP3242281B2 (ja) 1995-03-13 2001-12-25 東京エレクトロン株式会社 熱処理装置
US5837555A (en) * 1996-04-12 1998-11-17 Ast Electronik Apparatus and method for rapid thermal processing
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US20050188923A1 (en) * 1997-08-11 2005-09-01 Cook Robert C. Substrate carrier for parallel wafer processing reactor
US6765178B2 (en) * 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
WO2004032593A2 (de) 2002-10-07 2004-04-22 Schott Ag Dünnstsubstratträger
JP4860167B2 (ja) * 2005-03-30 2012-01-25 東京エレクトロン株式会社 ロードロック装置，処理システム及び処理方法
JP4619854B2 (ja) * 2005-04-18 2011-01-26 東京エレクトロン株式会社 ロードロック装置及び処理方法
EP1739213B1 (de) * 2005-07-01 2011-04-13 Freiberger Compound Materials GmbH Vorrichtung und Verfahren zum Tempern von III-V-Wafern sowie getemperte III-V-Halbleitereinkristallwafer
WO2009079845A1 (en) * 2007-12-20 2009-07-02 Applied Materials, Inc. Staggered dual proess chambers using one single facet on a transfer module
DE102008022784A1 (de) 2008-05-08 2009-11-12 Avancis Gmbh & Co. Kg Vorrichtung und Verfahren zum Tempern von Gegenständen in einer Behandlungskammer
EP2200097A1 (en) 2008-12-16 2010-06-23 Saint-Gobain Glass France S.A. Method of manufacturing a photovoltaic device and system for patterning an object
JP5543125B2 (ja) * 2009-04-08 2014-07-09 ピーエスフォー ルクスコ エスエイアールエル 半導体装置および半導体装置の製造方法
JP5507274B2 (ja) * 2010-01-29 2014-05-28 大日本スクリーン製造株式会社 熱処理方法および熱処理装置
EP2360720A1 (de) 2010-02-23 2011-08-24 Saint-Gobain Glass France Vorrichtung zum Positionieren von mindestens zwei Gegenständen, Anordnungen, insbesondere Mehrschichtkörperanordnungen, Anlage zum Prozessieren, insbesondere zum Selenisieren, von Gegenständen, Verfahren zum Positionieren von mindestens zwei Gegenständen
EP2360721A1 (de) * 2010-02-23 2011-08-24 Saint-Gobain Glass France Vorrichtung zum Positionieren von mindestens zwei Gegenständen, Anordnungen, insbesondere Mehrschichtkörperanordnungen, Anlage zum Prozessieren, insbesondere zum Selenisieren, von Gegenständen, Verfahren zum Positionieren von mindestens zwei Gegenständen
KR101609429B1 (ko) * 2010-11-05 2016-04-05 샤프 가부시키가이샤 어닐링 처리 장치 및 어닐링 처리를 사용한 박막 트랜지스터의 제조 방법
KR102068186B1 (ko) * 2012-02-29 2020-02-11 어플라이드 머티어리얼스, 인코포레이티드 로드 록 구성의 저감 및 스트립 프로세스 챔버

Also Published As

Publication number Publication date
JP6076377B2 (ja) 2017-02-08
ZA201405481B (en) 2015-11-25
CN104106131A (zh) 2014-10-15
US9799543B2 (en) 2017-10-24
EP2815426A1 (de) 2014-12-24
ES2841067T3 (es) 2021-07-07
EP2815426B1 (de) 2020-10-07
KR101680950B1 (ko) 2016-11-29
JP2015513790A (ja) 2015-05-14
KR20140117535A (ko) 2014-10-07
WO2013120779A1 (de) 2013-08-22
US20140363916A1 (en) 2014-12-11
CN104106131B (zh) 2017-08-08

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B12B Appeal against refusal [chapter 12.2 patent gazette]