BR112013006112A2 - folha de entrada para perfuração - Google Patents

folha de entrada para perfuração

Info

Publication number
BR112013006112A2
BR112013006112A2 BR112013006112A BR112013006112A BR112013006112A2 BR 112013006112 A2 BR112013006112 A2 BR 112013006112A2 BR 112013006112 A BR112013006112 A BR 112013006112A BR 112013006112 A BR112013006112 A BR 112013006112A BR 112013006112 A2 BR112013006112 A2 BR 112013006112A2
Authority
BR
Brazil
Prior art keywords
soluble resin
input sheet
water soluble
water
cooling
Prior art date
Application number
BR112013006112A
Other languages
English (en)
Inventor
Shimizu Kenichi
Horie Shigeru
Hasaki Takuya
Matsuyama Yousuke
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of BR112013006112A2 publication Critical patent/BR112013006112A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

folha de entrada para perfuração. esta invenção se refere a uma folha de entrada para perfuração sendo excelente precisão de localização de furo mesmo se uma temperatura de transporte e/ou armazenamento for alta, e particularmente, a uma folha de entrada para perfuração caracterizada pelo fato de uma camada de uma composição resina solúvel em água compreendendo uma resina solúvel em água, um lubrificante solúvel em água e 2,7-naftalenodissulfonatoa-3-hidroxi-4-[(4-sulfo-1-naftaleno)azo]-sal trissódico (vermelho alimentício no.2) é formado em pelo menos uma superfície de uma folha de suporte metálica, e a camada de composição de resina solúvel em água é formada pelo resfriamento de uma temperatura inicial de resfriamento de 120 c para 160 ca para uma temperatura final de resfriamento de 25 c a 40 c em uma taxa de resfriamento de não menores de 1,5 c/segundo em 60 segundos, e a composição de resina solúvel e mágua possui um grau de cristalinidade de não menos de 1,2 e a camada de composição de resina solúvel em água possui uma dureza de superfície de 8,5 n/mm^ 2^ em um desvio padrão <sym> de dureza de superfície de não mais de 2.
BR112013006112A 2010-09-17 2011-09-14 folha de entrada para perfuração BR112013006112A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010209476 2010-09-17
PCT/JP2011/005190 WO2012035771A1 (ja) 2010-09-17 2011-09-14 ドリル孔明け用エントリーシート

Publications (1)

Publication Number Publication Date
BR112013006112A2 true BR112013006112A2 (pt) 2017-09-19

Family

ID=45831257

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013006112A BR112013006112A2 (pt) 2010-09-17 2011-09-14 folha de entrada para perfuração

Country Status (8)

Country Link
JP (1) JP5845901B2 (pt)
KR (1) KR101705064B1 (pt)
CN (1) CN103108730B (pt)
BR (1) BR112013006112A2 (pt)
MY (1) MY165940A (pt)
RU (1) RU2526106C1 (pt)
TW (1) TWI470017B (pt)
WO (1) WO2012035771A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY162029A (en) * 2012-03-09 2017-05-31 Mitsubishi Gas Chemical Co Entry sheet for drilling use
JP6206700B2 (ja) * 2013-03-28 2017-10-04 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート及びドリル孔あけ用エントリーシートの製造方法
JP6315226B2 (ja) * 2015-09-02 2018-04-25 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN105538387A (zh) * 2016-01-21 2016-05-04 烟台柳鑫新材料科技有限公司 一种pcb钻孔用盖板
CN108811325B (zh) * 2017-05-02 2020-12-29 北大方正集团有限公司 一种印刷电路板的压合方法和制造方法
CN108366491B (zh) * 2018-03-22 2022-09-23 深圳市中科恒润科技发展有限公司 一种pcb线路板钻孔保护盖板
CN114713484A (zh) * 2022-04-28 2022-07-08 苏州罗恒电子材料有限公司 Peo熔融直涂方法及线路板钻孔用水溶性覆膜铝箔

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87102318A (zh) * 1987-03-28 1987-12-23 刘俊泉 印制电路用柔性复箔材料新制造方法
JP2855824B2 (ja) 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP3169026B2 (ja) 1991-12-18 2001-05-21 三菱瓦斯化学株式会社 小孔あけ用滑剤シート
BE1007879A3 (fr) * 1994-01-05 1995-11-07 Blue Chips Holding Resine polymerique a viscosite ajustable pour le depot de palladium catalytique sur un substrat, son procede de preparation et son utilisation.
JP4106518B2 (ja) 2001-10-31 2008-06-25 三菱瓦斯化学株式会社 孔明け用エントリーシート及びドリル孔明け加工法
JP2004071662A (ja) * 2002-08-02 2004-03-04 Nikko Materials Co Ltd ドリル穴開け性に優れた複合銅箔及び穴開け方法
JP4479878B2 (ja) * 2003-04-15 2010-06-09 三菱瓦斯化学株式会社 着色された金属ドリル孔あけ用滑剤シート
JP4644414B2 (ja) 2003-01-28 2011-03-02 三菱瓦斯化学株式会社 着色された孔あけ用滑剤シート
CN100348411C (zh) * 2004-04-13 2007-11-14 叶云照 钻孔润滑铝质复合材料
RU2302100C2 (ru) * 2005-07-12 2007-07-10 Государственное научное учреждение Всероссийский научно-исследовательский институт виноградарства и виноделия им. Я.И. Потапенко Способ перфорации мульчирующей рулонной полимерной пленки
JP5011823B2 (ja) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
JP5324037B2 (ja) * 2006-10-12 2013-10-23 大智化学産業株式会社 孔あけ加工用当て板及び孔あけ加工方法
KR20080055264A (ko) * 2006-12-15 2008-06-19 홍부진 천공 가공용 쉬트
JP4752910B2 (ja) * 2007-12-26 2011-08-17 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシート
KR101346269B1 (ko) * 2008-06-10 2013-12-31 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 드릴링용 엔트리 시트

Also Published As

Publication number Publication date
JP5845901B2 (ja) 2016-01-20
CN103108730B (zh) 2015-03-04
RU2526106C1 (ru) 2014-08-20
KR20140012612A (ko) 2014-02-03
TW201247761A (en) 2012-12-01
WO2012035771A1 (ja) 2012-03-22
MY165940A (en) 2018-05-18
TWI470017B (zh) 2015-01-21
KR101705064B1 (ko) 2017-02-09
CN103108730A (zh) 2013-05-15
JPWO2012035771A1 (ja) 2014-01-20

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements