BR112013004863A2 - estrutura de montagem para componente eletrônico - Google Patents
estrutura de montagem para componente eletrônicoInfo
- Publication number
- BR112013004863A2 BR112013004863A2 BR112013004863A BR112013004863A BR112013004863A2 BR 112013004863 A2 BR112013004863 A2 BR 112013004863A2 BR 112013004863 A BR112013004863 A BR 112013004863A BR 112013004863 A BR112013004863 A BR 112013004863A BR 112013004863 A2 BR112013004863 A2 BR 112013004863A2
- Authority
- BR
- Brazil
- Prior art keywords
- electronic component
- mounting frame
- layer
- substrate
- volume
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
estrutura de montagem para componente eletrônico. um fio (16) de um componente eletrônico (10) é conectado a um calço (24) de um substrato (20), e uma camada de solda (30) é provida de forma correspondente em um espaço (g) definido entre uma superfície exposta (14a) de um membro de suporte (14), o qual é um condutor, regulado para um potencial de aterramento sem corrente, do componente eletrônico e uma superfície superior (22a) de uma camada de aterramento (22) do substrato. o volume da camada de solda (30) é regulado para ser igual a ou menor do que um volume do espaço (g).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010191884A JP2012049421A (ja) | 2010-08-30 | 2010-08-30 | 電子部品の実装構造 |
PCT/JP2011/069445 WO2012029712A1 (ja) | 2010-08-30 | 2011-08-29 | 電子部品の実装構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112013004863A2 true BR112013004863A2 (pt) | 2016-06-07 |
Family
ID=45772799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112013004863A BR112013004863A2 (pt) | 2010-08-30 | 2011-08-29 | estrutura de montagem para componente eletrônico |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2613348A1 (pt) |
JP (1) | JP2012049421A (pt) |
CN (1) | CN103250241B (pt) |
BR (1) | BR112013004863A2 (pt) |
TW (1) | TWI467710B (pt) |
WO (1) | WO2012029712A1 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022078838A (ja) * | 2020-11-13 | 2022-05-25 | 株式会社リコー | 制御基板、電子機器及び画像形成装置 |
CN113257684A (zh) * | 2021-04-25 | 2021-08-13 | 深圳市时代速信科技有限公司 | 一种芯片的封装方法及装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04216653A (ja) * | 1990-12-17 | 1992-08-06 | Sumitomo Electric Ind Ltd | 半導体集積回路用パッケージおよびその実装方法 |
JPH0738043A (ja) * | 1993-07-23 | 1995-02-07 | Fujitsu Ltd | 半導体装置 |
KR100239406B1 (ko) * | 1996-12-27 | 2000-01-15 | 김영환 | 표면 실장형 반도체 패키지 및 그 제조 방법 |
JPH11251494A (ja) * | 1998-03-02 | 1999-09-17 | Mitsui High Tec Inc | 半導体装置 |
JP3535103B2 (ja) * | 2000-01-14 | 2004-06-07 | 株式会社地域情報システム研究所 | 真珠養殖方法とそのシステム |
US6864165B1 (en) * | 2003-09-15 | 2005-03-08 | International Business Machines Corporation | Method of fabricating integrated electronic chip with an interconnect device |
JP2005150643A (ja) * | 2003-11-19 | 2005-06-09 | Sanyo Electric Co Ltd | ランドグリッドアレイ型パッケージ |
JP2006041224A (ja) * | 2004-07-28 | 2006-02-09 | Denso Corp | 電子装置および電子装置の実装構造 |
JP4525277B2 (ja) * | 2004-09-30 | 2010-08-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2008277697A (ja) * | 2007-05-07 | 2008-11-13 | Kyocera Corp | 高周波モジュール |
-
2010
- 2010-08-30 JP JP2010191884A patent/JP2012049421A/ja active Pending
-
2011
- 2011-08-29 TW TW100130898A patent/TWI467710B/zh active
- 2011-08-29 WO PCT/JP2011/069445 patent/WO2012029712A1/ja active Application Filing
- 2011-08-29 CN CN201180038053.7A patent/CN103250241B/zh active Active
- 2011-08-29 BR BR112013004863A patent/BR112013004863A2/pt not_active Application Discontinuation
- 2011-08-29 EP EP11821728.0A patent/EP2613348A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW201222741A (en) | 2012-06-01 |
WO2012029712A1 (ja) | 2012-03-08 |
CN103250241B (zh) | 2016-04-13 |
JP2012049421A (ja) | 2012-03-08 |
TWI467710B (zh) | 2015-01-01 |
CN103250241A (zh) | 2013-08-14 |
EP2613348A1 (en) | 2013-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |