BR0317889A - Chip de aquecedor com camada de carbono tipo diamante e camada de cativação de superposição - Google Patents
Chip de aquecedor com camada de carbono tipo diamante e camada de cativação de superposiçãoInfo
- Publication number
- BR0317889A BR0317889A BR0317889-7A BR0317889A BR0317889A BR 0317889 A BR0317889 A BR 0317889A BR 0317889 A BR0317889 A BR 0317889A BR 0317889 A BR0317889 A BR 0317889A
- Authority
- BR
- Brazil
- Prior art keywords
- layer
- diamond
- carbon
- cavitation
- doped
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
"CHIP DE AQUECEDOR COM CAMADA DE CARBONO TIPO DIAMANTE E CAMADA DE CAVITAçãO DE SUPERPOSIçãO". A presente invenção refere-se a um chip de aquecedor de cabeçote de impressão de jato de tinta que tem um substrato de silício com uma pilha de aquecedor formada de uma pluralidade de camadas de filme fino nele para ejeção de uma gota de tinta durante o uso. As camadas de filme fino incluem: uma camada de barreira térmica no substrato de silício; uma camada de resistor na camada de barreira térmica, uma camada de carbono tipo diamante dopado na camada de resistor; e uma camada de cavitação na camada de carbono tipo diamante dopado. A camada de carbono tipo diamante dopado preferencialmente inclui silício, mas também pode incluir nitrogênio, titânio, tântalo, combinações dos mesmos e outros. Quando ela inclui silício, uma concentração de silício preferida varia de 20 a 25 de percentual atómico. Uma camada de cavitação preferida inclui uma camada de carbono, tântalo ou titânio tipo diamante não dopado. A camada de carbono tipo diamante dopado varia na espessura de 500 a 3000 angstroms. A camada de cavitação varia de 500 a 6000 angstroms. Cabeçotes de impressão de jato de tinta e impressoras também são mostradas.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/334,109 US6805431B2 (en) | 2002-12-30 | 2002-12-30 | Heater chip with doped diamond-like carbon layer and overlying cavitation layer |
PCT/US2003/041245 WO2004060676A2 (en) | 2002-12-30 | 2003-12-24 | Heater chip with doped diamond-like carbon layer and overlying cavitation layer |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0317889A true BR0317889A (pt) | 2005-12-06 |
Family
ID=32654930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0317889-7A BR0317889A (pt) | 2002-12-30 | 2003-12-24 | Chip de aquecedor com camada de carbono tipo diamante e camada de cativação de superposição |
Country Status (10)
Country | Link |
---|---|
US (1) | US6805431B2 (pt) |
EP (1) | EP1592559A4 (pt) |
JP (1) | JP2006512234A (pt) |
CN (1) | CN100402294C (pt) |
AU (1) | AU2003297528A1 (pt) |
BR (1) | BR0317889A (pt) |
CA (1) | CA2512165A1 (pt) |
MX (1) | MXPA05007160A (pt) |
TW (1) | TW200510184A (pt) |
WO (1) | WO2004060676A2 (pt) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100560717B1 (ko) * | 2004-03-11 | 2006-03-13 | 삼성전자주식회사 | 잉크젯 헤드 기판, 잉크젯 헤드 및 잉크젯 헤드 기판의제조방법 |
US20060081239A1 (en) * | 2004-10-15 | 2006-04-20 | Alley Rodney L | Thermally efficient drop generator |
US7214324B2 (en) * | 2005-04-15 | 2007-05-08 | Delphi Technologies, Inc. | Technique for manufacturing micro-electro mechanical structures |
US7452058B2 (en) * | 2006-06-29 | 2008-11-18 | Lexmark International, Inc. | Substantially planar ejection actuators and methods relating thereto |
US7673972B2 (en) * | 2007-01-08 | 2010-03-09 | Lexmark International, Inc. | Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters |
US7862156B2 (en) * | 2007-07-26 | 2011-01-04 | Hewlett-Packard Development Company, L.P. | Heating element |
WO2009091390A1 (en) * | 2008-01-14 | 2009-07-23 | Lexmark International, Inc. | Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads having high resistance thin film heaters |
US20100123758A1 (en) * | 2008-11-14 | 2010-05-20 | Steven Wayne Bergstedt | Micro-fluid ejection device with on-chip self-managed thermal control system |
US8960886B2 (en) | 2009-06-29 | 2015-02-24 | Videojet Technologies Inc. | Thermal inkjet print head with solvent resistance |
JP5698739B2 (ja) * | 2009-06-29 | 2015-04-08 | ヴィデオジェット テクノロジーズ インコーポレイテッド | 耐溶媒性サーマルインクジェット印刷ヘッド |
US20120091121A1 (en) * | 2010-10-19 | 2012-04-19 | Zachary Justin Reitmeier | Heater stack for inkjet printheads |
JP6128935B2 (ja) * | 2012-05-22 | 2017-05-17 | キヤノン株式会社 | 液体吐出ヘッド用基板、及び液体吐出ヘッド |
JP6310327B2 (ja) * | 2014-05-27 | 2018-04-11 | 株式会社エンプラス | 流体取扱装置 |
AU2015348738B2 (en) * | 2014-11-19 | 2018-03-01 | Memjet Technology Limited | Inkjet nozzle device having improved lifetime |
CN108330065A (zh) * | 2017-01-20 | 2018-07-27 | 上海新微技术研发中心有限公司 | 一种基于细胞打印喷头阵列的细胞筛选装置和细胞筛选方法 |
CN107746186B (zh) * | 2017-10-17 | 2021-02-05 | 信利光电股份有限公司 | 一种高硬度耐磨玻璃盖板及其制备方法 |
CN113873738B (zh) * | 2021-09-26 | 2024-01-12 | 中国工程物理研究院激光聚变研究中心 | 一种自支撑碳基电容器靶及其制备方法 |
Family Cites Families (33)
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DE3011919A1 (de) * | 1979-03-27 | 1980-10-09 | Canon Kk | Verfahren zur herstellung eines aufzeichnungskopfes |
US4335389A (en) * | 1979-03-27 | 1982-06-15 | Canon Kabushiki Kaisha | Liquid droplet ejecting recording head |
US4663640A (en) | 1984-07-20 | 1987-05-05 | Canon Kabushiki Kaisha | Recording head |
US4990939A (en) * | 1988-09-01 | 1991-02-05 | Ricoh Company, Ltd. | Bubble jet printer head with improved operational speed |
US4956653A (en) | 1989-05-12 | 1990-09-11 | Eastman Kodak Company | Bubble jet print head having improved multi-layer protective structure for heater elements |
JP2662446B2 (ja) * | 1989-12-11 | 1997-10-15 | キヤノン株式会社 | 記録ヘッド及び記録ヘッド用素子基板 |
US5786068A (en) | 1991-05-03 | 1998-07-28 | Advanced Refractory Technologies, Inc. | Electrically tunable coatings |
JPH0673966B2 (ja) * | 1992-07-29 | 1994-09-21 | ティーディーケイ株式会社 | サーマルヘッド |
US5348909A (en) | 1993-03-26 | 1994-09-20 | Lexmark International, Inc. | Manufacture of printhead with diamond resistors |
GB9309346D0 (en) | 1993-05-06 | 1993-06-16 | Kobe Steel Europ Ltd | Preparation of nucleated silicon surfaces |
GB9318985D0 (en) | 1993-09-14 | 1993-10-27 | Xaar Ltd | Passivation of ceramic piezoelectric ink jet print heads |
US5559367A (en) | 1994-07-12 | 1996-09-24 | International Business Machines Corporation | Diamond-like carbon for use in VLSI and ULSI interconnect systems |
US6031250A (en) | 1995-12-20 | 2000-02-29 | Advanced Technology Materials, Inc. | Integrated circuit devices and methods employing amorphous silicon carbide resistor materials |
US6080470A (en) | 1996-06-17 | 2000-06-27 | Dorfman; Benjamin F. | Hard graphite-like material bonded by diamond-like framework |
US5744865A (en) | 1996-10-22 | 1998-04-28 | Texas Instruments Incorporated | Highly thermally conductive interconnect structure for intergrated circuits |
US5933166A (en) | 1997-02-03 | 1999-08-03 | Xerox Corporation | Ink-jet printhead allowing selectable droplet size |
DE69803365T2 (de) | 1997-02-04 | 2002-10-31 | Bekaert Sa Nv | Beschichtung enthaltend filme aus diamantartigem kohlenstoff und diamantartigem nanokomposit |
JPH10217522A (ja) | 1997-02-07 | 1998-08-18 | Fuji Photo Film Co Ltd | サーマルヘッドおよびサーマルヘッドの製造方法 |
US6209991B1 (en) | 1997-03-04 | 2001-04-03 | Hewlett-Packard Company | Transition metal carbide films for applications in ink jet printheads |
DE19730083A1 (de) | 1997-07-14 | 1999-01-21 | Rossendorf Forschzent | Verfahren zur gezielten Herstellung von n-leitenden Bereichen in Diamantschichten mittels Ionenimplantation |
US6030904A (en) | 1997-08-21 | 2000-02-29 | International Business Machines Corporation | Stabilization of low-k carbon-based dielectrics |
US6659596B1 (en) | 1997-08-28 | 2003-12-09 | Hewlett-Packard Development Company, L.P. | Ink-jet printhead and method for producing the same |
US6505914B2 (en) | 1997-10-02 | 2003-01-14 | Merckle Gmbh | Microactuator based on diamond |
US5981000A (en) | 1997-10-14 | 1999-11-09 | International Business Machines Corporation | Method for fabricating a thermally stable diamond-like carbon film |
US6046758A (en) | 1998-03-10 | 2000-04-04 | Diamonex, Incorporated | Highly wear-resistant thermal print heads with silicon-doped diamond-like carbon protective coatings |
US6414338B1 (en) | 1998-11-30 | 2002-07-02 | Sandia National Laboratories | n-Type diamond and method for producing same |
US6315393B1 (en) | 1999-04-30 | 2001-11-13 | Hewlett-Packard Company | Ink-jet printhead |
US6139131A (en) | 1999-08-30 | 2000-10-31 | Hewlett-Packard Company | High drop generator density printhead |
JP4666739B2 (ja) * | 1999-10-05 | 2011-04-06 | キヤノン株式会社 | インクジェット記録ヘッド用基体、インクジェット記録ヘッド、インクジェット記録ユニット、インクジェット記録装置、インクジェット記録ヘッド用基体の製造方法及びインクジェット記録ヘッドの製造方法 |
JP4271339B2 (ja) | 2000-03-31 | 2009-06-03 | 富士フイルム株式会社 | サーマルヘッドの製造方法 |
US6387719B1 (en) * | 2001-02-28 | 2002-05-14 | Lexmark International, Inc. | Method for improving adhesion |
KR100425306B1 (ko) * | 2001-10-12 | 2004-03-30 | 삼성전자주식회사 | 버블젯 방식의 잉크젯 프린트헤드 |
US6637866B1 (en) * | 2002-06-07 | 2003-10-28 | Lexmark International, Inc. | Energy efficient heater stack using DLC island |
-
2002
- 2002-12-30 US US10/334,109 patent/US6805431B2/en not_active Expired - Lifetime
-
2003
- 2003-12-24 EP EP03814956A patent/EP1592559A4/en not_active Withdrawn
- 2003-12-24 CA CA002512165A patent/CA2512165A1/en not_active Abandoned
- 2003-12-24 MX MXPA05007160A patent/MXPA05007160A/es active IP Right Grant
- 2003-12-24 BR BR0317889-7A patent/BR0317889A/pt not_active IP Right Cessation
- 2003-12-24 CN CNB2003801090293A patent/CN100402294C/zh not_active Expired - Fee Related
- 2003-12-24 AU AU2003297528A patent/AU2003297528A1/en not_active Abandoned
- 2003-12-24 WO PCT/US2003/041245 patent/WO2004060676A2/en active Application Filing
- 2003-12-24 JP JP2004565697A patent/JP2006512234A/ja active Pending
- 2003-12-30 TW TW092137482A patent/TW200510184A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP1592559A2 (en) | 2005-11-09 |
TW200510184A (en) | 2005-03-16 |
US20040125174A1 (en) | 2004-07-01 |
CN100402294C (zh) | 2008-07-16 |
WO2004060676A3 (en) | 2005-03-31 |
US6805431B2 (en) | 2004-10-19 |
JP2006512234A (ja) | 2006-04-13 |
WO2004060676A2 (en) | 2004-07-22 |
AU2003297528A1 (en) | 2004-07-29 |
CA2512165A1 (en) | 2004-07-22 |
CN1738716A (zh) | 2006-02-22 |
MXPA05007160A (es) | 2005-09-21 |
WO2004060676B1 (en) | 2005-05-19 |
EP1592559A4 (en) | 2008-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A, 7A E 8A ANUIDADE(S). |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2144 DE 07/02/2012. |