BR0015457A - Aparelho e método para ligar placas de circuito impresso através de juntas sobrepostas soldadas - Google Patents

Aparelho e método para ligar placas de circuito impresso através de juntas sobrepostas soldadas

Info

Publication number
BR0015457A
BR0015457A BR0015457-1A BR0015457A BR0015457A BR 0015457 A BR0015457 A BR 0015457A BR 0015457 A BR0015457 A BR 0015457A BR 0015457 A BR0015457 A BR 0015457A
Authority
BR
Brazil
Prior art keywords
printed circuit
pcbs
circuit boards
connecting printed
overlapping joints
Prior art date
Application number
BR0015457-1A
Other languages
English (en)
Inventor
Stephen H P Wong
Billy Kiang
Original Assignee
Visteon Global Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visteon Global Tech Inc filed Critical Visteon Global Tech Inc
Publication of BR0015457A publication Critical patent/BR0015457A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

"APARELHO E MéTODO PARA LIGAR PLACAS DE CIRCUITO IMPRESSO ATRAVéS DE JUNTAS SOBREPOSTAS SOLDADAS". Trata-se de um aparelho e um método para ligar uma à outra uma primeira e uma segunda placas de circuito impresso (10/20) (PCBs), nos quais uma ou ambas as PCBs é/são um circuito flex. O método inclui a sobreposição das duas PCBs de modo que seus respectivos arranjos de traços de circuito correspondentes (12/22) fiquem voltados um para o outro por uma pequena distância K predeterminada, em seguida a introdução de solda forte em estado de fusão (30) nas proximidades de uma borda de PCB sobreposta (18), seja por soldagem ondulada, de modo a se fazer com que haja capilação da solda forte em estado de fusão entre as duas PCBs, formando-se assim juntas de solda forte que ligam operacionalmente um ao outro os dois arranjos de traços de circuito.
BR0015457-1A 1999-11-16 2000-11-16 Aparelho e método para ligar placas de circuito impresso através de juntas sobrepostas soldadas BR0015457A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/441,334 US6223973B1 (en) 1999-11-16 1999-11-16 Apparatus and method for connecting printed circuit boards through soldered lap joints
PCT/GB2000/004356 WO2001037624A1 (en) 1999-11-16 2000-11-16 Apparatus and method for connecting printed circuit boards through soldered lap joints

Publications (1)

Publication Number Publication Date
BR0015457A true BR0015457A (pt) 2002-11-12

Family

ID=23752486

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0015457-1A BR0015457A (pt) 1999-11-16 2000-11-16 Aparelho e método para ligar placas de circuito impresso através de juntas sobrepostas soldadas

Country Status (6)

Country Link
US (1) US6223973B1 (pt)
EP (1) EP1230829B1 (pt)
JP (1) JP2003515252A (pt)
BR (1) BR0015457A (pt)
DE (1) DE60005047T2 (pt)
WO (1) WO2001037624A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020052146A1 (en) * 1999-11-05 2002-05-02 James Keith Custer Circuit board apparatus with pin connectors
DE19958776A1 (de) * 1999-12-07 2001-06-13 Bosch Gmbh Robert Unlösbare elektrische und mechanische Verbindung, Kontaktteil für eine unlösbare elektrische und mechanische Verbindung und Verfahren zur Herstellung einer unlösbaren elektrischen und mechanischen Verbindung
JP3842050B2 (ja) * 2001-02-08 2006-11-08 富士通株式会社 プレスフィットピン接続検査方法及びシステム
US6794580B2 (en) * 2002-02-20 2004-09-21 Molex Incorporated Solder interconnections for flat circuits
US20060049238A1 (en) * 2004-09-03 2006-03-09 Lim Seong C Solderable structures and methods for soldering
KR100714648B1 (ko) * 2005-12-02 2007-05-07 삼성전자주식회사 인쇄 회로 기판
WO2009046428A2 (en) 2007-10-05 2009-04-09 Battery-Biz® Inc. Termination apparatus and method for planar components on printed circuit boards
US7766665B2 (en) * 2008-01-31 2010-08-03 Ivus Industries, Inc. Printed circuit board direct connection and method of forming the same
US7690104B2 (en) * 2008-02-20 2010-04-06 Apple Inc. Technique for reducing wasted material on a printed circuit board panel
WO2011091691A1 (zh) * 2010-01-29 2011-08-04 华为技术有限公司 电磁屏蔽方法及装置
US8419441B1 (en) 2011-11-22 2013-04-16 Lear Corporation System for electrically connecting a pair of circuit boards using a pair of board connectors and an interconnector received in apertures of the circuit boards
US9149882B1 (en) * 2014-12-09 2015-10-06 Flextronics Ap, Llc Thermal carrier

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US3573345A (en) * 1969-05-23 1971-04-06 Rogers Corp Connection of flexible printed circuit to connector board and method of making same
JPS5724775U (pt) * 1980-07-17 1982-02-08
US4708281A (en) * 1982-02-16 1987-11-24 Rca Corporation Apparatus and method for applying solder flux to a printed circuit board
JPS58218394A (ja) 1982-06-11 1983-12-19 Hitachi Ltd 半導体装置の実装方法
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DE3536431A1 (de) * 1985-10-12 1987-04-16 Standard Elektrik Lorenz Ag Loeten von oberflaechenmontierbaren bauelementen
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Also Published As

Publication number Publication date
DE60005047D1 (de) 2003-10-09
EP1230829A1 (en) 2002-08-14
DE60005047T2 (de) 2004-06-03
US6223973B1 (en) 2001-05-01
JP2003515252A (ja) 2003-04-22
EP1230829B1 (en) 2003-09-03
WO2001037624A1 (en) 2001-05-25

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A,6AE7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 1962 DE 12/08/2008.