BR0009063A - Composições de resina de epóxido estáveis aarmazenamento - Google Patents

Composições de resina de epóxido estáveis aarmazenamento

Info

Publication number
BR0009063A
BR0009063A BR0009063-8A BR0009063A BR0009063A BR 0009063 A BR0009063 A BR 0009063A BR 0009063 A BR0009063 A BR 0009063A BR 0009063 A BR0009063 A BR 0009063A
Authority
BR
Brazil
Prior art keywords
epoxy resin
resin compositions
storage stable
stable epoxy
polyol
Prior art date
Application number
BR0009063-8A
Other languages
English (en)
Other versions
BR0009063B1 (pt
Inventor
Qian Tang
Gunnar Reitmajer
Martin Roth
Martin Spitzer
Philip David Willis
Original Assignee
Vantico Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico Ag filed Critical Vantico Ag
Publication of BR0009063A publication Critical patent/BR0009063A/pt
Publication of BR0009063B1 publication Critical patent/BR0009063B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5093—Complexes of amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Patente de Invenção: "COMPOSIçõES DE RESINA DEEPóXIDO ESTáVEIS A ARMAZENAMENTO". Uma composiçãocontendo (a) uma resina de epóxido com em média mais do que umgrupo 1,2-epóxido por molécula, (b) um poliol como agente deendurecimento de resina de epóxido e (c) um aduto microgelaminasólido como acelerador, apresenta uma elevada latência, uma boaestabilidade a armazenamento e uma larga faixa deprocessamento.
BRPI0009063-8A 1999-03-17 2000-03-06 composições de resina de epóxido estáveis a armazenamento e produtos reticulados. BR0009063B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH498/99 1999-03-17
CH49899 1999-03-17
PCT/EP2000/001956 WO2000055234A1 (de) 1999-03-17 2000-03-06 Lagerstabile epoxidharzzusammensetzungen

Publications (2)

Publication Number Publication Date
BR0009063A true BR0009063A (pt) 2001-12-18
BR0009063B1 BR0009063B1 (pt) 2010-04-06

Family

ID=4188386

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0009063-8A BR0009063B1 (pt) 1999-03-17 2000-03-06 composições de resina de epóxido estáveis a armazenamento e produtos reticulados.

Country Status (9)

Country Link
US (1) US6562884B1 (pt)
EP (1) EP1163280B1 (pt)
JP (1) JP4651198B2 (pt)
AT (1) ATE227314T1 (pt)
BR (1) BR0009063B1 (pt)
CA (1) CA2365480C (pt)
DE (1) DE50000731D1 (pt)
ES (1) ES2185583T3 (pt)
WO (1) WO2000055234A1 (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2245740T3 (es) 2001-05-14 2006-01-16 Huntsman Advanced Materials (Switzerland) Gmbh Composicion de moldeo para la produccion de placas bipolares.
US8109402B2 (en) 2001-10-04 2012-02-07 Schoeller Arca Systems Ab Collapsible container for transport and storage
US7063413B2 (en) * 2003-07-23 2006-06-20 Hewlett-Packard Development Company, L.P. Fluid ejection cartridge utilizing a two-part epoxy adhesive
US20060182949A1 (en) 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
US20070110951A1 (en) * 2005-07-20 2007-05-17 Frank Hoefflin Thermally expansible material substantially free of tackifier
DE102005039555A1 (de) * 2005-08-22 2007-03-01 Abb Technology Ltd. Verfahren zur Herstellung von Schalterpolteilen für Nieder - Mittel - und Hochspannungsschaltanlagen, sowie Schalterpolteil selbst
US20070054978A1 (en) * 2005-09-07 2007-03-08 Kabushiki Kaisha Shofu One-liquid medical and dental curable composition
US7982133B2 (en) * 2008-08-29 2011-07-19 Pratt & Whitney Canada Corp. Crack controlled resin insulated electrical coil
CA2774934A1 (en) 2008-09-23 2010-04-01 Aerovironment, Inc. Stator winding heat sink configuraton
DE102010019723A1 (de) * 2010-05-07 2011-11-10 Siemens Aktiengesellschaft Elektroisolationssystem für eine elektrische Hochspannungsrotationsmaschine
JP5275295B2 (ja) * 2010-07-21 2013-08-28 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US9309381B2 (en) 2011-06-24 2016-04-12 Air Products And Chemicals, Inc. Epoxy resin compositions using solvated solids
US20120328811A1 (en) * 2011-06-24 2012-12-27 Air Products And Chemicals, Inc. Epoxy Resin Compositions
DE102012010583A1 (de) 2012-05-21 2013-11-21 Mankiewicz Gebr. & Co. Gmbh & Co. Kg Gelcoat auf Epoxidharzbasis zur Oberflächenvergütung von Bauteilen aus faserverstärkten Kunststoffen
CN104379627A (zh) * 2012-06-15 2015-02-25 陶氏环球技术有限责任公司 潜伏型催化固化剂
JP2015519461A (ja) * 2012-06-15 2015-07-09 ダウ グローバル テクノロジーズ エルエルシー 硬化性組成物
CN104364287A (zh) * 2012-06-15 2015-02-18 陶氏环球技术有限责任公司 用于可固化组合物的潜伏型催化剂
DE102012224101A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen eines Messaufnehmers
DE102013211811A1 (de) * 2013-06-21 2014-12-24 Siemens Aktiengesellschaft Wandlereinheit, insbesondere Kombinationswandler
WO2020005941A1 (en) * 2018-06-25 2020-01-02 University Of Florida Research Foundation, Inc. Improving the mechanical integrity of polysulfonic acids
CN113234520A (zh) * 2021-05-19 2021-08-10 湖南加美乐素新材料股份有限公司 一种混凝土建筑钢模用脱模剂及其制备方法
CN116875241B (zh) * 2023-05-11 2024-04-05 海丰县美达化工涂料有限公司 一种环保耐酸干挂胶及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819136B2 (ja) * 1979-03-06 1983-04-16 日東電工株式会社 半導体封止用エポキシ樹脂組成物
EP0105488A3 (en) 1982-09-30 1987-07-22 Union Carbide Corporation Curable epoxy resin containing molding compositions
AU563372B2 (en) * 1982-12-16 1987-07-09 Celanese Corporation Crosslinked microgel particles
US4751256A (en) * 1986-01-21 1988-06-14 Interez, Inc. Aqueous epoxy resin can coating compositions
JPS63152672A (ja) 1986-06-10 1988-06-25 ユニオン・カ−バイド・コ−ポレ−シヨン 高固形分の耐垂れ下り性脂環式エポキシコ−テイング
DE3750166T2 (de) 1987-08-26 1995-02-23 Asahi Chemical Ind Härtemittel für ein härtbares Eintopfepoxidharzsystem.
JP2688694B2 (ja) 1989-01-20 1997-12-10 旭化成工業株式会社 コンデンサー封止用一液性エポキシ樹脂組成物
EP0633286A1 (de) 1993-07-09 1995-01-11 Ciba-Geigy Ag Härtbare, Füllstoffe enthaltende Epoxidharzzusammensetzung
JPH08319341A (ja) * 1995-05-26 1996-12-03 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
DE59711017D1 (de) * 1996-07-02 2003-12-24 Vantico Ag Härter für Epoxidharze
JP3582552B2 (ja) * 1996-08-09 2004-10-27 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
BR0009063B1 (pt) 2010-04-06
JP2002539307A (ja) 2002-11-19
DE50000731D1 (de) 2002-12-12
EP1163280B1 (de) 2002-11-06
JP4651198B2 (ja) 2011-03-16
CA2365480C (en) 2009-05-26
US6562884B1 (en) 2003-05-13
ATE227314T1 (de) 2002-11-15
WO2000055234A1 (de) 2000-09-21
EP1163280A1 (de) 2001-12-19
CA2365480A1 (en) 2000-09-21
ES2185583T3 (es) 2003-05-01

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/04/2010, OBSERVADAS AS CONDICOES LEGAIS.

B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 06.04.2020