BE855977A - Procede et appareil de montage de dispositifs sur un substrat - Google Patents

Procede et appareil de montage de dispositifs sur un substrat

Info

Publication number
BE855977A
BE855977A BE178667A BE178667A BE855977A BE 855977 A BE855977 A BE 855977A BE 178667 A BE178667 A BE 178667A BE 178667 A BE178667 A BE 178667A BE 855977 A BE855977 A BE 855977A
Authority
BE
Belgium
Prior art keywords
substrate
mounting devices
mounting
devices
Prior art date
Application number
BE178667A
Other languages
English (en)
French (fr)
Original Assignee
Cii
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii filed Critical Cii
Publication of BE855977A publication Critical patent/BE855977A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5142—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y10T29/53017—Web or strand-carried information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/081—With randomly actuated stopping means
    • Y10T83/088—Responsive to tool detector or work-feed-means detector
    • Y10T83/089—Responsive to tool characteristic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Control Of Position Or Direction (AREA)
  • Wire Bonding (AREA)
  • Drilling And Boring (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
BE178667A 1977-02-04 1977-06-22 Procede et appareil de montage de dispositifs sur un substrat BE855977A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7703271A FR2379909A1 (fr) 1977-02-04 1977-02-04 Procede et appareil de montage de dispositifs sur un substrat

Publications (1)

Publication Number Publication Date
BE855977A true BE855977A (fr) 1977-10-17

Family

ID=9186345

Family Applications (1)

Application Number Title Priority Date Filing Date
BE178667A BE855977A (fr) 1977-02-04 1977-06-22 Procede et appareil de montage de dispositifs sur un substrat

Country Status (10)

Country Link
US (2) US4236306A (de)
JP (1) JPS5397369A (de)
BE (1) BE855977A (de)
CA (1) CA1091818A (de)
CH (1) CH628196A5 (de)
DE (1) DE2804693A1 (de)
FR (1) FR2379909A1 (de)
GB (1) GB1590545A (de)
NL (1) NL185966C (de)
SE (1) SE422868B (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
EP0020832A1 (de) * 1979-06-26 1981-01-07 Excellon Industries Mustererkennungssystem und Verfahren zu seiner Anwendung
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
FR2479641A1 (fr) * 1980-03-25 1981-10-02 Numergo Sa Atelier flexible permettant la digitalisation et le cablage de circuits electroniques hybrides
CH638072A5 (fr) * 1980-05-19 1983-08-31 Far Fab Assortiments Reunies Procede et dispositif de report d'un composant electronique sur un substrat.
FR2495836A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres
JPS5718392A (en) * 1980-12-29 1982-01-30 Ikegami Tsushinki Kk Position detector
JPS57128175U (de) * 1981-02-03 1982-08-10
US4460421A (en) * 1982-11-29 1984-07-17 At&T Technologies, Inc. Methods of and apparatus for indexing a repetitively patterned strip past a plurality of work stations
JPS6021535A (ja) * 1983-06-30 1985-02-02 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体装置を相互接続する方法
SE454439B (sv) * 1983-07-06 1988-05-02 Tetra Pak Ab Sett och anordning att med fotoelektriska medel detektera och behorighetskontrollera gjorda styrmarkeringar pa en med tryck dekorerad lopande materialbana
US4868978A (en) * 1985-11-12 1989-09-26 Siemens Aktiengesellschaft Method and apparatus for equipping substrates with micropacks
US4972572A (en) * 1985-11-13 1990-11-27 Fujitsu Limited IC sheet cutting press and IC sheet processing apparatus using the same
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
US4629420A (en) * 1986-03-26 1986-12-16 Dynapert-Htc Corp. Vapor level control for vapor processing system
JPH0636393B2 (ja) * 1987-04-15 1994-05-11 松下電器産業株式会社 電子部品の製造方法
US5251372A (en) * 1988-08-03 1993-10-12 Houghton Jon C Method and apparatus for framing a film mounted integrated circuit
US5084962A (en) * 1988-08-24 1992-02-04 Tdk Corporation Apparatus for and method of automatically mounting electronic component on printed circuit board
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
US5113565A (en) * 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames
US5410124A (en) * 1993-04-01 1995-04-25 Micron Technology, Inc. Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip
US5503895A (en) * 1993-09-20 1996-04-02 Bi-Link Metal Specialties Supply feedstock for workpiece finishing machine
EP0665706A1 (de) * 1994-01-28 1995-08-02 Molex Incorporated Verfahren zur Herstellung von flachen flexiblen Schaltungen
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
US6405430B1 (en) * 1996-02-07 2002-06-18 Micron Technology, Inc. Workpiece moving methods
JP3422645B2 (ja) * 1997-02-14 2003-06-30 富士通株式会社 回路素子配置装置
TW396474B (en) * 1997-07-11 2000-07-01 Hitachi Ltd Method for forming bump bondings
KR100319198B1 (ko) * 1999-11-17 2001-12-29 윤종용 반도체 모듈에 히트 싱크를 조립하는 설비 및 그 조립 방법
US6629631B2 (en) * 2001-06-04 2003-10-07 Sony Corporation Solder iron pressure monitor and method of using same in manufacturing a cathode ray tube
US7296727B2 (en) * 2001-06-27 2007-11-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic components
KR100490700B1 (ko) * 2002-09-26 2005-05-19 주식회사 풍산마이크로텍 전자부품 조립용 리벳팅 머신.
GB2437999B (en) * 2006-05-10 2009-07-29 Dek Int Gmbh Workpiece carrier and workpiece positioning system and method
JP5083158B2 (ja) * 2008-10-03 2012-11-28 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置における操作指示方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB801232A (en) * 1956-04-05 1958-09-10 Gen Electric Co Ltd Improvements in or relating to automatic machines for performing a sequence of operations on a plurality of articles
DE1453097A1 (de) * 1964-06-10 1969-01-02 Rheinische Nadelfab Gmbh Fussbodenpflege- und -reinigungsmaschine
US3412451A (en) * 1966-02-10 1968-11-26 Amp Inc Force limiting tool
US3508315A (en) * 1967-07-26 1970-04-28 Essington Metal Works Inc Apparatus for inserting and for securing preformed electronic components to printed circuit boards
US3597824A (en) * 1968-03-19 1971-08-10 Matsushita Electric Ind Co Ltd Full-automatic electric part mounting apparatus
US3744361A (en) * 1971-02-08 1973-07-10 Lummus Industries Process and apparatus for cutting elongated material
US3710479A (en) * 1971-03-01 1973-01-16 Ibm Component insertion apparatus
US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
US3777350A (en) * 1971-07-26 1973-12-11 Matsushita Electric Ind Co Ltd Component mounting apparatus
US3742574A (en) * 1971-12-03 1973-07-03 Gte Automatic Electric Lab Inc Wire braid forming apparatus
US3765075A (en) * 1972-01-03 1973-10-16 Honeywell Inf Systems Method and apparatus for inserting pins into a circuit board
US3783488A (en) * 1972-07-05 1974-01-08 Universal Instruments Corp Film mounted electronic component insertion machine
FR2205800B1 (de) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
FR2225977A5 (en) * 1973-04-13 1974-11-08 Honeywell Bull Soc Ind Feeding mechanism for perforated flexible strip - claws feed strip intermittently under control of double slide mechanism
FR2238247B1 (de) * 1973-06-27 1976-11-12 Honeywell Bull Soc Ind
US3893232A (en) * 1973-08-16 1975-07-08 Ibm Electronic component assembly apparatus
US4051593A (en) * 1975-04-07 1977-10-04 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JPS51116968A (en) * 1975-04-07 1976-10-14 Matsushita Electric Ind Co Ltd Device for inserting electric parts
US4080730A (en) * 1976-09-07 1978-03-28 Usm Corporation Machine for assembling components

Also Published As

Publication number Publication date
DE2804693C2 (de) 1992-05-21
JPS5397369A (en) 1978-08-25
FR2379909A1 (fr) 1978-09-01
US4236306A (en) 1980-12-02
JPS6337520B2 (de) 1988-07-26
GB1590545A (en) 1981-06-03
SE422868B (sv) 1982-03-29
FR2379909B1 (de) 1980-06-13
NL185966B (nl) 1990-03-16
DE2804693A1 (de) 1978-08-10
CA1091818A (fr) 1980-12-16
SE7709735L (sv) 1978-08-05
NL185966C (nl) 1990-08-16
CH628196A5 (fr) 1982-02-15
NL7712371A (nl) 1978-08-08
US4236301A (en) 1980-12-02

Similar Documents

Publication Publication Date Title
BE855977A (fr) Procede et appareil de montage de dispositifs sur un substrat
BE860351A (fr) Procede et dispositif de connexion pour cables meplats flexibles
FR2306489A1 (fr) Procede et dispositif de telemesure de donnees de diagraphie
FR2353472A1 (fr) Procede et dispositif de manutention de bandes imprimees
DE2862391D1 (de) Control apparatus for a semi-conductor laser device
IT1091986B (it) Metodo ed apparecchiatura per tendere un dispositivo di fissaggio
JPS51141365A (en) Device for stripping and cleaning substrate
BR7804426A (pt) Aparelho de tratamento de tarefas para um sistema de computador
FR2344368A1 (fr) Procede et dispositif de brasage
FR2349981A1 (fr) Dispositif a denuder des cables
FR2299145A1 (fr) Procede et dispositif pour la f
FR2278131A1 (fr) Procede et dispositif de reperage de pistes transversales
FR2401682B1 (fr) Appareil et procede de sechage par pulverisation
BE868705A (fr) Dispositif de surveillance de la temperature sur un organe en mouvement
JPS5221041A (en) Method and apparatus for uniformly coating sureace on periodically driven manufacturing device
BE869142A (fr) Procede et dispositif de pulverisation de liquides
FR2328335A1 (fr) Procede et dispositif de telecopie par belinographie
BE830445A (fr) Procede et dispositif pour denuder un support de son revetement
FR2376806B1 (fr) Dispositif de montage d'un appareil de nettoyage de bandes transporteuses
DE2861038D1 (en) Method of forming leads on a semiconductor device and apparatus designed for carrying out the process
BE870437A (fr) Procede et dispositif de mise a la terre
AT384441B (de) Vorrichtung zum behandeln eines bewegten substrates
BE868336A (fr) Procede et dispositif de fabrication de panneaux
IT1076194B (it) Procedimento,e dispositivo per il rivestimento uniforme di substrati a superficie
FR2530059B1 (fr) Procede et appareil de commande d'affichage d'un arc de cercle sur un dispositif d'affichage

Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: CIE INTERNATIONALE POUR L INFORMATIQUE CII- HONEY

Effective date: 19930630