BE723340A - - Google Patents

Info

Publication number
BE723340A
BE723340A BE723340DA BE723340A BE 723340 A BE723340 A BE 723340A BE 723340D A BE723340D A BE 723340DA BE 723340 A BE723340 A BE 723340A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE723340A publication Critical patent/BE723340A/xx

Links

Classifications

    • H01L29/0638—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H01L29/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Bipolar Transistors (AREA)
  • Weting (AREA)
  • Dicing (AREA)
  • Electrodes Of Semiconductors (AREA)
BE723340D 1967-11-04 1968-11-04 BE723340A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.
NL6715013A NL6715013A (fr) 1967-11-04 1967-11-04

Publications (1)

Publication Number Publication Date
BE723340A true BE723340A (fr) 1969-05-05

Family

ID=26644261

Family Applications (1)

Application Number Title Priority Date Filing Date
BE723340D BE723340A (fr) 1967-11-04 1968-11-04

Country Status (11)

Country Link
US (2) US3839103A (fr)
JP (1) JPS5013633B1 (fr)
AT (1) AT281122B (fr)
BE (1) BE723340A (fr)
CH (1) CH483725A (fr)
DE (1) DE1805826C3 (fr)
ES (1) ES359847A1 (fr)
FR (1) FR1592176A (fr)
GB (1) GB1243355A (fr)
NL (2) NL6715013A (fr)
SE (1) SE354380B (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4819113B1 (fr) * 1969-08-27 1973-06-11
JPS573225B2 (fr) * 1974-08-19 1982-01-20
JPS5261333U (fr) * 1975-10-31 1977-05-06
CH594989A5 (fr) * 1976-09-03 1978-01-31 Bbc Brown Boveri & Cie
US4076558A (en) * 1977-01-31 1978-02-28 International Business Machines Corporation Method of high current ion implantation and charge reduction by simultaneous kerf implant
US4665420A (en) * 1984-11-08 1987-05-12 Rca Corporation Edge passivated charge-coupled device image sensor
US4835592A (en) * 1986-03-05 1989-05-30 Ixys Corporation Semiconductor wafer with dice having briding metal structure and method of manufacturing same
JP2578600B2 (ja) * 1987-04-28 1997-02-05 オリンパス光学工業株式会社 半導体装置
US5237197A (en) * 1989-06-26 1993-08-17 University Of Hawaii Integrated VLSI radiation/particle detector with biased pin diodes
DE58909785D1 (de) * 1989-11-28 1997-04-10 Siemens Ag Halbleiterscheibe mit dotiertem Ritzrahmen
ATE106489T1 (de) * 1990-06-21 1994-06-15 Chiang Mu Long Eckenschutz für wände, träger, stützen etc.
FR2694410B1 (fr) * 1992-07-30 1994-10-28 Sgs Thomson Microelectronics Procédé de test de la résistance par carré de couches diffusées.
DE19539527C2 (de) * 1995-10-24 2001-02-22 August Braun Winkelleiste mit Armierungsmaterial für den Putz auf einer Wärmedämmung
CN110832640B (zh) * 2017-06-27 2023-12-08 株式会社半导体能源研究所 半导体装置、半导体晶片、存储装置及电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282779A (fr) * 1961-09-08
US3197681A (en) * 1961-09-29 1965-07-27 Texas Instruments Inc Semiconductor devices with heavily doped region to prevent surface inversion
NL294370A (fr) * 1963-06-20
GB993388A (en) * 1964-02-05 1965-05-26 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3395320A (en) * 1965-08-25 1968-07-30 Bell Telephone Labor Inc Isolation technique for integrated circuit structure

Also Published As

Publication number Publication date
NL154061B (nl) 1977-07-15
NL6715013A (fr) 1969-05-06
US3839103A (en) 1974-10-01
DE1805826A1 (de) 1969-06-26
DE1805826B2 (de) 1976-04-22
SE354380B (fr) 1973-03-05
US3772576A (en) 1973-11-13
CH483725A (de) 1969-12-31
FR1592176A (fr) 1970-05-11
JPS5013633B1 (fr) 1975-05-21
DE1805826C3 (de) 1978-06-01
GB1243355A (en) 1971-08-18
NL6715014A (fr) 1969-05-06
ES359847A1 (es) 1970-10-01
AT281122B (de) 1970-05-11

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