BE713722A - - Google Patents

Info

Publication number
BE713722A
BE713722A BE713722DA BE713722A BE 713722 A BE713722 A BE 713722A BE 713722D A BE713722D A BE 713722DA BE 713722 A BE713722 A BE 713722A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE713722A publication Critical patent/BE713722A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
    • H10D84/615—Combinations of vertical BJTs and one or more of resistors or capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/043—Dual dielectric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/102—Mask alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/162—Testing steps
BE713722D 1967-05-23 1968-04-16 BE713722A (ref)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64061067A 1967-05-23 1967-05-23

Publications (1)

Publication Number Publication Date
BE713722A true BE713722A (ref) 1968-09-16

Family

ID=24568953

Family Applications (1)

Application Number Title Priority Date Filing Date
BE713722D BE713722A (ref) 1967-05-23 1968-04-16

Country Status (9)

Country Link
US (1) US3539876A (ref)
BE (1) BE713722A (ref)
CH (1) CH483127A (ref)
DE (1) DE1764336B2 (ref)
ES (1) ES354217A1 (ref)
FR (2) FR1064185A (ref)
GB (4) GB1236404A (ref)
NL (1) NL6807308A (ref)
SE (1) SE359689B (ref)

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DE1138165B (de) * 1957-12-14 1962-10-18 Telefunken Patent Diode oder Transistor
US3781683A (en) * 1971-03-30 1973-12-25 Ibm Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration
US3689803A (en) * 1971-03-30 1972-09-05 Ibm Integrated circuit structure having a unique surface metallization layout
US3983023A (en) * 1971-03-30 1976-09-28 Ibm Corporation Integrated semiconductor circuit master-slice structure in which the insulation layer beneath unused contact terminals is free of short-circuits
US3811182A (en) * 1972-03-31 1974-05-21 Ibm Object handling fixture, system, and process
US3801910A (en) * 1972-07-03 1974-04-02 Ibm Externally accessing mechanical difficult to access circuit nodes using photo-responsive conductors in integrated circuits
US3849872A (en) * 1972-10-24 1974-11-26 Ibm Contacting integrated circuit chip terminal through the wafer kerf
US3774088A (en) * 1972-12-29 1973-11-20 Ibm An integrated circuit test transistor structure and method of fabricating the same
US3993934A (en) * 1973-05-29 1976-11-23 Ibm Corporation Integrated circuit structure having a plurality of separable circuits
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure
FR2280203A1 (fr) * 1974-07-26 1976-02-20 Thomson Csf Procede d'ajustement de tension de seuil de transistors a effet de champ
US4542579A (en) * 1975-06-30 1985-09-24 International Business Machines Corporation Method for forming aluminum oxide dielectric isolation in integrated circuits
GB1520925A (en) * 1975-10-06 1978-08-09 Mullard Ltd Semiconductor device manufacture
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers
US4040891A (en) * 1976-06-30 1977-08-09 Ibm Corporation Etching process utilizing the same positive photoresist layer for two etching steps
US4111720A (en) * 1977-03-31 1978-09-05 International Business Machines Corporation Method for forming a non-epitaxial bipolar integrated circuit
JPS60953B2 (ja) * 1977-12-30 1985-01-11 富士通株式会社 半導体集積回路装置
JPS5688350A (en) 1979-12-19 1981-07-17 Toshiba Corp Semiconductor device
US4272882A (en) * 1980-05-08 1981-06-16 Rca Corporation Method of laying out an integrated circuit with specific alignment of the collector contact with the emitter region
US4434134A (en) 1981-04-10 1984-02-28 International Business Machines Corporation Pinned ceramic substrate
DE3280233D1 (de) * 1981-09-11 1990-10-04 Toshiba Kawasaki Kk Verfahren zum herstellen eines substrats fuer multischichtschaltung.
GB2122417B (en) * 1982-06-01 1985-10-09 Standard Telephones Cables Ltd Integrated circuits
EP0155965A4 (en) * 1983-09-15 1987-09-07 Mosaic Systems Inc DISC.
DE3724634C2 (de) * 1987-07-22 1995-08-03 Hertz Inst Heinrich Elektro-optisches Bauelement
US5214657A (en) * 1990-09-21 1993-05-25 Micron Technology, Inc. Method for fabricating wafer-scale integration wafers and method for utilizing defective wafer-scale integration wafers
US7926097B2 (en) 1996-11-29 2011-04-12 Ellis Iii Frampton E Computer or microchip protected from the internet by internal hardware
US6167428A (en) 1996-11-29 2000-12-26 Ellis; Frampton E. Personal computer microprocessor firewalls for internet distributed processing
US6725250B1 (en) * 1996-11-29 2004-04-20 Ellis, Iii Frampton E. Global network computers
US20050180095A1 (en) 1996-11-29 2005-08-18 Ellis Frampton E. Global network computers
US7506020B2 (en) 1996-11-29 2009-03-17 Frampton E Ellis Global network computers
US8225003B2 (en) 1996-11-29 2012-07-17 Ellis Iii Frampton E Computers and microchips with a portion protected by an internal hardware firewall
US7805756B2 (en) 1996-11-29 2010-09-28 Frampton E Ellis Microchips with inner firewalls, faraday cages, and/or photovoltaic cells
US6201267B1 (en) 1999-03-01 2001-03-13 Rensselaer Polytechnic Institute Compact low power complement FETs
US20050205999A1 (en) * 2003-08-30 2005-09-22 Visible Tech-Knowledgy, Inc. Method for pattern metalization of substrates
US8256147B2 (en) 2004-11-22 2012-09-04 Frampton E. Eliis Devices with internal flexibility sipes, including siped chambers for footwear
US8125796B2 (en) 2007-11-21 2012-02-28 Frampton E. Ellis Devices with faraday cages and internal flexibility sipes
US12401619B2 (en) 2010-01-26 2025-08-26 Frampton E. Ellis Computer or microchip with a secure system bios having a separate private network connection to a separate private network
US8429735B2 (en) 2010-01-26 2013-04-23 Frampton E. Ellis Method of using one or more secure private networks to actively configure the hardware of a computer or microchip
CN107271930B (zh) * 2017-06-09 2019-11-01 合肥工业大学 一种折合梁结构的mems磁场传感器及制备方法

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* Cited by examiner, † Cited by third party
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US2884571A (en) * 1952-07-12 1959-04-28 Sylvania Electric Prod Printed circuit
US2877544A (en) * 1954-08-30 1959-03-17 Western Electric Co Method of locating and replacing defective components of encapsulated electrical assemblies
US3252087A (en) * 1961-06-15 1966-05-17 Marine Electric Corp Method and apparatus for identifying wires
US3239716A (en) * 1961-09-11 1966-03-08 Jefferson Electric Co Safety circuit for sequence start ballast with disconnect switches in the primary and secondary windings
US3229119A (en) * 1963-05-17 1966-01-11 Sylvania Electric Prod Transistor logic circuits
US3197710A (en) * 1963-05-31 1965-07-27 Westinghouse Electric Corp Complementary transistor structure
US3393349A (en) * 1964-04-30 1968-07-16 Motorola Inc Intergrated circuits having isolated islands with a plurality of semiconductor devices in each island
BE670213A (ref) * 1964-09-30 1900-01-01
US3369159A (en) * 1964-12-21 1968-02-13 Texas Instruments Inc Printed transistors and methods of making same
DE1289187B (de) * 1965-04-17 1969-02-13 Telefunken Patent Verfahren zum Herstellen einer mikroelektronischen Schaltungsanordnung
US3368113A (en) * 1965-06-28 1968-02-06 Westinghouse Electric Corp Integrated circuit structures, and method of making same, including a dielectric medium for internal isolation
US3340620A (en) * 1965-09-20 1967-09-12 Russell L Meade Training apparatus
US3419765A (en) * 1965-10-01 1968-12-31 Texas Instruments Inc Ohmic contact to semiconductor devices
US3405224A (en) * 1966-04-20 1968-10-08 Nippon Electric Co Sealed enclosure for electronic device
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus
US3445727A (en) * 1967-05-15 1969-05-20 Raytheon Co Semiconductor contact and interconnection structure

Also Published As

Publication number Publication date
SE359689B (ref) 1973-09-03
GB1236401A (en) 1971-06-23
GB1236402A (en) 1971-06-23
FR1580199A (ref) 1969-09-05
GB1236403A (en) 1971-06-23
CH483127A (de) 1969-12-15
GB1236404A (en) 1971-06-23
DE1764336A1 (de) 1972-03-23
US3539876A (en) 1970-11-10
FR1064185A (fr) 1954-05-11
ES354217A1 (es) 1970-10-16
DE1764336B2 (de) 1975-08-14
NL6807308A (ref) 1968-11-25

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: INTERNATIONAL BUSINESS MACHINES CORP.

Effective date: 19860430