BE598393A - Procédé de fabrication d'un dispositif semi-conducteur en silicium - Google Patents

Procédé de fabrication d'un dispositif semi-conducteur en silicium

Info

Publication number
BE598393A
BE598393A BE598393A BE598393A BE598393A BE 598393 A BE598393 A BE 598393A BE 598393 A BE598393 A BE 598393A BE 598393 A BE598393 A BE 598393A BE 598393 A BE598393 A BE 598393A
Authority
BE
Belgium
Prior art keywords
manufacturing
semiconductor device
silicon semiconductor
silicon
semiconductor
Prior art date
Application number
BE598393A
Other languages
English (en)
French (fr)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE598393A publication Critical patent/BE598393A/fr

Links

Classifications

    • H10P95/00—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
BE598393A 1959-12-30 1960-12-21 Procédé de fabrication d'un dispositif semi-conducteur en silicium BE598393A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES66475A DE1128924B (de) 1959-12-30 1959-12-30 Verfahren zur Herstellung einer Halbleiteranordnung aus Silizium

Publications (1)

Publication Number Publication Date
BE598393A true BE598393A (fr) 1961-06-21

Family

ID=7498842

Family Applications (1)

Application Number Title Priority Date Filing Date
BE598393A BE598393A (fr) 1959-12-30 1960-12-21 Procédé de fabrication d'un dispositif semi-conducteur en silicium

Country Status (6)

Country Link
US (1) US3050667A (index.php)
BE (1) BE598393A (index.php)
CH (1) CH380247A (index.php)
DE (1) DE1128924B (index.php)
GB (1) GB907427A (index.php)
NL (1) NL249694A (index.php)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL122782C (index.php) * 1959-08-14 1900-01-01
DE1133834B (de) * 1960-09-21 1962-07-26 Siemens Ag Siliziumgleichrichter und Verfahren zu dessen Herstellung
US3172829A (en) * 1961-01-24 1965-03-09 Of an alloy to a support
US3127285A (en) * 1961-02-21 1964-03-31 Vapor condensation doping method
NL275010A (index.php) * 1961-03-28 1900-01-01
US3226265A (en) * 1961-03-30 1965-12-28 Siemens Ag Method for producing a semiconductor device with a monocrystalline semiconductor body
NL291270A (index.php) * 1961-08-12
US3163915A (en) * 1961-09-15 1965-01-05 Richard J Fox Method of fabricating surface-barrier detectors
NL297607A (index.php) * 1962-09-07
US3159462A (en) * 1962-09-24 1964-12-01 Int Rectifier Corp Semiconductor and secured metal base and method of making the same
BE639315A (index.php) * 1962-10-31
US3298093A (en) * 1963-04-30 1967-01-17 Hughes Aircraft Co Bonding process
US3339274A (en) * 1964-03-16 1967-09-05 Hughes Aircraft Co Top contact for surface protected semiconductor devices
US3245764A (en) * 1965-01-28 1966-04-12 Alloys Unltd Inc Gold alloy clad products
US3453724A (en) * 1965-04-09 1969-07-08 Rca Corp Method of fabricating semiconductor device
DE1298632B (de) * 1965-10-26 1969-07-03 Siemens Ag Verfahren zum sperrfreien Verbinden eines Halbleiterkoerpers mit einer metallischen Tragplatte
US3454374A (en) * 1966-05-13 1969-07-08 Youngwood Electronic Metals In Method of forming presoldering components and composite presoldering components made thereby
US3593412A (en) * 1969-07-22 1971-07-20 Motorola Inc Bonding system for semiconductor device
US3620692A (en) * 1970-04-01 1971-11-16 Rca Corp Mounting structure for high-power semiconductor devices
US3660632A (en) * 1970-06-17 1972-05-02 Us Navy Method for bonding silicon chips to a cold substrate
EP0039507A1 (en) * 1980-05-05 1981-11-11 LeaRonal, Inc. A process of packaging a semiconductor and a packaging structure for containing semiconductive elements
DE3518699A1 (de) * 1985-05-24 1986-11-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterelement
US5177590A (en) * 1989-11-08 1993-01-05 Kabushiki Kaisha Toshiba Semiconductor device having bonding wires

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE539442A (index.php) * 1954-07-01
NL190331A (index.php) * 1954-08-26 1900-01-01
NL109558C (index.php) * 1955-05-10 1900-01-01
US2964830A (en) * 1957-01-31 1960-12-20 Westinghouse Electric Corp Silicon semiconductor devices
US2922092A (en) * 1957-05-09 1960-01-19 Westinghouse Electric Corp Base contact members for semiconductor devices
US2965519A (en) * 1958-11-06 1960-12-20 Bell Telephone Labor Inc Method of making improved contacts to semiconductors
US2973466A (en) * 1959-09-09 1961-02-28 Bell Telephone Labor Inc Semiconductor contact

Also Published As

Publication number Publication date
DE1128924B (de) 1962-05-03
CH380247A (de) 1964-07-31
NL249694A (index.php)
US3050667A (en) 1962-08-21
GB907427A (en) 1962-10-03

Similar Documents

Publication Publication Date Title
BE598393A (fr) Procédé de fabrication d'un dispositif semi-conducteur en silicium
CH349703A (fr) Procédé de fabrication d'un dispositif semi-conducteur
CH350047A (fr) Procédé de fabrication d'un dispositif redresseur au silicium
FR1233420A (fr) Dispositif semi-conducteur en carbure de silicium et son procédé de fabrication
CH400370A (fr) Procédé de fabrication d'un dispositif semi-conducteur
CH392700A (fr) Procédé de fabrication d'un dispositif semi-conducteur
FR1293869A (fr) Procédé de fabrication d'un dispositif à semi-conducteur
FR1364466A (fr) Procédé de fabrication d'un dispositif à semi-conducteur
FR1451676A (fr) Procédé de fabrication d'un dispositif semiconducteur
CH369214A (fr) Procédé de fabrication d'un dispositif semi-conducteur et dispositif semi-conducteur obtenu par ce procédé
CH369525A (fr) Dispositif semi-conducteur photosensible et procédé de fabrication dudit dispositif
FR1263548A (fr) Dispositif semi-conducteur du type pnpn et son procédé de fabrication
FR1206897A (fr) Procédé de fabrication d'un dispositif semi-conducteur
CH337888A (fr) Procédé de fabrication d'un dispositif thermoélectrique
FR1330717A (fr) Procédé de fabrication d'un dispositif semi-conducteur en silicium
BE601416A (fr) Procédé de fabrication d'un dispositif semi-conducteur en silicium.
FR1331912A (fr) Procédé de fabrication d'un dispositif semi-conducteur en silicium
FR1330719A (fr) Procédé de fabrication d'un dispositif semi-conducteur en silicium
FR1233332A (fr) Procédé de fabrication d'un semi-conducteur à base de silicium
FR1277290A (fr) Procédé de fabrication d'un dispositif semi-conducteur
FR1406461A (fr) Procédé de fabrication d'un dispositif semi-conducteur
FR1234100A (fr) Procédé pour la fabrication d'un dispositif semi-conducteur
FR1374096A (fr) Procédé de fabrication d'un dispositif à semi-conducteur
FR1348733A (fr) Procédé de fabrication d'un dispositif à semi-conducteur
FR1268113A (fr) Procédé de fabrication d'un dispositif à semi-conducteur