BE586536R - Dispositif semi-conducteur électrique - Google Patents

Dispositif semi-conducteur électrique

Info

Publication number
BE586536R
BE586536R BE586536A BE586536A BE586536R BE 586536 R BE586536 R BE 586536R BE 586536 A BE586536 A BE 586536A BE 586536 A BE586536 A BE 586536A BE 586536 R BE586536 R BE 586536R
Authority
BE
Belgium
Prior art keywords
semiconductor device
electric semiconductor
electric
semiconductor
Prior art date
Application number
BE586536A
Other languages
English (en)
Inventor
H Wagner
Original Assignee
Bell Telephone Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell Telephone Mfg filed Critical Bell Telephone Mfg
Application granted granted Critical
Publication of BE586536R publication Critical patent/BE586536R/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
BE586536A 1959-01-14 1960-01-14 Dispositif semi-conducteur électrique BE586536R (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEST14659A DE1098103B (de) 1959-01-14 1959-01-14 Verfahren zum Einbau eines elektrischen Halbleiterelementes in ein Gehaeuse
GB234/61A GB942331A (en) 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
BE586536R true BE586536R (fr) 1960-07-14

Family

ID=25993904

Family Applications (1)

Application Number Title Priority Date Filing Date
BE586536A BE586536R (fr) 1959-01-14 1960-01-14 Dispositif semi-conducteur électrique

Country Status (4)

Country Link
BE (1) BE586536R (fr)
DE (1) DE1098103B (fr)
FR (2) FR1299502A (fr)
GB (2) GB934185A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1242758B (de) * 1961-04-07 1967-06-22 Siemens Ag Halbleiteranordnung, insbesondere fuer grosse Leistungen, bei der ein duenner, scheibenfoermiger Halbleiterkoerper auf einer Traegerplatte befestigt ist
NL280742A (fr) * 1961-08-12
DE1271834B (de) * 1961-09-02 1968-07-04 Siemens Ag Halbleiteranordnung
DE1229647B (de) * 1961-12-22 1966-12-01 Walter Brandt G M B H Verfahren zum Herstellen einer Flaechengleichrichteranordnung
NL286498A (fr) * 1961-12-30 1900-01-01
JPS5952030B2 (ja) * 1981-03-26 1984-12-17 株式会社東芝 冷間圧接方法
US4579102A (en) * 1983-04-14 1986-04-01 Sukup Eugene G Biomass heat exchanger furnace
JP3426101B2 (ja) * 1997-02-25 2003-07-14 三菱電機株式会社 整流装置
DE10127052A1 (de) * 2001-06-02 2002-12-12 Bosch Gmbh Robert Verbindung eines Halbleiterbauelements mit einem Kühlkörper, Halbleiterbauelement, Kühlkörper und Verfahren
DE10141603A1 (de) * 2001-08-24 2003-03-06 Bosch Gmbh Robert Verfahren zum Befestigen eines elektrischen Elements sowie Baueinheit mit danach befestigtem elektrischen Element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO66796A (fr) * 1941-09-04
NL93941C (fr) * 1955-03-24 1959-11-16

Also Published As

Publication number Publication date
FR1299502A (fr) 1962-07-27
DE1098103B (de) 1961-01-26
GB942331A (en) 1963-11-20
GB934185A (en) 1963-08-14
FR81208E (fr) 1963-08-16

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