Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S228/00—Metal fusion bonding
  • Y10S228/903—Metal to nonmetal

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Power Engineering (AREA)
• Furnace Details (AREA)
• Die Bonding (AREA)
• Tunnel Furnaces (AREA)
• Crystals, And After-Treatments Of Crystals (AREA)
• Electrodes Of Semiconductors (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=25989851

Family Applications (1)

Country Status (7)

Families Citing this family (6)

Family Cites Families (14)

• 0
  • NL NL236288D patent/NL236288A/xx unknown
  • BE BE575988D patent/BE575988A/xx unknown
  • NL NL131155D patent/NL131155C/xx active
• 1958
  • 1958-02-22 DE DEP20194A patent/DE1150455B/de active Pending
  • 1958-03-26 DE DEP20396A patent/DE1230911B/de active Pending
• 1959
  • 1959-02-19 CH CH6983759A patent/CH372759A/de unknown
  • 1959-02-19 GB GB5766/59A patent/GB907568A/en not_active Expired
  • 1959-02-20 FR FR787406A patent/FR1224318A/fr not_active Expired
• 1961
  • 1961-06-07 US US115484A patent/US3209436A/en not_active Expired - Lifetime

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