AU659857B2 - Mildly basic accelerating solutions for direct electroplating - Google Patents
Mildly basic accelerating solutions for direct electroplatingInfo
- Publication number
- AU659857B2 AU659857B2 AU22280/92A AU2228092A AU659857B2 AU 659857 B2 AU659857 B2 AU 659857B2 AU 22280/92 A AU22280/92 A AU 22280/92A AU 2228092 A AU2228092 A AU 2228092A AU 659857 B2 AU659857 B2 AU 659857B2
- Authority
- AU
- Australia
- Prior art keywords
- solution
- substrate
- accelerating
- conducting
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Indole Compounds (AREA)
- Paints Or Removers (AREA)
- Pyridine Compounds (AREA)
- Mobile Radio Communication Systems (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Transceivers (AREA)
- Electrolytic Production Of Metals (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71818691A | 1991-06-20 | 1991-06-20 | |
US718186 | 1991-06-20 | ||
PCT/US1992/005084 WO1993000456A1 (en) | 1991-06-20 | 1992-06-17 | Mildly basic accelerating solutions for direct electroplating |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2228092A AU2228092A (en) | 1993-01-25 |
AU659857B2 true AU659857B2 (en) | 1995-06-01 |
Family
ID=24885150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU22280/92A Ceased AU659857B2 (en) | 1991-06-20 | 1992-06-17 | Mildly basic accelerating solutions for direct electroplating |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP0590046B1 (es) |
JP (1) | JP3143707B2 (es) |
KR (1) | KR100295144B1 (es) |
AT (1) | ATE179761T1 (es) |
AU (1) | AU659857B2 (es) |
DE (1) | DE69229115T2 (es) |
DK (1) | DK0590046T3 (es) |
ES (1) | ES2132124T3 (es) |
GR (1) | GR3030770T3 (es) |
WO (1) | WO1993000456A1 (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2119050C (en) | 1993-03-18 | 1999-11-23 | Nayan H. Joshi | Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
JP3054746B2 (ja) * | 1997-02-03 | 2000-06-19 | 奥野製薬工業株式会社 | 非導電性材料への電気めっき方法 |
SG107593A1 (en) * | 2002-06-04 | 2004-12-29 | Agency Science Tech & Res | Method for electroless metalisation of polymer substrate |
JP5072059B2 (ja) * | 2005-10-25 | 2012-11-14 | 住友軽金属工業株式会社 | 銅管または銅合金管内面の洗浄方法 |
JP7187363B2 (ja) | 2019-03-18 | 2022-12-12 | Toyo Tire株式会社 | 空気入りタイヤ |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3340164A (en) * | 1963-12-26 | 1967-09-05 | Sperry Rand Corp | Method of copper plating anodized aluminum |
US4311551A (en) * | 1979-04-12 | 1982-01-19 | Philip A. Hunt Chemical Corp. | Composition and method for etching copper substrates |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3793038A (en) * | 1973-01-02 | 1974-02-19 | Crown City Plating Co | Process for electroless plating |
SU921124A1 (ru) * | 1979-06-19 | 1982-04-15 | Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср | Способ металлизации отверстий печатных плат |
US5071517A (en) * | 1989-11-21 | 1991-12-10 | Solution Technology Systems | Method for directly electroplating a dielectric substrate and plated substrate so produced |
-
1992
- 1992-06-17 DK DK92913993T patent/DK0590046T3/da active
- 1992-06-17 AT AT92913993T patent/ATE179761T1/de not_active IP Right Cessation
- 1992-06-17 EP EP92913993A patent/EP0590046B1/en not_active Expired - Lifetime
- 1992-06-17 DE DE69229115T patent/DE69229115T2/de not_active Expired - Lifetime
- 1992-06-17 KR KR1019930703990A patent/KR100295144B1/ko not_active IP Right Cessation
- 1992-06-17 WO PCT/US1992/005084 patent/WO1993000456A1/en active IP Right Grant
- 1992-06-17 JP JP05501547A patent/JP3143707B2/ja not_active Expired - Lifetime
- 1992-06-17 ES ES92913993T patent/ES2132124T3/es not_active Expired - Lifetime
- 1992-06-17 AU AU22280/92A patent/AU659857B2/en not_active Ceased
-
1999
- 1999-07-14 GR GR990401855T patent/GR3030770T3/el unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3340164A (en) * | 1963-12-26 | 1967-09-05 | Sperry Rand Corp | Method of copper plating anodized aluminum |
US4311551A (en) * | 1979-04-12 | 1982-01-19 | Philip A. Hunt Chemical Corp. | Composition and method for etching copper substrates |
Also Published As
Publication number | Publication date |
---|---|
GR3030770T3 (en) | 1999-11-30 |
KR100295144B1 (ko) | 2001-09-17 |
JP3143707B2 (ja) | 2001-03-07 |
EP0590046A1 (en) | 1994-04-06 |
DE69229115D1 (de) | 1999-06-10 |
EP0590046A4 (en) | 1995-07-05 |
KR940701463A (ko) | 1994-05-28 |
ATE179761T1 (de) | 1999-05-15 |
EP0590046B1 (en) | 1999-05-06 |
JPH06510568A (ja) | 1994-11-24 |
WO1993000456A1 (en) | 1993-01-07 |
DK0590046T3 (da) | 1999-11-01 |
ES2132124T3 (es) | 1999-08-16 |
AU2228092A (en) | 1993-01-25 |
DE69229115T2 (de) | 1999-10-14 |
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